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    • 5. 发明申请
    • SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
    • 半导体器件及其形成方法
    • US20160225714A1
    • 2016-08-04
    • US14974567
    • 2015-12-18
    • Jang-Gn YUNSunghoi HURJaesun YUNJoon-Sung LIM
    • Jang-Gn YUNSunghoi HURJaesun YUNJoon-Sung LIM
    • H01L23/528H01L27/115H01L23/522
    • H01L27/11582H01L27/11573H01L27/11575
    • A semiconductor device may include a cell gate conductive pattern in a cell array area that extends to a step area, a cell vertical structure in the cell array area that extends through the cell gate conductive pattern, a cell gate contact structure on the cell gate conductive pattern in the step area, a cell gate contact region in the cell gate conductive pattern and aligned with the cell gate contact structure, a first peripheral contact structure spaced apart from the cell gate conductive pattern, a second peripheral contact structure spaced apart from the first peripheral contact structure, a first peripheral contact region under the first peripheral contact structure, and a second peripheral contact region under the second peripheral contact structure. The cell gate contact region may include a first element and a remainder of the cell gate conductive pattern may not substantially include the first element.
    • 半导体器件可以包括延伸到台阶区域的单元阵列区域中的单元栅极导电图案,延伸穿过单元栅极导电图案的单元阵列区域中的单元垂直结构,单元栅极导电上的单元栅极接触结构 在步进区域中的图案,单元栅极导电图案中的单元栅极接触区域并与单元栅极接触结构对准,与单元栅极导电图案间隔开的第一外围接触结构,与第一外部接触结构间隔开的第二外部接触结构 周边接触结构,第一周边接触结构下面的第一周边接触区域和第二周边接触结构下面的第二周边接触区域。 单元栅极接触区域可以包括第一元件,并且单元栅极导电图案的其余部分可以基本上不包括第一元件。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICES
    • 半导体器件
    • US20160163732A1
    • 2016-06-09
    • US14962263
    • 2015-12-08
    • Joon-Sung LIMJang-Gn YUNJaesun YUN
    • Joon-Sung LIMJang-Gn YUNJaesun YUN
    • H01L27/115H01L23/522H01L23/528
    • H01L27/11582H01L23/5226H01L23/528H01L27/11573H01L2924/0002H01L2924/00
    • Semiconductor devices and methods of manufacturing the semiconductor devices are provided. The semiconductor devices may include a semiconductor pattern including an opening on a semiconductor substrate. A peripheral transistor and a peripheral interconnection structure may be disposed between the semiconductor substrate and the semiconductor pattern. The peripheral interconnection structure may be electrically connected to the peripheral transistor. Cell gate conductive patterns may be disposed on the semiconductor pattern. The cell vertical structures may extend through the cell gate conductive patterns and may be connected to the semiconductor pattern. Cell bit line contact plugs may be disposed on the cell vertical structures. A bit line may be disposed on the cell bit line contact plugs. A peripheral bit line contact structure may be disposed between the bit line and the peripheral interconnection structure. The peripheral bit line contact structure may extend through the opening of the semiconductor.
    • 提供了制造半导体器件的半导体器件和方法。 半导体器件可以包括在半导体衬底上包括开口的半导体图案。 外围晶体管和外围互连结构可以设置在半导体衬底和半导体图案之间。 外围互连结构可以电连接到外围晶体管。 单元栅极导电图案可以设置在半导体图案上。 单元垂直结构可以延伸穿过单元栅极导电图案并且可以连接到半导体图案。 单元位线接触插头可以设置在单元垂直结构上。 位线可以设置在单元位线接触插头上。 外围位线接触结构可以设置在位线和外围互连结构之间。 外围位线接触结构可延伸穿过半导体的开口。
    • 8. 发明申请
    • GATE STRUCTURE IN NON-VOLATILE MEMORY DEVICE
    • 非易失性存储器件中的门结构
    • US20130270624A1
    • 2013-10-17
    • US13759195
    • 2013-02-05
    • Jang-Gn YUNJung-Dal CHOIKwang-Soo SEOL
    • Jang-Gn YUNJung-Dal CHOIKwang-Soo SEOL
    • H01L29/792
    • H01L29/7926H01L21/28282H01L27/1157H01L27/11582H01L29/66833H01L29/792
    • A gate structure of a non-volatile memory device and a method of forming the same including a tunnel oxide layer pattern, a charge trap layer pattern, a blocking dielectric layer pattern having the uppermost layer including a material having a first dielectric constant greater than that of a material included in the tunnel oxide layer pattern, and first and second conductive layer patterns. The gate structure includes a first spacer to cover at least the sidewall of the second conductive layer pattern. The gate structure includes a second spacer covering the sidewall of the first spacer and the sidewall of the first conductive layer pattern and including a material having a second dielectric constant equal to or greater than the first dielectric constant. In the non-volatile memory device including the gate structure, erase saturation caused by back tunneling is reduced.
    • 非易失性存储器件的栅极结构及其形成方法,其包括隧道氧化物层图案,电荷陷阱层图案,阻挡介电层图案,其最上层包括第一介电常数大于其的介电常数的材料。 包括在隧道氧化物层图案中的材料,以及第一和第二导电层图案。 栅极结构包括至少覆盖第二导电层图案的侧壁的第一间隔物。 栅极结构包括覆盖第一间隔物的侧壁和第一导电层图案的侧壁的第二间隔物,并且包括具有等于或大于第一介电常数的第二介电常数的材料。 在包括栅极结构的非易失性存储器件中,由于后部隧道引起的擦除饱和度降低。