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1. 发明授权

US06482072B1 Method and apparatus for providing and controlling delivery of a web of polishing material 失效
标题翻译：用于提供和控制抛光材料网的传送的方法和装置
公开(公告)号：US06482072B1
公开(公告)日：2002-11-19
申请号：US09698396
申请日：2000-10-26
申请人： Jayakumar Gurusamy , Gee Sun Hoey , Lawrence M. Rosenberg
发明人： Jayakumar Gurusamy , Gee Sun Hoey , Lawrence M. Rosenberg
IPC分类号： B24B100
CPC分类号： B24B37/12 , B24B21/20
摘要： Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.
摘要翻译：通常，用于支撑抛光材料的网的方法和装置。在一个实施例中，该装置包括适于支撑腹板，框架组件和联接在压板和框架组件之间的一个或多个挠曲件的压板。弯曲部件允许框架组件相对于压板移动。当框架组件相对于压板处于延伸位置时，腹板被放置成与压板间隔开的关系。

2. 发明授权

US06951511B2 Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system 失效
标题翻译：压板具有外围框架，用于在化学机械平面化系统中支撑抛光材料的网状物
公开(公告)号：US06951511B2
公开(公告)日：2005-10-04
申请号：US10273934
申请日：2002-10-17
申请人： Jayakumar Gurusamy , Gee Sun Hoey , Lawrence M. Rosenberg
发明人： Jayakumar Gurusamy , Gee Sun Hoey , Lawrence M. Rosenberg
IPC分类号： B24B21/20 , B24B37/12 , B24B1/00
CPC分类号： B24B37/12 , B24B21/20
摘要： Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.
摘要翻译：通常，用于支撑抛光材料的网的方法和装置。在一个实施例中，该装置包括适于支撑腹板，框架组件和联接在压板和框架组件之间的一个或多个挠曲件的压板。弯曲部件允许框架组件相对于压板移动。当框架组件相对于压板处于延伸位置时，腹板被放置成与压板间隔开的关系。

3. 发明授权

US06200199B1 Chemical mechanical polishing conditioner 失效
标题翻译：化学机械抛光调理剂
公开(公告)号：US06200199B1
公开(公告)日：2001-03-13
申请号：US09052798
申请日：1998-03-31
申请人： Jayakumar Gurusamy , Lawrence M. Rosenberg
发明人： Jayakumar Gurusamy , Lawrence M. Rosenberg
IPC分类号： B24B722
CPC分类号： B24B53/017 , B24B53/02 , B24B53/12
摘要： A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.
摘要翻译：用于调节抛光垫的抛光表面的调节头。调节头包括用于围绕纵向轴线旋转的驱动元件和盘背衬元件。盘背衬元件携带研磨盘并且保持盘的下表面与抛光垫接合。调节头还包括一个驱动元件，该驱动元件将盘背衬元件连接到驱动元件以在其间传递扭矩和旋转。从动元件可在缩回位置和伸出位置之间纵向移动。环形隔膜跨越驱动元件和被驱动元件之间的间隙，并且联接到驱动元件并且被驱动元件作为一个单元旋转。

4. 发明授权

US06361423B1 Chemical mechanical polishing conditioner 有权
公开(公告)号：US06361423B1
公开(公告)日：2002-03-26
申请号：US09746710
申请日：2000-12-22
申请人： Jayakumar Gurusamy , Lawrence M. Rosenberg
发明人： Jayakumar Gurusamy , Lawrence M. Rosenberg
IPC分类号： B24B2118
摘要： A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

5. 发明授权

US06299511B1 Chemical mechanical polishing conditioner 有权
标题翻译：化学机械抛光调理剂
公开(公告)号：US06299511B1
公开(公告)日：2001-10-09
申请号：US09489291
申请日：2000-01-21
申请人： Jayakumar Gurusamy , Lawrence M. Rosenberg , Alexander Medvinsky
发明人： Jayakumar Gurusamy , Lawrence M. Rosenberg , Alexander Medvinsky
IPC分类号： B24B5303
CPC分类号： B24B53/017 , B24B41/04
摘要： A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.
摘要翻译：调节头使用流体吹扫系统来防止碎片进入调节器头部的开口并导致调节器头部中的轴承和其它运动部件的劣化。流体可以是气体，例如氮气，或液体，如水或反应性溶剂。

6. 发明授权

US6033290A Chemical mechanical polishing conditioner 失效
标题翻译：化学机械抛光调理剂
公开(公告)号：US6033290A
公开(公告)日：2000-03-07
申请号：US162916
申请日：1998-09-29
申请人： Jayakumar Gurusamy , Lawrence M. Rosenberg , Alexander Medvinsky
发明人： Jayakumar Gurusamy , Lawrence M. Rosenberg , Alexander Medvinsky
IPC分类号： B24B41/04 , B24B53/007 , B24B53/017 , H01L21/304 , B24B53/00
CPC分类号： B24B53/017 , B24B41/04
摘要： A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.
摘要翻译：调节头使用流体吹扫系统来防止碎片进入调节器头部的开口并导致调节器头部中的轴承和其它运动部件的劣化。流体可以是气体，例如氮气，或液体，如水或反应性溶剂。

