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1. 发明授权

US5591480A Method for fabricating metallization patterns on an electronic substrate 失效
标题翻译：在电子基板上制造金属化图案的方法
公开(公告)号：US5591480A
公开(公告)日：1997-01-07
申请号：US517392
申请日：1995-08-21
申请人： Douglas H. Weisman , Thomas J. Swirbel , John K. Arledge
发明人： Douglas H. Weisman , Thomas J. Swirbel , John K. Arledge
IPC分类号： G02F1/1345 , H01L21/48 , H03H3/08 , H05K3/06 , H05K3/24 , B05D5/12 , C23C14/00 , C25D5/02 , H01L21/465
CPC分类号： H05K3/243 , H01L21/4846 , H03H3/08 , G02F1/1345 , H05K2201/0326 , H05K2203/0384 , H05K2203/095 , H05K3/062 , H05K3/064
摘要： One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.
摘要翻译：用于将可焊焊盘（406）制造到用于直接芯片附接的基板（220）上的一种方法使用多层金属化涂层（500）。涂层具有铟锡氧化物的底层（202），其中铜的中间层（204）和氧化铟锡的顶层（206）。掩模层（208）沉积在衬底的有源显示区域（402）上，留下焊盘未被覆盖。然后使用聚酰亚胺作为抗蚀剂，然后等离子体蚀刻所揭示的接合焊盘，并且选择性地去除ITO的顶层以露出下面的铜层。然后将暴露的铜层（204）用可焊接金属镀覆至所需厚度，以形成可与直接芯片附接方案一起使用的焊盘。

2. 发明授权

US06990734B2 Methods for shielding one or more circuit of a printed circuit board 有权
标题翻译：屏蔽印刷电路板的一个或多个电路的方法
公开(公告)号：US06990734B2
公开(公告)日：2006-01-31
申请号：US10263006
申请日：2002-10-02
申请人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： H05K3/34
CPC分类号： H05K1/0218 , H01L2223/6622 , H05K1/0221 , H05K1/0222 , H05K1/113 , H05K3/4644 , H05K9/0039 , H05K2201/0715 , H05K2201/09036 , H05K2201/09509 , H05K2201/09809 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/10969 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).
摘要翻译：在印刷电路板（10）上形成金属屏蔽的方法包括在印刷电路板（10）的基板（22）上沉积第一金属层（41），将第一层介电材料（42）沉积在所述第一金属层（41），在所述第一介电层（42）上印刷一个或多个电路（21,21'），在所述一个或多个印刷电路（21,21）上沉积第二介电材料层 '），在围绕所述一个或多个印刷电路（21,21'）的两层介电材料（42,43）中形成沟槽状开口（44），使得第一层（41）的金属暴露通过所述沟槽状开口（44），在所述第二介电材料层（43）上沉积第二金属层（27），使得所述第二金属层（27）平坦化所述沟槽状开口（44）并使与第一金属层（41）电接触。

3. 发明授权

US5395740A Method for fabricating electrode patterns 失效
标题翻译：电极图形制作方法
公开(公告)号：US5395740A
公开(公告)日：1995-03-07
申请号：US10224
申请日：1993-01-27
申请人： Thomas J. Swirbel , John K. Arledge , James L. Davis
发明人： Thomas J. Swirbel , John K. Arledge , James L. Davis
IPC分类号： G02F1/1343 , G03F7/00 , G03F7/20 , H01L27/32 , H01L51/52 , H05K3/04 , G03F7/26 , G03C5/16
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/00 , G03F7/0035 , G03F7/2022 , H01L51/0021
摘要： A method of forming electrode patterns on a substrate. A transparent substrate (10) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (12) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then exposed to actinic radiation (19) through the back side (25) of the transparent substrate. The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.
摘要翻译：在基板上形成电极图案的方法。透明基板（10）被图案化，在前侧具有光致抗蚀剂层（14），从而露出基板的部分（18）。金属氧化物层（12）沉积在图案化的光刻胶层和衬底的露出部分上。然后将图案化的光致抗蚀剂层通过透明基底的背面（25）暴露于光化辐射（19）。去除光致抗蚀剂图案（20），携带沉积在光致抗蚀剂层上的金属氧化物层的那些部分，通过剥离技术形成电极图案（22）。

