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1. 发明授权

US5748438A Electrical energy storage device having a porous organic electrode 失效
标题翻译：具有多孔有机电极的电能储存装置
公开(公告)号：US5748438A
公开(公告)日：1998-05-05
申请号：US351983
申请日：1994-12-08
申请人： James L. Davis , Melanie Williams , Robert W. Pennisi
发明人： James L. Davis , Melanie Williams , Robert W. Pennisi
IPC分类号： H01G9/04 , H01G9/042 , H01G9/048 , H01M4/02 , H01G9/02 , H01G9/00
CPC分类号： H01G9/042 , H01G9/048 , H01M4/137 , Y02E60/13
摘要： An ultracapacitor having two porous organic membrane electrodes is made from microporous polymer substrates (10). The surface of the polymer substrate and the walls of the micropores (30) are coated with metal oxides. Both sides of the substrate can be coated with the conductive materials. The film can be a carboxylic ion-exchange material dispersed in a microporous copolymer matrix, and the film can be supported on a woven nylon substrate. The two electrodes (82, 84) are situated substantially parallel to each other, with the coated surface of one electrode facing the coated surface of the other electrode. An ionic electrolyte solution (89) fills the gap (86) between the electrodes.
摘要翻译：具有两个多孔有机膜电极的超级电容器由微孔聚合物基材（10）制成。聚合物基材的表面和微孔（30）的壁涂覆有金属氧化物。衬底的两侧可以涂覆导电材料。膜可以是分散在微孔共聚物基质中的羧酸离子交换材料，并且该膜可以负载在编织尼龙基材上。两个电极（82,84）基本上彼此平行地布置，一个电极的涂覆表面面对另一个电极的涂覆表面。离子电解质溶液（89）填充电极之间的间隙（86）。

2. 发明授权

US5288769A Thermally conducting adhesive containing aluminum nitride 失效
标题翻译：含氮化铝的导热胶
公开(公告)号：US5288769A
公开(公告)日：1994-02-22
申请号：US935360
申请日：1992-08-28
申请人： Marc V. Papageorge , Robert W. Pennisi , James L. Davis
发明人： Marc V. Papageorge , Robert W. Pennisi , James L. Davis
IPC分类号： C09J9/02 , H01L21/58 , H01L23/373 , B32B5/16 , B32B15/02
CPC分类号： H01L24/83 , C09J9/02 , H01L23/3737 , H01L24/29 , H01L2224/2929 , H01L2224/29347 , H01L2224/29386 , H01L2224/29447 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , Y10S428/901 , Y10T428/2991 , Y10T428/2993
摘要： Thermally conductive particles (14) for use in a polymeric resin are provided. The particles (10) are aluminum nitride coated with copper (12). The thermally conductive particles (14) are incorporated into a polymer (38) in order to provide, for example, a thermally conductive adhesive (36). The thermally conductive adhesive is used to bond an electronic component (32) to a circuit carrying substrate (34) in order to dissipate heat from the electronic component.
摘要翻译：提供了用于聚合物树脂的导热颗粒（14）。颗粒（10）是用铜（12）涂覆的氮化铝。导热颗粒（14）被引入聚合物（38）中以提供例如导热粘合剂（36）。导热粘合剂用于将电子部件（32）连接到电路承载基板（34），以便散发来自电子部件的热量。

3. 发明授权

US5064481A Use or organic acids in low residue solder pastes 失效
标题翻译：在低残留焊膏中使用或有机酸
公开(公告)号：US5064481A
公开(公告)日：1991-11-12
申请号：US524540
申请日：1990-05-17
申请人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth
发明人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth
IPC分类号： H05K3/34 , B23K35/22 , B23K35/36 , B23K35/363
CPC分类号： B23K35/3618 , B23K35/36
摘要： Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.
摘要翻译：描述了助熔组合物，其含有下式的助熔剂化合物：其中R是吸电子基团。在一个实施方案中，R选自氟，氯，溴，碘，硫，羟基，腈和苄基。该复合物从组装的印刷电路板（PCB）中清除氧化物，然后几乎不需要清洁步骤或仅用水或甲酸清洗即可挥发。很少或不需要不需要的残留物。这种酸性助熔剂可以与典型的焊料配方（例如铅/锡焊膏）混合使用，或局部施用于焊料如焊料球; 这两种技术允许更容易地组装PCBs，具有高质量的键，并且几乎没有或没有残留物。苹果酸是优选的有机酸助熔剂。

