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    • 2. 发明授权
    • Microaccelerometer having low stress bonds and means for preventing
excessive Z-axis deflection
    • 具有低应力结合的微加速器和用于防止过大的Z轴偏转的装置
    • US5284057A
    • 1994-02-08
    • US976100
    • 1992-11-13
    • Steven E. StallerDavid W. De Roo
    • Steven E. StallerDavid W. De Roo
    • G01P15/12G01P15/08
    • G01P15/0802G01P2015/084Y10S73/01
    • A microaccelerometer is provided which has a silicon substrate bonded to a silicon capping plate and silicon back plate, wherein the bonds between the three silicon wafers are characterized by a relatively low residual stress level over a wide temperature range. The bonds are formed by means of an appropriate adhesive at a relatively low temperature without degradation to the microaccelerometer. The bonds between the silicon wafers also provide stress relief during use and packaging of the microaccelerometer. With this invention, the damping distance for the proof mass of the microaccelerometer is accurately controllable and stop means are provided for preventing excessive deflection of the proof mass in a direction perpendicular to the plane of the microaccelerometer.
    • 提供了一种微加速度计,其具有结合到硅封盖板和硅背板的硅衬底,其中三个硅晶片之间的结合的特征在于在宽的温度范围内具有相对较低的残余应力水平。 这些键在相对较低的温度下通过适当的粘合剂形成,而不会降解到微加速度计。 硅晶片之间的结合也在微加速度计的使用和封装期间提供应力消除。 利用本发明,微加速度计的检验质量块的阻尼距离是可以精确控制的,并且提供停止装置以防止证明物质在垂直于微加速度计平面的方向上的过度偏转。