4. 发明授权

US06653915B1 Coaxial transmission lines having grounding troughs on a printed circuit board 有权
标题翻译：同轴传输线在印刷电路板上具有接地槽
公开(公告)号：US06653915B1
公开(公告)日：2003-11-25
申请号：US09378351
申请日：1999-08-20
申请人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
发明人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
IPC分类号： H01P308
CPC分类号： H05K1/0221 , H01P11/005 , H05K3/0023 , H05K3/4644 , H05K2201/09036 , H05K2201/09809 , H05K2201/09981 , Y10T29/49016 , Y10T29/49117
摘要： A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
摘要翻译：一种在高密度PCB上形成同轴传输线的方法。 PCB（104）上的金属层（102）形成屏蔽的底部并被第一电介质（112）覆盖。在第一电介质中形成两个平行的沟槽（122），以露出金属条的部分（123）。信号导体（132）然后形成在第一电介质上。第二电介质（142）覆盖信号导体和第一电介质。第二组两个平行的沟槽（172）形成在紧邻第一两个沟槽上方的第二电介质中。金属沉积物（182）被电镀在平行的沟槽中以接触金属条，并且还覆盖位于沟槽之间的第二电介质的一部分以形成屏蔽。所得到的同轴传输线具有通过电介质与屏蔽层绝缘的中心导体。

5. 发明授权

US5891795A High density interconnect substrate 失效
标题翻译：高密度互连基板
公开(公告)号：US5891795A
公开(公告)日：1999-04-06
申请号：US617156
申请日：1996-03-18
申请人： John K. Arledge , Thomas J. Swirbel
发明人： John K. Arledge , Thomas J. Swirbel
IPC分类号： H01L21/48 , H05K3/40 , H05K3/46 , H01L21/44 , H01L23/48
CPC分类号： H05K3/4046 , H01L21/4846 , H01L21/4853 , H01L2924/0002 , H05K2201/0347 , H05K2201/10234 , H05K3/4644
摘要： A method of creating high density interlayer interconnects on circuit carrying substrates. A circuit pattern (20) is formed on one side of a substrate (10), and gold balls (30) are selectively placed on the circuit pattern using a thermosonic ball bonder. A liquid solution of a polymer is cast directly on the substrate and the etched circuit pattern such that only the upper portion of each gold ball is revealed when the liquid polymer solution is then dried and cured to form a dry film (40). A second layer of metal is then deposited directly on the dry film, such that it is electrically and mechanically connected to the exposed top of the gold balls. A second circuit pattern (50) is then formed in the second layer of metal. The resulting high density interconnect has two circuit layers separated by a dielectric layer. Each circuit layer is connected to the other by the gold balls that serve as conductive vias.
摘要翻译：一种在电路承载衬底上产生高密度层间互连的方法。电路图案（20）形成在基板（10）的一侧上，并且使用热球球接合器将金球（30）选择性地放置在电路图案上。将聚合物的液体溶液直接浇铸在基材和蚀刻电路图案上，使得仅当液体聚合物溶液干燥和固化以形成干膜（40）时，才会露出每个金球的上部。然后将第二层金属直接沉积在干膜上，使得其与金球的暴露的顶部电气和机械连接。然后在第二金属层中形成第二电路图案（50）。所得到的高密度互连具有由介电层隔开的两个电路层。每个电路层通过用作导电通孔的金球彼此连接。