4. 发明授权

US5045128A Solder fluxes bearing oxide removers generated by light 失效
标题翻译：由光产生的具有氧化物去除剂的焊剂
公开(公告)号：US5045128A
公开(公告)日：1991-09-03
申请号：US566029
申请日：1990-08-13
申请人： Bobby D. Landreth , Robert W. Pennisi , James L. Davis , Fadia Nounou
发明人： Bobby D. Landreth , Robert W. Pennisi , James L. Davis , Fadia Nounou
IPC分类号： B23K35/363 , B23K1/00 , B23K35/36 , H05K3/34
CPC分类号： B23K35/3612 , H05K3/3484 , H05K3/3489
摘要： Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.
摘要翻译：描述了含有从光源如Hg / Xe紫外（UV）光源引起光引发时产生酸的化合物的助焊剂组合物。这些酸在组装时清洁印刷电路板（PCB）的氧化物，然后很少或不需要清洁步骤挥发，或仅用水清洁。释放氧化物去除剂（有时称为“光酸”）的化合物包括金属和有机鎓盐以及带有羰基的呋喃基化合物。这种助熔组合物可以与典型的焊料配方（例如铅/锡焊料）混合使用，或者局部施用于其上; 这两种技术允许更容易地组装PCB，并且具有高质量的粘合。

5. 发明授权

US5028399A Gas manifold for solder reflow processing atmosphere 失效
标题翻译：用于焊锡回流加工气体的气体歧管
公开(公告)号：US5028399A
公开(公告)日：1991-07-02
申请号：US464259
申请日：1990-01-12
申请人： Anthony B. Suppelsa , Robert W. Pennisi , Fadia Nounou , James L. Davis
发明人： Anthony B. Suppelsa , Robert W. Pennisi , Fadia Nounou , James L. Davis
IPC分类号： B23K1/008
CPC分类号： B23K1/008
摘要： A manifold (10) for use in a gas solder-reflow oven (50) comprises a hollow tube made from a transition metal having an open end (18) for receiving gas, a closed end (16), and a plurality of holes (12).
摘要翻译：用于气体焊料回流炉（50）的歧管（10）包括由具有用于接收气体的开口端（18）的过渡金属制成的中空管，封闭端（16）和多个孔 12）。

6. 发明授权

US4992139A Conductive mask and method of making same 失效
标题翻译：导电罩及其制作方法
公开(公告)号：US4992139A
公开(公告)日：1991-02-12
申请号：US437136
申请日：1989-11-16
申请人： Anthony B. Suppelsa , Robert W. Pennisi , James L. Davis , Robert J. Mulligan
发明人： Anthony B. Suppelsa , Robert W. Pennisi , James L. Davis , Robert J. Mulligan
IPC分类号： H05K3/06 , H05K3/24 , H05K3/40
CPC分类号： H05K3/061 , H05K2201/035 , H05K2201/09563 , H05K2203/0571 , H05K3/247 , H05K3/4069 , Y10S428/901 , Y10T29/49155 , Y10T29/49165 , Y10T428/24339 , Y10T428/24917
摘要： A first conductive layer 12 is deposited on the substrate 14. Next, a second conductive layer 16 with a circuit pattern is deposited on the first layer 12. Finally, the first conductive layer 12 not residing under the second conductive layer 16 is etched off, leaving the second layer 16 above the first layer 12.
摘要翻译：第一导电层12沉积在衬底14上。接下来，具有电路图案的第二导电层16沉积在第一层12上。最后，不存在于第二导电层16下面的第一导电层12被蚀刻掉，使第二层16在第一层12上方。

