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    • 7. 发明授权
    • Modular component computer system
    • 模块化组件计算机系统
    • US5363275A
    • 1994-11-08
    • US15989
    • 1993-02-10
    • Jerome A. FrankenyRichard F. FrankenyKarl HermannRonald L. Imken
    • Jerome A. FrankenyRichard F. FrankenyKarl HermannRonald L. Imken
    • G06F1/18H01L23/538H05K1/11H05K1/18H05K3/00H05K3/36H05K1/00
    • H05K1/189H01L23/5385H01L23/5387H01L2224/16225H01L2924/15311H05K1/118H05K2201/041H05K2201/053H05K2201/2009H05K3/0058H05K3/361H05K3/4691
    • Discrete computational elements are provided that will be connected to a base unit, and to one another or I/O devices, in order to configure a particular computer system. The base unit provides the electrical power required to energize the computational elements. A plurality of identically configured substrates are joined in a layered relation and are electrically connected with one another. These substrates are capable of being fabricated of different lengths such that they can extend outwardly from the computational element and may be connected to other computational elements. At least one integrated circuit will be placed on one side of the joined substrates and is electrically connected to each substrate layer. In this manner the ICs will be able to communicate with chips on other computational elements. A support member is also included that stiffens the plural substrate layers and independently distributes electrical power through voltage and ground potential planes, and interconnected substrate layers, to the chips. The support member will be disposed adjacent the substrate layers on a side opposite the ICs and independently attachable to the base unit by using electrical connection pins, a pluggable lip portion, or the like.
    • 提供将连接到基本单元和彼此或I / O设备的离散计算元件,以便配置特定的计算机系统。 基本单元提供激励计算元件所需的电力。 多个相同配置的基板以分层关系连接并且彼此电连接。 这些基板能够被制造成不同的长度,使得它们可以从计算元件向外延伸并且可以连接到其它计算元件。 至少一个集成电路将被放置在接合的衬底的一侧上,并且电连接到每个衬底层。 以这种方式,IC将能够与其他计算元件上的芯片通信。 还包括支撑构件,其硬化多个衬底层,并且通过电压和接地电位平面以及互连的衬底层独立地分配电力到芯片。 支撑构件将被布置在与IC相对的一侧上的基底层附近,并且通过使用电连接销,可插入唇部等可独立地附接到基座单元。