6. 发明授权

US5460922A Method for fabricating electrode patterns 失效
标题翻译：电极图形制作方法
公开(公告)号：US5460922A
公开(公告)日：1995-10-24
申请号：US276147
申请日：1994-07-18
申请人： Thomas J. Swirbel , John K. Arledge , James L. Davis
发明人： Thomas J. Swirbel , John K. Arledge , James L. Davis
IPC分类号： G02F1/1343 , G03F7/00 , G03F7/20 , H01L27/32 , H01L51/52 , H05K3/04 , G03F7/26
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/00 , G03F7/0035 , G03F7/2022 , H01L51/0021
摘要： A method of forming electrode patterns on a substrate. A substrate (30) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (32) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then flood exposed to actinic radiation (19). The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.
摘要翻译：在基板上形成电极图案的方法。衬底（30）在正面上用光致抗蚀剂层（14）构图，从而露出衬底的部分（18）。金属氧化物层（32）沉积在图案化的光致抗蚀剂层和衬底的露出部分上。然后将图案化的光致抗蚀剂层暴露于光化辐射（19）。去除光致抗蚀剂图案（20），携带沉积在光致抗蚀剂层上的金属氧化物层的那些部分，通过剥离技术形成电极图案（22）。

7. 发明授权

US5869899A High density interconnect substrate and method of manufacturing same 失效
标题翻译：高密度互连基板及其制造方法
公开(公告)号：US5869899A
公开(公告)日：1999-02-09
申请号：US78115
申请日：1998-05-13
申请人： John K. Arledge , Thomas J. Swirbel
发明人： John K. Arledge , Thomas J. Swirbel
IPC分类号： H01L21/48 , H05K3/40 , H05K3/46 , H01L23/48
CPC分类号： H05K3/4046 , H01L21/4846 , H01L21/4853 , H01L2924/0002 , H05K2201/0347 , H05K2201/10234 , H05K3/4644
摘要： A method of creating high density interlayer interconnects on circuit carrying substrates. A circuit pattern (20) is formed on one side of a substrate (10), and gold balls (30) are selectively placed on the circuit pattern using a thermosonic ball bonder. A liquid solution of a polymer is cast directly on the substrate and the etched circuit pattern such that only the upper portion of each gold ball is revealed when the liquid polymer solution is then dried and cured to form a dry film (40). A second layer of metal is then deposited directly on the dry film, such that it is electrically and mechanically connected to the exposed top of the gold balls. A second circuit pattern (50) is then formed in the second layer of metal. The resulting high density interconnect has two circuit layers separated by a dielectric layer. Each circuit layer is connected to the other by the gold balls that serve as conductive vias.
摘要翻译：一种在电路承载衬底上产生高密度层间互连的方法。电路图案（20）形成在基板（10）的一侧上，并且使用热球球接合器将金球（30）选择性地放置在电路图案上。将聚合物的液体溶液直接浇铸在基材和蚀刻电路图案上，使得仅当液体聚合物溶液干燥和固化以形成干膜（40）时，才会露出每个金球的上部。然后将第二层金属直接沉积在干膜上，使得其与金球的暴露的顶部电气和机械连接。然后在第二金属层中形成第二电路图案（50）。所得到的高密度互连具有由介电层隔开的两个电路层。每个电路层通过用作导电通孔的金球彼此连接。

8. 发明授权

US5576052A Method of metallizing high aspect ratio apertures 失效
标题翻译：金属化高纵横比孔径的方法
公开(公告)号：US5576052A
公开(公告)日：1996-11-19
申请号：US635822
申请日：1996-04-22
申请人： John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： C23C18/16 , C23C28/02 , H05K3/40 , H05K3/42 , B05D5/12
CPC分类号： H05K3/4076 , C23C18/165 , C23C18/405 , C23C28/023 , H05K3/422 , C23C18/1603 , C23C18/1653 , C23C18/1689 , H05K3/427
摘要： A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.
摘要翻译：一种在电路承载衬底中制造高纵横比电镀通孔的方法。在衬底（10）中形成高纵横比孔或孔（16）。将铜（20）的薄膜溅射到基板上和孔中，在孔壁的一部分上形成宏观不连续的铜膜（26）。宏观不连续的铜膜比沉积在表面上的铜膜薄得多。催化铜涂层（30）通过化学镀铜直接镀在真空沉积的铜薄膜上，以足以在孔壁上形成宏观连续的铜层。

