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1. 发明申请

US20070272666A1 Infrared laser wafer scribing using short pulses 审中-公开
标题翻译：使用短脉冲的红外激光晶圆划片
公开(公告)号：US20070272666A1
公开(公告)日：2007-11-29
申请号：US11441454
申请日：2006-05-25
申请人： James N. O'Brien , Peter Pirogovsky
发明人： James N. O'Brien , Peter Pirogovsky
IPC分类号： B23K26/38 , B23K26/40
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： Systems and methods are provided for scribing wafers to efficiently ablate passivation and/or encapsulation layers while reducing or eliminating chipping and cracking in the passivation and/or encapsulation layers. Short laser pulses are used to provide high peak powers and reduce the ablation threshold. In one embodiment, the scribing is performed by a q-switched CO2 laser.
摘要翻译：提供了用于划片晶片的系统和方法，以有效地消融钝化和/或封装层，同时减少或消除钝化和/或封装层中的切屑和破裂。使用短激光脉冲提供高峰值功率并降低消融阈值。在一个实施例中，划线由q切换CO 2激光器执行。

2. 发明授权

US08642918B2 Adaptive optic beamshaping in laser processing systems 失效
标题翻译：激光加工系统中的自适应光束成形
公开(公告)号：US08642918B2
公开(公告)日：2014-02-04
申请号：US13494839
申请日：2012-06-12
申请人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
发明人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
IPC分类号： B23K26/06 , B23K26/073
CPC分类号： B23K26/0676 , B23K26/0613 , B23K26/066 , B23K26/705
摘要： A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.
摘要翻译：激光处理系统快速且灵活地修改处理光束，以确定并实现特定应用（或应用的子集）的改进或最佳光束简档。该系统降低了光束成形子系统对激光加工系统变化的敏感性，包括由制造公差，热漂移，部件性能变化以及其他系统变化来源引起的偏差。某些实施例还操纵较低质量的激光束（较高的M2值）以提供可接受的成形梁轮廓。

3. 发明授权

US08609512B2 Method for laser singulation of chip scale packages on glass substrates 失效
标题翻译：在玻璃基板上激光切割芯片级封装的方法
公开(公告)号：US08609512B2
公开(公告)日：2013-12-17
申请号：US12413068
申请日：2009-03-27
申请人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
发明人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
IPC分类号： H01L21/00
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50
摘要： An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
摘要翻译：提出了一种改进的复合电子设备分离方法。复合电子装置通过将两个或多个基板组合成包含多个装置的组件来制造。提出了使用激光加工对复合电子器件进行单片化的方法。所提出的方法提供了更少的缺陷，例如基板的破裂或碎裂，同时最小化切口的宽度并维持系统的生产量。

4. 发明申请

US20050036175A1 Optical proximity correction in raster scan printing based on grayscale manipulation of the bitmap 有权
标题翻译：基于灰度处理位图的光栅扫描打印中的光学邻近校正
公开(公告)号：US20050036175A1
公开(公告)日：2005-02-17
申请号：US10870597
申请日：2004-06-16
申请人： Asher Klatchko , Peter Pirogovsky
发明人： Asher Klatchko , Peter Pirogovsky
IPC分类号： G06T5/00 , H04N1/409 , G06K15/00 , G06K9/46 , H04N1/407
CPC分类号： G06T5/003 , G03F1/78 , G03F7/70291 , G06K9/4604 , G06K15/1872 , G06T7/13 , G06T2207/20164 , G06T2207/20192 , G06T2207/30148 , H04N1/4092
摘要： Methods and apparatus for correcting defects, such as rounded corners and line end shortening, in patterns formed via photolithography are provided. Such defects are compensated for “post-rasterization” by manipulating the grayscale values of pixel maps.
摘要翻译：提供了用于校正通过光刻形成的图案中的缺陷（例如圆角和线端缩短）的方法和装置。通过操纵像素图的灰度值来补偿这种缺陷“后光栅化”。

5. 发明授权

US07529421B2 Optical proximity correction in raster scan printing based on corner matching templates 失效
标题翻译：基于角匹配模板的光栅扫描打印中的光学邻近校正
公开(公告)号：US07529421B2
公开(公告)日：2009-05-05
申请号：US10882959
申请日：2004-07-01
申请人： Robert J. Beauchaine , Thomas E. Chabreck , Samuel C. Howells , John J. Hubbard , Asher Klatchko , Peter Pirogovsky , Robin L. Teitzel
发明人： Robert J. Beauchaine , Thomas E. Chabreck , Samuel C. Howells , John J. Hubbard , Asher Klatchko , Peter Pirogovsky , Robin L. Teitzel
IPC分类号： G06K9/00 , G06K9/46 , G06K9/62
CPC分类号： G06T5/003 , G06T7/13 , G06T2207/20164 , H04N1/4092
摘要： Methods and apparatus for correcting defects, such as rounded corners and line end shortening, in patterns formed via lithography are provided. Such defects are compensated for “post-rasterization” by manipulating the grayscale values of pixel maps.
摘要翻译：提供了用于校正通过光刻形成的图案中的缺陷（例如圆角和线端缩短）的方法和装置。通过操纵像素图的灰度值来补偿这种缺陷“后光栅化”。

