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1. 发明授权

US08309689B2 High yield dialysis-free process for producing organosoluble regenerated silk fibroin 有权
标题翻译：用于生产有机溶剂的再生丝素蛋白的高产率透析工艺
公开(公告)号：US08309689B2
公开(公告)日：2012-11-13
申请号：US12783818
申请日：2010-05-20
申请人： Jen-Chang Yang , Sheng-Yang Lee , Chien Chung Chen , Yun-Ting Hsu , Hong-Da Wu , Dian-Yu Ji
发明人： Jen-Chang Yang , Sheng-Yang Lee , Chien Chung Chen , Yun-Ting Hsu , Hong-Da Wu , Dian-Yu Ji
IPC分类号： C07K1/30
CPC分类号： C07K14/43586
摘要： The invention relates to a simple and high yield process for producing a regenerated silk fibroin which does not need dialysis. Particularly, a process of the invention is characterized in that the silk fibroin is precipitated by applying a shear stress and/or changing the solvent power of the fibroin solution. The process of the invention simplifies the process of producing silk fibroin and greatly shortens the process time to 1 to 2 hours, whereas the conventional dialysis process is complex and needs around 2 to 3 days. In addition to reducing the time needed, the process of the invention can increase productivity of silk fibroin by at least 8%.
摘要翻译：本发明涉及用于生产不需要透析的再生丝素蛋白的简单且高产率的方法。特别地，本发明的方法的特征在于，通过施加剪切应力和/或改变丝心蛋白溶液的溶剂能力使丝素蛋白沉淀。本发明的方法简化了生产丝素蛋白的过程，大大缩短了1至2小时的处理时间，而常规透析过程复杂，需要2至3天左右。除了减少所需时间之外，本发明的方法可以将丝素蛋白的生产率提高至少8％。

2. 发明授权

US08263048B2 Calcium phosphate complex for oral care applications, its preparation method, and compositions containing the same 有权
标题翻译：用于口腔护理应用的磷酸钙复合物，其制备方法和含有它们的组合物
公开(公告)号：US08263048B2
公开(公告)日：2012-09-11
申请号：US12975052
申请日：2010-12-21
申请人： Jen-Chang Yang , Sheng-Yang Lee , Der-Zen Liu , Nai-Chia Teng , En-Sheng Ke , Chien Chung Chen , Dian-Yu Ji , Chen-Feng Ma , Hong-Da Wu
发明人： Jen-Chang Yang , Sheng-Yang Lee , Der-Zen Liu , Nai-Chia Teng , En-Sheng Ke , Chien Chung Chen , Dian-Yu Ji , Chen-Feng Ma , Hong-Da Wu
IPC分类号： A61K8/55 , A61Q11/00
CPC分类号： A61Q11/00 , A61K8/24 , A61K8/88 , A61K2800/58
摘要： The invention is directed to a calcium phosphate complex and the composition containing the same for oral care applications, in which the calcium phosphate complex is formed by chelating the γ-polyglutamic acid (γ-PGA) with amorphous calcium phosphate (ACP). This complex can prevent crystallization of ACP and maintain its high solubility. The calcium phosphate complex has superior mucoadhesion properties, allowing it to remain in the mouth longer and offering effective buffering, by which dental caries can be alleviated and prevented.
摘要翻译：本发明涉及一种磷酸钙复合物和含有该磷酸钙络合物的组合物，其中通过用无定形磷酸钙（ACP）螯合γ-聚谷氨酸（γ-PGA）形成磷酸钙复合物。该复合物可以防止ACP的结晶并保持其高溶解度。磷酸钙复合物具有优异的粘膜粘附性质，使其能够更长时间地保留在口腔中，并提供有效的缓冲，可以减轻和预防龋齿。

