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1. 发明授权

US5388025A Rechargeable electrical energy storage device having organometallic electrodes 失效
标题翻译：具有有机金属电极的可充电电能储存装置
公开(公告)号：US5388025A
公开(公告)日：1995-02-07
申请号：US937776
申请日：1992-09-01
申请人： James L. Davis , John K. Arledge , Thomas J. Swirbel , Melanie Williams
发明人： James L. Davis , John K. Arledge , Thomas J. Swirbel , Melanie Williams
IPC分类号： H01G9/058 , H01M4/60 , H01M10/36 , H01G9/00
CPC分类号： H01M4/60 , H01M10/36
摘要： A rechargeable electrical energy storage device (20). The cell has two electrodes (28, 36) constructed from a similar organometallic compound (30), and the electrodes are electrically connected by an ion carrying electrolyte (32). The electrodes are also physically separated from each other by a barrier (34) that will pass ions but not electrons. In one embodiment of the invention, the electrodes are ferrocene, and the electrolyte is sulfuric acid.
摘要翻译：一种可充电电能存储装置（20）。电池具有由类似的有机金属化合物（30）构成的两个电极（28,36），并且电极通过离子载体电解质（32）电连接。电极也通过将通过离子而不是电子的屏障（34）在物理上彼此分离。在本发明的一个实施方案中，电极是二茂铁，电解质是硫酸。

2. 发明授权

US5395740A Method for fabricating electrode patterns 失效
标题翻译：电极图形制作方法
公开(公告)号：US5395740A
公开(公告)日：1995-03-07
申请号：US10224
申请日：1993-01-27
申请人： Thomas J. Swirbel , John K. Arledge , James L. Davis
发明人： Thomas J. Swirbel , John K. Arledge , James L. Davis
IPC分类号： G02F1/1343 , G03F7/00 , G03F7/20 , H01L27/32 , H01L51/52 , H05K3/04 , G03F7/26 , G03C5/16
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/00 , G03F7/0035 , G03F7/2022 , H01L51/0021
摘要： A method of forming electrode patterns on a substrate. A transparent substrate (10) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (12) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then exposed to actinic radiation (19) through the back side (25) of the transparent substrate. The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.
摘要翻译：在基板上形成电极图案的方法。透明基板（10）被图案化，在前侧具有光致抗蚀剂层（14），从而露出基板的部分（18）。金属氧化物层（12）沉积在图案化的光刻胶层和衬底的露出部分上。然后将图案化的光致抗蚀剂层通过透明基底的背面（25）暴露于光化辐射（19）。去除光致抗蚀剂图案（20），携带沉积在光致抗蚀剂层上的金属氧化物层的那些部分，通过剥离技术形成电极图案（22）。

3. 发明授权

US5460922A Method for fabricating electrode patterns 失效
标题翻译：电极图形制作方法
公开(公告)号：US5460922A
公开(公告)日：1995-10-24
申请号：US276147
申请日：1994-07-18
申请人： Thomas J. Swirbel , John K. Arledge , James L. Davis
发明人： Thomas J. Swirbel , John K. Arledge , James L. Davis
IPC分类号： G02F1/1343 , G03F7/00 , G03F7/20 , H01L27/32 , H01L51/52 , H05K3/04 , G03F7/26
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/00 , G03F7/0035 , G03F7/2022 , H01L51/0021
摘要： A method of forming electrode patterns on a substrate. A substrate (30) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (32) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then flood exposed to actinic radiation (19). The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.
摘要翻译：在基板上形成电极图案的方法。衬底（30）在正面上用光致抗蚀剂层（14）构图，从而露出衬底的部分（18）。金属氧化物层（32）沉积在图案化的光致抗蚀剂层和衬底的露出部分上。然后将图案化的光致抗蚀剂层暴露于光化辐射（19）。去除光致抗蚀剂图案（20），携带沉积在光致抗蚀剂层上的金属氧化物层的那些部分，通过剥离技术形成电极图案（22）。