9. 发明授权

US5529863A Method for fabricating LCD substrates having solderable die attach pads 失效
标题翻译：一种用于制造具有可焊接管芯附接焊盘的LCD基板的方法
公开(公告)号：US5529863A
公开(公告)日：1996-06-25
申请号：US503141
申请日：1995-07-17
申请人： Thomas J. Swirbel , John K. Arledge
发明人： Thomas J. Swirbel , John K. Arledge
IPC分类号： G02F1/13 , G02F1/1345 , C09K19/00
CPC分类号： G02F1/13452 , G02F1/1345
摘要： A method for fabricating solderable pads (106) onto a glass substrate (101) includes the step of depositing a seed metallization layer (step 406) after the polyimide layer is cured (step 404) but prior to buffing the alignment layer (step 414). The seed metallization layer can done by, for example, sputter depositing indium-tin, tin or copper.
摘要翻译：用于在玻璃基板（101）上制造可焊接焊盘（106）的方法包括在聚酰亚胺层固化（步骤404）之后但在抛光对准层之前沉积种子金属化层（步骤406）的步骤（步骤414）。种子金属化层可以通过例如溅射沉积铟锡，锡或铜来完成。

10. 发明授权

US5436744A Flexible liquid crystal display with integrated driver circuit and display electrodes formed on opposite sides of folded substrate 失效
标题翻译：具有集成驱动电路的柔性液晶显示器和形成在折叠基板的相对侧上的显示电极
公开(公告)号：US5436744A
公开(公告)日：1995-07-25
申请号：US115625
申请日：1993-09-03
申请人： John K. Arledge , Thomas J. Swirbel
发明人： John K. Arledge , Thomas J. Swirbel
IPC分类号： G02F1/13 , G02F1/1333 , G02F1/1345
CPC分类号： G02F1/13452
摘要： A liquid crystal display (LCD) package (10) is made by creating an indium/tin oxide electrode (64) on the surface of a flexible substrate (60). The electrode is connected to conductive vias (68) in the flexible substrate by conductive runners (66) that are also indium/tin oxide with an overlayer of copper. The indium/tin oxide is typically sputtered, and the copper is sputtered or plated on selected portions of the runners. The conductive vias are further connected to a circuitry pattern (62) on an opposite side of the flexible substrate. A display driver (70) is attached to the circuitry pattern to drive the LCD (5). A second substrate (80), also with a film electrode (82) on it, is arranged in mutually opposing planar relationship to the flexible substrate in order to form a liquid crystal display. A liquid crystal material (86) is then filled in the gap between the two substrates creating an LCD module (10). The LCD module can be folded about a portion (72) of the flexible substrate so that the display driver circuit is directly underneath the film electrode. An adhesive bonding agent (77) is used to retain the flexible substrate in the folded position.
摘要翻译：通过在柔性基板（60）的表面上形成铟/锡氧化物电极（64）制成液晶显示器（LCD）封装（10）。电极通过也是具有铜覆盖层的铟/锡氧化物的导电流道（66）连接到柔性基板中的导电通孔（68）。铟/锡氧化物通常被溅射，并且铜被溅射或镀在选定的流道部分上。导电通孔进一步连接到柔性基板的相对侧上的电路图案（62）。显示驱动器（70）附接到电路图案以驱动LCD（5）。为了形成液晶显示器，与柔性基板相对的平面关系，配置有与其上的膜电极（82）相对的第二基板（80）。然后将液晶材料（86）填充在两个基板之间的间隙中，形成LCD模块（10）。 LCD模块可围绕柔性基板的一部分（72）折叠，使得显示驱动电路直接位于薄膜电极下方。使用粘合剂（77）将柔性基材保持在折叠位置。

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