3. 发明授权

US07494250B2 Light emitting module and process thereof 失效
标题翻译：发光模块及其工艺
公开(公告)号：US07494250B2
公开(公告)日：2009-02-24
申请号：US11503216
申请日：2006-08-14
申请人： Chien Chung Chen
发明人： Chien Chung Chen
IPC分类号： F21V29/00
CPC分类号： H01L33/641 , F21K9/00 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10S362/80 , H01L2924/00014
摘要： A light emitting module includes a metal substrate, a bearing base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate and the bearing base is embedded into the first perforation of the metal substrate. According to an eutectic soldering method, the LED(s) is/are adhered on the bearing base by a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are adhered on the bearing base and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) with the printed circuit board.
摘要翻译：发光模块包括金属基板，轴承座，至少一个LED，印刷电路板和至少一根导线。在金属基板上形成第一穿孔，并且将轴承座嵌入金属基板的第一穿孔中。根据共晶焊接方法，通过复合金属将LED粘附在轴承座上。在印刷电路板上形成第二个穿孔，以露出在轴承座上粘附的LED，并进一步允许印刷电路板粘在金属基底上。导线用于将LED与印刷电路板电连接。

4. 发明申请

US20080129713A1 Method of Transmitting Data from Timing Controller to Source Driving Device in LCD 有权
标题翻译：从时序控制器向LCD驱动装置发送数据的方法
公开(公告)号：US20080129713A1
公开(公告)日：2008-06-05
申请号：US11566647
申请日：2006-12-04
申请人： Chien Chung Chen , Po Hsien Tsai
发明人： Chien Chung Chen , Po Hsien Tsai
IPC分类号： G09G5/00
CPC分类号： G09G3/3685 , G09G2330/06
摘要： A method of transmitting data from a timing controller to a source driving device in a liquid crystal display is disclosed. The method of the present invention comprises the steps of: (a) providing a setup/hold time; (b) transmitting a test pattern from the timing controller to the source driving device using the setup/hold time; (c) returning an acknowledge signal from the source driving device to the timing controller when the test pattern is successfully received by the source driving device; (d) providing a new setup/hold time and repeating Steps (b) and (c) using the new setup/hold time when the test pattern is not successfully received by the source driving device; and (e) transmitting the image data from the timing controller to the source driving device using the new setup/hold time upon receipt of the acknowledge signal. Therefore, the use of the setup/hold time adjustment pins is eliminated.
摘要翻译：公开了一种从时序控制器向液晶显示器中的源驱动装置发送数据的方法。本发明的方法包括以下步骤：（a）提供建立/保持时间; （b）使用建立/保持时间将测试图案从定时控制器发送到源驱动装置; （c）当源驱动装置成功地接收到测试图案时，将来自源驱动装置的确认信号返回到定时控制器; （d）提供新的建立/保持时间，并且当源驱动装置未成功接收到测试图案时，使用新的建立/保持时间重复步骤（b）和（c）以及（e）在接收到确认信号时，使用新的建立/保持时间将图像数据从定时控制器发送到源驱动装置。因此，消除了建立/保持时间调节引脚的使用。

5. 发明申请

US20070170563A1 Light emitting module and process thereof 失效
标题翻译：发光模块及其工艺
公开(公告)号：US20070170563A1
公开(公告)日：2007-07-26
申请号：US11503216
申请日：2006-08-14
申请人： Chien Chung Chen
发明人： Chien Chung Chen
IPC分类号： H01L23/02
CPC分类号： H01L33/641 , F21K9/00 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10S362/80 , H01L2924/00014
摘要： A light emitting module includes a metal substrate, a bearing base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate and the bearing base is embedded into the first perforation of the metal substrate. According to an eutectic soldering method, the LED(s) is/are adhered on the bearing base by a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are adhered on the bearing base and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) with the printed circuit board.
摘要翻译：发光模块包括金属基板，轴承座，至少一个LED，印刷电路板和至少一根导线。在金属基板上形成第一穿孔，并且将轴承座嵌入金属基板的第一穿孔中。根据共晶焊接方法，通过复合金属将LED粘附在轴承座上。在印刷电路板上形成第二个穿孔，以露出在轴承座上粘附的LED，并进一步允许印刷电路板粘在金属基底上。导线用于将LED与印刷电路板电连接。

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