7. 发明授权

US5122200A Method of cleaning printed circuit boards using formic acid 失效
标题翻译：使用甲酸清洗印刷电路板的方法
公开(公告)号：US5122200A
公开(公告)日：1992-06-16
申请号：US583630
申请日：1990-09-17
申请人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Robert J. Mulligan , Bobby D. Landreth
发明人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Robert J. Mulligan , Bobby D. Landreth
IPC分类号： B23K35/36 , C23G1/10 , H05K3/26 , H05K3/34
CPC分类号： B23K35/36 , B23K35/3618 , C23G1/103 , H05K3/26 , H05K2203/0789 , H05K2203/122 , H05K3/3484
摘要： Solder pastes having vehicles including formic acid-soluble organic acids as fluxing agents are described. Fluxing agents may be compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, acrylic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize leaving a residue to be cleaned away. The cleaning step involves rinsing with formic acid. No undesired residue remains indicating that the organic acids of the invention are effective in cleaning boards. Such acid fluxing agents can be used mixed with typical solder components, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent. The formic acid cleaning step may be followed by a water rinse.
摘要翻译：描述了具有包含甲酸可溶性有机酸作为助熔剂的载体的焊膏。助焊剂可以是下式的化合物：其中R是吸电子基团。在一个实施方案中，R选自氟，氯，溴，碘，硫，羟基，腈和苄基。其它合适的甲酸助熔剂包括但不限于己二酸，丙烯酸，聚丙烯酸，甲基丙烯酸和聚甲基丙烯酸。这些化合物在组装时清除印刷电路板（PCB）的氧化物，然后挥发，留下残留物进行清除。清洁步骤包括用甲酸冲洗。没有不需要的残留物表明本发明的有机酸在清洁板中是有效的。这种酸助熔剂可以与典型的焊料组分（例如铅/锡焊膏）混合使用，或局部施用于焊料如焊料球; 这两种技术允许更容易地组装PCBs，具有高质量的键，并且几乎没有或没有残留物。苹果酸是优选的有机酸助熔剂。甲酸清洗步骤之后可以进行水冲洗。

8. 发明授权

US5092943A Method of cleaning printed circuit boards using water 失效
标题翻译：使用水清洗印刷电路板的方法
公开(公告)号：US5092943A
公开(公告)日：1992-03-03
申请号：US583629
申请日：1990-09-17
申请人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth , Robert J. Mulligan
发明人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth , Robert J. Mulligan
IPC分类号： B23K35/36 , H05K3/34
CPC分类号： H05K3/3489 , B23K35/36 , B23K35/3618
摘要： Solder pastes having vehicles including blends of low boiling point alcohols and relatively high boiling point alcohols are described which leave residues which may be cleaned using only water are described. The low boiling point alcohols have a boiling point range of between about 65.degree. and about 150.degree. C. whereas the high boiling point alcohols have a boiling point in rhe range of about 150.degree. to about 270.degree. C. The solder pastes also use water-soluble organic acids as fluxing agents such as compounds of the formula: ##STR1## where R is an electron withdrawing group such as fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilze leaving a residue to be cleaned away. The cleaning step involves rinsing with water. No undesired residue remains indicating that the organic acids of the invention are effective in cleaning boards. Malic acid is a preferred organic acid fluxing agent.
摘要翻译：描述了具有包含低沸点醇和相对高沸点醇的共混物的载体的焊膏，其留下可以仅使用水清洁的残余物。低沸点醇的沸点范围为约65℃至约150℃，而高沸点醇的沸点在约150℃至约270℃的流变范围内。焊膏还使用水 - 可溶性有机酸作为助熔剂，例如下式的化合物：其中R是吸电子基团如氟，氯，溴，碘，硫，羟基，腈和苄基。其它合适的甲酸助熔剂包括但不限于己二酸，聚丙烯酸，甲基丙烯酸和聚甲基丙烯酸。这些化合物在组装时清除印刷电路板（PCB）的氧化物，然后挥发，留下残留物进行清理。清洁步骤包括用水冲洗。没有不需要的残留物表明本发明的有机酸在清洁板中是有效的。苹果酸是优选的有机酸助熔剂。