7. 发明授权

US06251215B1 Carrier head with a multilayer retaining ring for chemical mechanical polishing 失效
标题翻译：带有多层固定环的载体头用于化学机械抛光
公开(公告)号：US06251215B1
公开(公告)日：2001-06-26
申请号：US09090679
申请日：1998-06-03
申请人： Steven M. Zuniga , Thomas H. Osterheld , Lawrence M. Rosenberg
发明人： Steven M. Zuniga , Thomas H. Osterheld , Lawrence M. Rosenberg
IPC分类号： B24B500
CPC分类号： B24B41/06 , B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
摘要翻译：用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。

8. 发明授权

US07303467B2 Chemical mechanical polishing apparatus with rotating belt 有权
标题翻译：化学机械抛光装置带旋转带
公开(公告)号：US07303467B2
公开(公告)日：2007-12-04
申请号：US11531272
申请日：2006-09-12
申请人： Manoocher Birang , Lawrence M. Rosenberg , Sasson Somekh , John M. White
发明人： Manoocher Birang , Lawrence M. Rosenberg , Sasson Somekh , John M. White
IPC分类号： B24B21/00
CPC分类号： B24B21/004 , B24B21/008 , B24B21/04 , B24B27/0023 , B24B37/04 , B24B37/16 , B24B37/24 , B24B37/245 , B24B53/017 , B24D7/12 , H01L21/30625
摘要： A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.
摘要翻译：化学机械抛光装置具有可移动的压板，驱动机构和夹紧机构。所述驱动机构附接到所述压板，所述驱动机构被配置为支撑大致线性的抛光片，所述抛光片的一部分延伸在所述压板上，并且被配置为相对于所述压板沿线性方向递增地推进所述抛光片。夹持机构构造成将抛光片的部分间歇地固定到压板上。

9. 发明授权

US4525852A Alignment apparatus 失效
标题翻译：校准装置
公开(公告)号：US4525852A
公开(公告)日：1985-06-25
申请号：US475420
申请日：1983-03-15
申请人： Lawrence M. Rosenberg
发明人： Lawrence M. Rosenberg
IPC分类号： G03F7/22 , B23Q1/36 , G03F7/20 , G03F9/00 , H01L21/027 , G05G11/00 , A47B11/00 , G21K5/00
CPC分类号： G03F7/70691 , B23Q1/36 , G03F9/7023 , G03F9/7049 , Y10T74/20207
摘要： Alignment apparatus particularly for a semiconductor wafer (140) includes a horizontal support plate (134), a horizontal rotatable theta plate (106) below the support plate and a horizontal x-y motion plate below the rotatable plate. Three piezoelectric linear drive motors (128-130) are mounted depending from the rotatable plate and having linear shafts (128a, etc.) extending thereabove to support the support plate, drive the support in the z-axis and then differentially operated to tilt the support plate. A pair of linear piezoelectric motors (110,115) drive the motion plate in x- and y-directions. A theta drive linear piezoelectric motor (137) functions to rotate the theta plate (106). Flexure connections (113, 117, 119, 121, 138, 144) are provided between the various motors and plates. Mask registration means (124, 125) extends upwardly past the edges of the plates to initially gap the wafer-to-mask distance. The mask (150) is held in a separate aligner (153) above the wafer (14) mounted on the support plate. The assembly of six piezoelectric motors and flexural linkages provides for movement of a wafer in six degrees of freedom.
摘要翻译：特别是用于半导体晶片（140）的对准装置包括水平支撑板（134），支撑板下方的水平可旋转的θ板（106）和可旋转板下方的水平x-y运动板。三个压电线性驱动电机（128-130）从可旋转板安装，并具有在其上延伸的线性轴（128a等）以支撑支撑板，驱动支撑在z轴上，然后差速操作以使支撑板一对线性压电电动机（110,115）在x和y方向上驱动运动板。 θ驱动线性压电电动机（137）用于使θ板（106）旋转。挠性连接件（113,117,119,121,138,144）设置在各种电机和板之间。掩模配准装置（124,125）向上延伸穿过板的边缘，以最初间隔晶片与掩模的距离。掩模（150）保持在安装在支撑板上的晶片（14）上方的分离的对准器（153）中。六个压电电机和弯曲连接件的组件提供六个自由度的晶片的移动。

10. 发明授权

US06413873B1 System for chemical mechanical planarization 失效
标题翻译：化学机械平面化系统
公开(公告)号：US06413873B1
公开(公告)日：2002-07-02
申请号：US09563550
申请日：2000-05-03
申请人： Shijian Li , John M. White , Lawrence M. Rosenberg , Martin Scales , Ramin Emami , James V. Tietz , Manoocher Birang
发明人： Shijian Li , John M. White , Lawrence M. Rosenberg , Martin Scales , Ramin Emami , James V. Tietz , Manoocher Birang
IPC分类号： H01L21302
CPC分类号： B24B37/16 , B24B1/04 , B24B21/04 , B24B21/18 , B24B37/12 , B24B37/20 , B24B49/14 , B24B55/02 , B24B57/02 , H01L21/30625
摘要： A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.
摘要翻译：一种用于抛光基板的半导体基板处理系统，其通常包括压板和布置在其上的抛光材料的卷材。该系统的实施例包括用于容纳抛光材料幅材的一次性盒，设置在纸幅附近的防护件，用于防止纸幅未使用部分的污染，用于将纸幅从压板固定和释放的流体输送装置，用于控制幅材的横向移动，以及用于为每个高度的辊提供更多线性的抛光材料的装置。

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