4. 发明授权

US5382471A Adherent metal coating for aluminum nitride surfaces 失效
标题翻译：用于氮化铝表面的粘附金属涂层
公开(公告)号：US5382471A
公开(公告)日：1995-01-17
申请号：US12824
申请日：1993-02-03
申请人： John K. Arledge , Thomas J. Swirbel , James L. Davis
发明人： John K. Arledge , Thomas J. Swirbel , James L. Davis
IPC分类号： C04B41/52 , C04B41/89 , C23C14/02 , C23C14/18 , C23C26/00 , H05K3/38 , B32B15/04
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , C23C14/022 , C23C14/18 , C23C26/00 , H05K3/388 , Y10T428/265
摘要： A metallized aluminum nitride substrate (40) has a first layer (42) of deposited metal, comprising chromium, chromium oxide, and an aluminum nitride/chromium oxide complex represented by the formulaAl.sub.a N.sub.b O.sub.c Cr.sub.dwhere a, b, c and d are numbers representing relative combining ratios. The first layer is formed by sputtering about 10-500 .ANG.ngstroms of chromium onto the substrate under vacuum, and then heating the substrate in an oxygen-containing atmosphere at conditions of time and temperature sufficient to convert at least portions of the deposited chromium to chromium oxide, in order to form an adherent metal system. A second layer (44) of metal such as chromium covers the first layer. A third layer (46) of metal is deposited on the second layer in a manner sufficient to prevent oxidation of the second layer.
摘要翻译：金属化氮化铝衬底（40）具有沉积金属的第一层（42），其包含铬，氧化铬和由式AlaNbOcCrd表示的氮化铝/铬氧化物络合物，其中a，b，c和d表示相对组合比。第一层是通过在真空下将大约10-500埃的铬溅射到衬底上形成的，然后在足够的时间和温度的条件下在含氧气氛中加热衬底，以将至少部分沉积的铬转化成铬氧化物，以形成粘附金属体系。金属如铬的第二层（44）覆盖第一层。金属的第三层（46）以足以防止第二层氧化的方式沉积在第二层上。

5. 发明授权

US5437941A Thin film electrical energy storage device 失效
标题翻译：薄膜电能储存装置
公开(公告)号：US5437941A
公开(公告)日：1995-08-01
申请号：US373903
申请日：1995-01-17
申请人： John K. Arledge , James L. Davis , Thomas J. Swirbel
发明人： John K. Arledge , James L. Davis , Thomas J. Swirbel
IPC分类号： H01G9/00 , H01G9/145 , H01M2/02 , H01M2/08 , H01M2/18 , H01M2/14
CPC分类号： H01G9/145 , H01M2/0212 , H01M2/08 , H01M2/18
摘要： An electrical energy storage device (10). An electrode (12) consisting of a thin film of metal or metal oxide is deposited on a substrate (24), preferably by sputtering. Spherical plastic spacers (16) are uniformly dispersed on the electrode at a maximum density of about 1000 spacers per square millimeter of the electrode area. A second substrate also has an electrode (14) formed of a thin film of metal or metal oxide deposited on it, similar to the first substrate. The first and second substrates are arranged so that the electrodes face each other and are separated by the spherical plastic spacers to form a gap (18) of about 20 microns between the electrodes. An electrolyte (20) is filled in the gap, and the edges of the gap are optionally sealed (22) to form the electrical energy storage device. The device may also be formed by using metal foils, and eliminating one or more of the substrates. In both cases, the use of an electrolyte is optional.
摘要翻译：一种电能存储装置（10）。优选通过溅射将由金属或金属氧化物薄膜组成的电极（12）沉积在基板（24）上。球形塑料间隔物（16）以电极面积每平方毫米约1000个间隔物的最大密度均匀分散在电极上。类似于第一衬底，第二衬底还具有由沉积在其上的金属或金属氧化物薄膜形成的电极（14）。第一和第二基板被布置成使得电极彼此面对并且被球形塑料间隔物隔开，以在电极之间形成约20微米的间隙（18）。电解质（20）填充在间隙中，并且间隙的边缘任选地被密封（22）以形成电能存储装置。该装置还可以通过使用金属箔形成，并且消除一个或多个基板。在这两种情况下，使用电解质都是可选的。

