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1. 发明申请

US20120309128A1 DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS 有权
标题翻译：使用通过三维互连和关联系统和方法禁用电气连接
公开(公告)号：US20120309128A1
公开(公告)日：2012-12-06
申请号：US13572461
申请日：2012-08-10
申请人： Jeffery W. Janzen , Russell D. Slifer , Michael Chaine , Kyle K. Kirby , William M. Hiatt
发明人： Jeffery W. Janzen , Russell D. Slifer , Michael Chaine , Kyle K. Kirby , William M. Hiatt
IPC分类号： H01L21/50 , H01L21/768
CPC分类号： H01L23/481 , H01L21/50 , H01L21/76898 , H01L21/82 , H01L23/52 , H01L23/525 , H01L23/60 , H01L23/62 , H01L24/17 , H01L25/0657 , H01L25/50 , H01L27/0248 , H01L2224/02372 , H01L2224/0401 , H01L2224/13009 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/17051 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06593 , H01L2924/13034 , H01L2924/00014
摘要： Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.
摘要翻译：本文公开了直通3D互连和微电子管芯以及包括这种互连以禁用电连接的堆叠管芯的系统。在一个实施例中，堆叠管芯的系统包括具有背面的第一微电子管芯，经由第一管芯延伸到背面的互连件，电耦合到互连的集成电路，以及与第一静电放电（ESD）器件电隔离的第一静电放电互连。第二微电子管芯具有耦合到第一管芯的背侧的前侧，电连接到互连的前侧的金属接触件和电耦合到金属接触件的第二ESD器件。在另一实施例中，第一管芯还包括承载集成电路和第一ESD器件的衬底，并且互连件位于衬底中，以禁止第一ESD器件和互连件之间的电连接。

2. 发明申请

US20090283898A1 DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS 有权
标题翻译：使用通过三维互连和关联系统和方法禁用电气连接
公开(公告)号：US20090283898A1
公开(公告)日：2009-11-19
申请号：US12121654
申请日：2008-05-15
申请人： Jeffery W. Janzen , Michael Chaine , Kyle K. Kirby , William M. Hiatt , Russell D. Slifer
发明人： Jeffery W. Janzen , Michael Chaine , Kyle K. Kirby , William M. Hiatt , Russell D. Slifer
IPC分类号： H01L23/52 , H01L23/538 , H01L21/50 , H01L21/768
CPC分类号： H01L23/481 , H01L21/50 , H01L21/76898 , H01L21/82 , H01L23/52 , H01L23/525 , H01L23/60 , H01L23/62 , H01L24/17 , H01L25/0657 , H01L25/50 , H01L27/0248 , H01L2224/02372 , H01L2224/0401 , H01L2224/13009 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/17051 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06593 , H01L2924/13034 , H01L2924/00014
摘要： Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.
摘要翻译：本文公开了直通3D互连和微电子管芯以及包括这种互连以禁用电连接的堆叠管芯的系统。在一个实施例中，堆叠管芯的系统包括具有背面的第一微电子管芯，经由第一管芯延伸到背面的互连件，电耦合到互连的集成电路，以及与第一静电放电（ESD）器件电隔离的第一静电放电互连。第二微电子管芯具有耦合到第一管芯的背侧的前侧，电连接到互连的前侧的金属接触件和电耦合到金属接触件的第二ESD器件。在另一实施例中，第一管芯还包括承载集成电路和第一ESD器件的衬底，并且互连件位于衬底中，以禁止第一ESD器件和互连件之间的电连接。

3. 再颁专利

USRE39818E1 Personalized wireless video game system 有权
标题翻译：个性化无线视频游戏系统
公开(公告)号：USRE39818E1
公开(公告)日：2007-09-04
申请号：US10763073
申请日：2004-01-22
申请人： Russell D. Slifer
发明人： Russell D. Slifer
IPC分类号： A63F13/02 , A63F13/10
CPC分类号： A63F13/235 , A63F13/06 , A63F13/79 , A63F2300/1025 , A63F2300/208
摘要： A video game system is described which includes a wireless game controller which stores information about the user of the controller. The controller includes a memory for storing the information. The information is communicated through wireless transmissions to a processor which can operate a video game. The personalized information can include, for example, the user's name, skill level, preferred characters, handicaps, limitations, and/or historical game scores. The game controllers can include a wireless receiver for receiving communications from the processor to update information stored in the controller. Several different communication operations and protocols are described, including storing a user identification code in the controller with corresponding detailed information stored in the processor, or storing detailed information in the hand held controller and down loading the information to the processor.
摘要翻译：描述了一种视频游戏系统，其包括存储关于控制器的用户的信息的无线游戏控制器。控制器包括用于存储信息的存储器。该信息通过无线传输传送到可操作视频游戏的处理器。个性化信息可以包括例如用户的姓名，技能水平，优选角色，障碍，限制和/或历史游戏得分。游戏控制器可以包括用于从处理器接收通信以更新存储在控制器中的信息的无线接收器。描述了几种不同的通信操作和协议，包括将控制器中的用户识别码存储在处理器中存储的对应的详细信息，或者将详细信息存储在手持控制器中并将信息下载到处理器。

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