6. 发明申请

US20120250134A1 ADAPTIVE OPTIC BEAMSHAPING IN LASER PROCESSING SYSTEMS 失效
标题翻译：激光加工系统中的自适应光学吸收
公开(公告)号：US20120250134A1
公开(公告)日：2012-10-04
申请号：US13494839
申请日：2012-06-12
申请人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
发明人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
IPC分类号： G02F1/01
CPC分类号： B23K26/0676 , B23K26/0613 , B23K26/066 , B23K26/705
摘要： A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.
摘要翻译：激光处理系统快速且灵活地修改处理光束，以确定并实现特定应用（或应用的子集）的改进或最佳光束简档。该系统降低了光束成形子系统对激光加工系统变化的敏感性，包括由制造公差，热漂移，部件性能变化以及其他系统变化来源引起的偏差。某些实施例还操纵较低质量的激光束（较高的M2值）以提供可接受的成形梁轮廓。

7. 发明授权

US08198564B2 Adaptive optic beamshaping in laser processing systems 失效
标题翻译：激光加工系统中的自适应光束成形
公开(公告)号：US08198564B2
公开(公告)日：2012-06-12
申请号：US12207338
申请日：2008-09-09
申请人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
发明人： Mark A. Unrath , Peter Pirogovsky , Leo Baldwin
IPC分类号： B23K26/00
CPC分类号： B23K26/0676 , B23K26/0613 , B23K26/066 , B23K26/705
摘要： A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.
摘要翻译：激光处理系统快速且灵活地修改处理光束，以确定并实现特定应用（或应用的子集）的改进或最佳光束简档。该系统降低了光束成形子系统对激光加工系统变化的敏感性，包括由制造公差，热漂移，部件性能变化以及其他系统变化来源引起的偏差。某些实施例还操纵较低质量的激光束（较高的M2值）以提供可接受的成形梁轮廓。

8. 发明申请

US20060002603A1 Optical proximity correction in raster scan printing based on corner matching templates 失效
公开(公告)号：US20060002603A1
公开(公告)日：2006-01-05
申请号：US10882959
申请日：2004-07-01
申请人： Robert Beauchaine , Thomas Chabreck , Samuel Howells , John Hubbard , Asher Klatchko , Peter Pirogovsky , Robin Teitzel
发明人： Robert Beauchaine , Thomas Chabreck , Samuel Howells , John Hubbard , Asher Klatchko , Peter Pirogovsky , Robin Teitzel
IPC分类号： G06K9/00 , G06K9/40 , G06F17/50
CPC分类号： G06T5/003 , G06T7/13 , G06T2207/20164 , H04N1/4092
摘要： Methods and apparatus for correcting defects, such as rounded corners and line end shortening, in patterns formed via lithography are provided. Such defects are compensated for “post-rasterization” by manipulating the grayscale values of pixel maps.

9. 发明授权

US08624157B2 Ultrashort laser pulse wafer scribing 有权
标题翻译：超短脉冲激光脉冲晶片刻划
公开(公告)号：US08624157B2
公开(公告)日：2014-01-07
申请号：US11440792
申请日：2006-05-25
申请人： Jeffrey A. Albelo , Peter Pirogovsky
发明人： Jeffrey A. Albelo , Peter Pirogovsky
IPC分类号： B23K26/38 , B23K26/06
CPC分类号： B23K26/364 , B23K26/0624 , B23K26/384 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.
摘要翻译：提供了用短激光脉冲刻划晶片的系统和方法，以减少目标材料的消融阈值。在堆叠的材料层中，针对每个层确定基于激光脉冲宽度的最小激光烧蚀阈值。选择最小激光消融阈值中的最高值，并且产生一个或多个激光脉冲的光束，其具有在所选择的激光烧蚀阈值和所选激光烧蚀阈值的大约十倍之间的范围内的能量密度。在一个实施例中，使用在约0.1皮秒至约1000皮秒范围内的激光脉冲宽度。另外或在其他实施例中，选择高脉冲重复频率以增加划线速度。在一个实施例中，脉冲重复频率在大约100kHz到大约100MHz之间的范围内。

10. 发明申请

US20100248451A1 Method for Laser Singulation of Chip Scale Packages on Glass Substrates 失效
标题翻译：玻璃基板上芯片尺寸封装的激光切割方法
公开(公告)号：US20100248451A1
公开(公告)日：2010-09-30
申请号：US12413068
申请日：2009-03-27
申请人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
发明人： Peter Pirogovsky , Jeffery A. Albelo , James O'Brien , Yasu Osako
IPC分类号： H01L21/78
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50
摘要： An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
摘要翻译：提出了一种改进的复合电子设备分离方法。复合电子装置通过将两个或多个基板组合成包含多个装置的组件来制造。提出了使用激光加工对复合电子器件进行单片化的方法。所提出的方法提供了更少的缺陷，例如基板的破裂或碎裂，同时最小化切口的宽度并维持系统的生产量。

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