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    • 8. 发明授权
    • Field emission array having carbon microstructure and method of manufacturing the same
    • 具有碳微观结构的场发射阵列及其制造方法
    • US08017413B2
    • 2011-09-13
    • US12450965
    • 2008-07-01
    • Seung Seob LeeSeok Woo LeeJung A Lee
    • Seung Seob LeeSeok Woo LeeJung A Lee
    • H01L21/00
    • H01J1/3044H01J3/022H01J9/025H01J31/127H01J63/02H01J2201/30415H01J2201/30453H01J2203/0228H01J2329/0418H01J2329/0444H01J2329/4626
    • Provided is a method for manufacturing a field emission array with a carbon microstructure. The method includes: a photomask attachment step of attaching a photomask with a pattern groove to one surface of a transparent substrate; a photoresist attachment step of attaching a negative photoresist to one surface of the photomask; an exposure step of irradiating light toward the opposite surface of the transparent substrate from the photomask to cure a portion of the negative photoresist with the light irradiated on the negative photoresist through the pattern groove; a developing step of removing an uncured portion of the negative photoresist while leaving the cured portion of the negative photoresist as a microstructure; a pyrolysis step of heating and carbonizing the microstructure thus obtained; and a cathode attachment step of attaching a voltage-supplying cathode to the surface of the transparent substrate on which the microstructure is formed.
    • 提供一种制造具有碳微观结构的场致发射阵列的方法。 该方法包括:光掩模附着步骤,其将具有图案凹槽的光掩模附着到透明基板的一个表面; 将负性光致抗蚀剂附着到光掩模的一个表面的光致抗蚀剂附着步骤; 曝光步骤,从所述光掩模向所述透明基板的相对表面照射光,以通过所述图案凹槽照射在所述负性光致抗蚀剂上的光来固化所述负性光致抗蚀剂的一部分; 去除负性光致抗蚀剂的未固化部分同时留下负性光致抗蚀剂的固化部分作为微结构的显影步骤; 对由此获得的微结构进行加热和碳化的热解步骤; 以及将电压供给阴极安装在其上形成微结构的透明基板的表面上的阴极附着步骤。