9. 发明授权

US5116433A Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same 失效
标题翻译：具有焊剂合金/复合材料的氧化物焊剂的焊膏和其制备方法
公开(公告)号：US5116433A
公开(公告)日：1992-05-26
申请号：US607387
申请日：1990-10-31
申请人： James L. Davis , Fadia Nounou , Anthony B. Suppelsa , Robert W. Pennisi
发明人： James L. Davis , Fadia Nounou , Anthony B. Suppelsa , Robert W. Pennisi
IPC分类号： B23K35/22 , B23K35/36 , B23K35/363 , B23K35/40 , H05K3/34
CPC分类号： B23K35/3612 , B23K35/36 , H05K3/3484
摘要： A solder paste is formulated by combining a solder paste vehicle, a resin, and solder alloy particles. The solder paste vehicle is made by combining mono and polyfunctional alcoholic solvents with a fluxing agent. The solder particles are first reacted with a formate ion produced by formic acid, formaldehyde, paraformaldehyde, or mixtures thereof, in order to create a metal-formate complex that functions as an oxygen scavenger on the surface of the solder alloy particles.
摘要翻译：通过组合焊膏载体，树脂和焊料合金颗粒来配制焊膏。焊膏载体通过将单官能醇和多官能醇溶剂与助熔剂组合而制成。焊料颗粒首先与由甲酸，甲醛，多聚甲醛或其混合物产生的甲酸根离子反应，以产生在焊料合金颗粒的表面上用作除氧剂的金属 - 甲酸盐络合物。

10. 发明授权

US4995921A Solder pastes using alcohol blends as rheological aids 失效
标题翻译：使用酒精混合物作为流变助剂的焊膏
公开(公告)号：US4995921A
公开(公告)日：1991-02-26
申请号：US521871
申请日：1990-05-11
申请人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth
发明人： James L. Davis , Robert W. Pennisi , Fadia Nounou , Bobby D. Landreth
IPC分类号： B23K35/36
CPC分类号： B23K35/36 , B23K35/3612
摘要： Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof. These blends give improved solubility of organic acid fluxing agents, provide relatively high viscosities of the solder paste and permit lower amounts of solvent to be used.
摘要翻译：描述了使用单官能和多官能醇的共混物的焊膏车辆。共混物可以具有主要部分的低粘度单官能醇溶剂和少部分高粘度多官能醇增稠剂。一元溶剂具有至少3厘泊和约3至18个碳原子的室温粘度，并且可以包括如2-丁醇，1-己醇，1-庚醇，1-辛醇，1-壬醇，1-十二烷醇，2-乙氧基乙醇，2-（2-乙氧基乙氧基）乙醇，2-（2-丁氧基乙氧基）乙醇，正十六烷醇，正十八烷醇，苄醇及其混合物。多元醇的室温粘度在约26至约1500cp之间，并且包括化合物如1,2-乙二醇; 1,2-丙二醇 1,3-丙二醇 1,2-丁二醇 1,3-丁二醇 1,4-丁二醇 1,2-戊二醇 1,5-戊二醇 2,4-戊二醇 2,5-己二醇; 甘油 1,2,4-丁三醇; 2,2' - （亚乙二氧基）二乙醇; 1,12-十二烷二醇; 1,6-己二醇及其混合物。这些共混物提高了有机酸助熔剂的溶解度，提供了较高粘度的焊膏，并允许使用较少量的溶剂。

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