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    • 2. 发明申请
    • THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME
    • 薄膜晶体管阵列及其制造方法
    • US20080138942A1
    • 2008-06-12
    • US12031121
    • 2008-02-14
    • Je-Hun LEEYang-Ho BAEBeom-Seok CHOChang-Oh JEONG
    • Je-Hun LEEYang-Ho BAEBeom-Seok CHOChang-Oh JEONG
    • H01L21/336
    • H01L27/3279H01L27/124H01L27/1288H01L51/0023H01L51/56
    • The invention provides a thin film transistor (TFT) array panel that includes an insulating substrate; a gate line formed on the insulating substrate and having a first layer of an Al containing metal, a second layer of a Cu containing metal that is thicker than the first layer, and a gate electrode; a gate insulating layer arranged on the gate line; a semiconductor arranged on the gate insulating layer; a data line having a source electrode and arranged on the gate insulating layer and the semiconductor; a drain electrode arranged on the gate insulating layer and the semiconductor and facing the source electrode; a passivation layer having a contact hole and arranged on the data line and the drain electrode; and a pixel electrode arranged on the passivation layer and coupled with the drain electrode through the contact hole.
    • 本发明提供一种薄膜晶体管(TFT)阵列面板,其包括绝缘基板; 形成在所述绝缘基板上并具有含有Al的金属的第一层,比所述第一层更厚的含Cu金属的第二层的栅极线和栅电极; 栅极绝缘层,布置在栅极线上; 布置在栅绝缘层上的半导体; 数据线,其具有源电极并且布置在所述栅极绝缘层和所述半导体上; 布置在所述栅绝缘层和所述半导体上并面对所述源电极的漏电极; 钝化层,其具有接触孔并且布置在所述数据线和所述漏电极上; 以及设置在钝化层上并通过接触孔与漏电极耦合的像素电极。
    • 4. 发明申请
    • TFT SUBSTRATE FOR LIQUID CRYSTAL DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
    • 用于液晶显示装置的TFT基板及其制造方法
    • US20080044963A1
    • 2008-02-21
    • US11923822
    • 2007-10-25
    • Beom-Seok CHOChang-Oh JEONG
    • Beom-Seok CHOChang-Oh JEONG
    • H01L21/84
    • H01L29/4908C22C9/00G02F1/133345G02F1/136286H01L27/12H01L27/124H01L27/1288H01L29/66765
    • There are provided a TFT substrate for an LCD apparatus and a method of manufacturing the same. A substrate (10), a diffusion barrier layer (11) and a copper alloy layer (12) are formed on the TET substrate, consecutively. The copper alloy includes a material from about 0.5 at % to about 15 at % to form a gate wiring layer. The material is used to form the diffusion barrier layer (11). A compound that comprises a material such as Zr, Ti, Hf, V, Ta, Ni, Cr, Nb, Co, Mn, Mo, W, Rh, Pd, Pt, etc. is deposited on the diffusion barrier layer (11) to a thickness from about 50 Å to about 5,000 Å. The deposited compound is then heat treated to convert the deposited compound into a silicide compound (11b). The transistor substrate has low resistance and high conductance. Also, etching process is simplified, and a mutual diffusion is prevented by means of the thin diffusion barrier layer.
    • 提供了一种用于LCD装置的TFT基板及其制造方法。 在TET基板上连续形成基板(10),扩散阻挡层(11)和铜合金层(12)。 铜合金包括约0.5at%至约15at%的材料以形成栅极布线层。 该材料用于形成扩散阻挡层(11)。 包含诸如Zr,Ti,Hf,V,Ta,Ni,Cr,Nb,Co,Mn,Mo,W,Rh,Pd,Pt等材料的化合物沉积在扩散阻挡层(11)上, 至约50至约5000的厚度。 然后将沉积的化合物进行热处理以将沉积的化合物转化为硅化物(11b)。 晶体管衬底具有低电阻和高电导率。 此外,简化了蚀刻工艺,并且通过薄的扩散阻挡层来防止相互扩散。