6. 发明授权

US5217589A Method of adherent metal coating for aluminum nitride surfaces 失效
标题翻译：氮化铝表面附着金属涂层的方法
公开(公告)号：US5217589A
公开(公告)日：1993-06-08
申请号：US770270
申请日：1991-10-03
申请人： John K. Arledge , Thomas J. Swirbel , James L. Davis
发明人： John K. Arledge , Thomas J. Swirbel , James L. Davis
IPC分类号： C04B41/52 , C04B41/89 , C23C14/02 , C23C14/18 , C23C26/00 , H05K3/38
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , C23C14/022 , C23C14/18 , C23C26/00 , H05K3/388 , Y10T428/265
摘要： A method of metallizing a substrate by vacuum depositing a thin layer of chromium. The substrate is first cleaned (16) by exposing it to a plasma gas discharge. A thin layer of chromium metal is then sputtered under vacuum (17) onto the substrate. The substrate is then heated in an oxygen containing atmosphere (18) for a period of time and at a temperature sufficient to convert the chromium metal to chromium oxide. A second layer of chromium metal is then sputtered (20) onto the chromium oxide layer in order to form an adherent metal system to the substrate.
摘要翻译：通过真空沉积薄层的铬来金属化衬底的方法。首先通过将衬底暴露于等离子体气体放电来清洁衬底（16）。然后将薄的铬金属层在真空（17）下溅射到基底上。然后将基材在含氧气氛（18）中加热一段时间，并在足以将铬金属转化为氧化铬的温度下加热。然后将第二层铬金属溅射（20）到氧化铬层上，以便形成与衬底粘附的金属体系。

7. 发明授权

US5355016A Shielded EPROM package 失效
标题翻译：屏蔽EPROM封装
公开(公告)号：US5355016A
公开(公告)日：1994-10-11
申请号：US56278
申请日：1993-05-03
申请人： Thomas J. Swirbel , Lonnie L. Barnardoni , Melanie Williams , James L. Davis
发明人： Thomas J. Swirbel , Lonnie L. Barnardoni , Melanie Williams , James L. Davis
IPC分类号： G11C5/00 , G11C16/18 , H01L23/552 , H01L25/04 , H01L23/28
CPC分类号： H01L23/552 , G11C16/18 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025
摘要： A shielded, erasable-programmable-read-only-memory (EPROM) package is provided. A circuit carrying substrate (10), contains an area for mounting an EPROM chip (16), having conductive interconnecting patterns (12) adjacent to the chip mounting area. The EPROM chip is mounted on the circuit carrying substrate, and the pad electrodes on the EPROM chip are connected to pads on the conductive patterns of the substrate by wire bonds (17) or other means. An ultraviolet (UV) light transmitting resin (18) is transfer molded onto the circuit carrying substrate, covering the EPROM chip (16) and the wire bonds (17) so as to provide an optical path through the material to the top surface of the EPROM chip, and sealing the EPROM chip from the exterior of the package. An adherent metal coating (19) is sputtered over the transfer molded resin, and the metal coating is coated with a protective organic resin (15). Both the metal coating and the organic resin are at least partially transparent to ultraviolet light.
摘要翻译：提供屏蔽，可擦写可编程只读存储器（EPROM）封装。电路承载基板（10）包含用于安装EPROM芯片（16）的区域，其具有与芯片安装区域相邻的导电互连图案（12）。 EPROM芯片安装在电路承载基板上，EPROM芯片上的焊盘电极通过引线接合（17）或其他方式连接到基板的导电图案上的焊盘。紫外线（UV）透光树脂（18）被传递模塑到电路承载基板上，覆盖EPROM芯片（16）和引线接合（17），以便提供通过材料的光路到达 EPROM芯片，并将EPROM芯片从封装的外部密封。在传递模塑树脂上溅射粘附金属涂层（19），金属涂层涂覆有保护性有机树脂（15）。金属涂层和有机树脂对紫外光至少部分透明。

