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    • 4. 发明申请
    • SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
    • 半导体波导和半导体波形制造方法
    • US20110006399A1
    • 2011-01-13
    • US12810989
    • 2008-12-26
    • Tomoyuki TakadaSadanori YamanakaMasahiko HataTaketsugu YamamotoKazumi Wada
    • Tomoyuki TakadaSadanori YamanakaMasahiko HataTaketsugu YamamotoKazumi Wada
    • H01L29/12H01L21/20
    • H01L21/02516H01L21/02381H01L21/02433H01L21/0245H01L21/02546H01L21/0262H01L21/02639H01L29/267H01L29/7371
    • A high-quality GaAs-type crystal thin film using an inexpensive Si wafer with good thermal release characteristics is achieved. Provided is a semiconductor wafer comprising a single-crystal Si wafer; an insulating layer that has an open region and that is formed on the wafer; a Ge layer that is epitaxially grown on the wafer in the open region; and a GaAs layer that is epitaxially grown on the Ge layer, wherein the Ge layer is formed by (i) placing the wafer in a CVD reaction chamber that can create an ultra-high vacuum low-pressure state, (ii) performing a first epitaxial growth at a first temperature at which raw material gas can thermally decompose, (iii) performing a second epitaxial growth at a second temperature that is higher than the first temperature, (iv) performing a first annealing, at a third temperature that is loss than a melting point of Ge, on epitaxial layers formed by the first and second epitaxial growths, and (v) performing a second annealing at a fourth temperature that is lower than the third temperature. The Ge layer may he formed by repeating the first annealing and the second annealing a plurality of times, and the insulating layer may be a silicon oxide layer.
    • 实现了具有良好热释放特性的廉价Si晶片的高质量GaAs型晶体薄膜。 提供了包括单晶Si晶片的半导体晶片; 绝缘层,其具有开放区域并形成在所述晶片上; 在开放区域中在晶片上外延生长的Ge层; 以及在所述Ge层上外延生长的GaAs层,其中,所述Ge层通过以下方式形成:(i)将所述晶片放置在可产生超高真空低压状态的CVD反应室中,(ii) 在原料气体可以热分解的第一温度下外延生长,(iii)在高于第一温度的第二温度下进行第二外延生长,(iv)在损失的第三温度下进行第一退火 比在第一和第二外延生长形成的外延层上的熔点高的Ge,和(v)在低于第三温度的第四温度下进行第二次退火。 可以通过重复第一退火和第二退火多次形成Ge层,并且绝缘层可以是氧化硅层。
    • 9. 发明授权
    • Deposit metal welding method
    • 沉积金属焊接方法
    • US06805276B2
    • 2004-10-19
    • US10143558
    • 2002-05-10
    • Kazumi Wada
    • Kazumi Wada
    • B23K3102
    • E01B29/42B23K23/00Y10T428/12493
    • To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld. A method for welding a deposit metal to a base material with reduced residual stress, comprising a step of welding a deposit metal to a base material; and a step of plastically deforming into a recess, an area on the surface of the base material around a peripheral portion of the deposit metal. The invention is also directed to a welded block joint between a wire and a base material, characterized by comprising a deposit metal receiving an end portion of the wire and welded to the base material, wherein an area which is plastically deformed into a recess is formed on the base material surface at a peripheral portion of the deposit metal.
    • 通过减轻焊接的残余应力来防止基材的疲劳强度降低。 一种用于将沉积金属焊接到具有降低的残余应力的基底材料的方法,包括将沉积金属焊接到基底材料的步骤; 以及将金属表面周围的基材表面的区域塑性变形为凹陷的步骤。 本发明还涉及一种电线和基材之间的焊接块接头,其特征在于,包括一个沉积金属,其接收该电线的端部并焊接到该基底材料上,其中形成塑性变形成凹槽的区域 在沉积金属的周边部分的基材表面上。