8. 发明授权

US06990734B2 Methods for shielding one or more circuit of a printed circuit board 有权
标题翻译：屏蔽印刷电路板的一个或多个电路的方法
公开(公告)号：US06990734B2
公开(公告)日：2006-01-31
申请号：US10263006
申请日：2002-10-02
申请人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： H05K3/34
CPC分类号： H05K1/0218 , H01L2223/6622 , H05K1/0221 , H05K1/0222 , H05K1/113 , H05K3/4644 , H05K9/0039 , H05K2201/0715 , H05K2201/09036 , H05K2201/09509 , H05K2201/09809 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/10969 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).
摘要翻译：在印刷电路板（10）上形成金属屏蔽的方法包括在印刷电路板（10）的基板（22）上沉积第一金属层（41），将第一层介电材料（42）沉积在所述第一金属层（41），在所述第一介电层（42）上印刷一个或多个电路（21,21'），在所述一个或多个印刷电路（21,21）上沉积第二介电材料层 '），在围绕所述一个或多个印刷电路（21,21'）的两层介电材料（42,43）中形成沟槽状开口（44），使得第一层（41）的金属暴露通过所述沟槽状开口（44），在所述第二介电材料层（43）上沉积第二金属层（27），使得所述第二金属层（27）平坦化所述沟槽状开口（44）并使与第一金属层（41）电接触。

9. 发明授权

US5591480A Method for fabricating metallization patterns on an electronic substrate 失效
标题翻译：在电子基板上制造金属化图案的方法
公开(公告)号：US5591480A
公开(公告)日：1997-01-07
申请号：US517392
申请日：1995-08-21
申请人： Douglas H. Weisman , Thomas J. Swirbel , John K. Arledge
发明人： Douglas H. Weisman , Thomas J. Swirbel , John K. Arledge
IPC分类号： G02F1/1345 , H01L21/48 , H03H3/08 , H05K3/06 , H05K3/24 , B05D5/12 , C23C14/00 , C25D5/02 , H01L21/465
CPC分类号： H05K3/243 , H01L21/4846 , H03H3/08 , G02F1/1345 , H05K2201/0326 , H05K2203/0384 , H05K2203/095 , H05K3/062 , H05K3/064
摘要： One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.
摘要翻译：用于将可焊焊盘（406）制造到用于直接芯片附接的基板（220）上的一种方法使用多层金属化涂层（500）。涂层具有铟锡氧化物的底层（202），其中铜的中间层（204）和氧化铟锡的顶层（206）。掩模层（208）沉积在衬底的有源显示区域（402）上，留下焊盘未被覆盖。然后使用聚酰亚胺作为抗蚀剂，然后等离子体蚀刻所揭示的接合焊盘，并且选择性地去除ITO的顶层以露出下面的铜层。然后将暴露的铜层（204）用可焊接金属镀覆至所需厚度，以形成可与直接芯片附接方案一起使用的焊盘。

10. 发明授权

US06653915B1 Coaxial transmission lines having grounding troughs on a printed circuit board 有权
标题翻译：同轴传输线在印刷电路板上具有接地槽
公开(公告)号：US06653915B1
公开(公告)日：2003-11-25
申请号：US09378351
申请日：1999-08-20
申请人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
发明人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
IPC分类号： H01P308
CPC分类号： H05K1/0221 , H01P11/005 , H05K3/0023 , H05K3/4644 , H05K2201/09036 , H05K2201/09809 , H05K2201/09981 , Y10T29/49016 , Y10T29/49117
摘要： A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
摘要翻译：一种在高密度PCB上形成同轴传输线的方法。 PCB（104）上的金属层（102）形成屏蔽的底部并被第一电介质（112）覆盖。在第一电介质中形成两个平行的沟槽（122），以露出金属条的部分（123）。信号导体（132）然后形成在第一电介质上。第二电介质（142）覆盖信号导体和第一电介质。第二组两个平行的沟槽（172）形成在紧邻第一两个沟槽上方的第二电介质中。金属沉积物（182）被电镀在平行的沟槽中以接触金属条，并且还覆盖位于沟槽之间的第二电介质的一部分以形成屏蔽。所得到的同轴传输线具有通过电介质与屏蔽层绝缘的中心导体。

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