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1. 发明授权

US07122872B2 Control of stress in metal films by controlling the atmosphere during film deposition 有权
标题翻译：通过控制膜沉积过程中的气氛来控制金属膜中的应力
公开(公告)号：US07122872B2
公开(公告)日：2006-10-17
申请号：US10441458
申请日：2003-05-20
申请人： James F. Bailey , Ho Bun Chan , Louis T. Gomez , Martin Haueis
发明人： James F. Bailey , Ho Bun Chan , Louis T. Gomez , Martin Haueis
IPC分类号： H01L21/14
CPC分类号： B81B3/0072 , B81C2201/017 , H01L21/2855
摘要： Materials such as titanium are vapor-deposited in the presence of, e.g., oxygen to form a film on a substrate, such as to provide an adhesion layer between a silicon movable structure in an optical MEMS device and a gold layer serving as a reflecting surface. The resulting film contains titanium and oxygen. Varying the conditions under which the film is deposited varies the intrinsic stress of the film, which varies the change in substrate shape caused by the presence of the film. A film having a desired intrinsic stress may be obtained by control of the oxygen partial pressure when the film is deposited. In one embodiment, the oxygen partial pressure in the atmosphere present during titanium deposition is greater than about 2×10−7 Torr, and preferably between about 1×10−6 Torr and about 2×10−6 Torr.
摘要翻译：诸如钛的材料在例如氧的存在下气相沉积以在衬底上形成膜，以便在光学MEMS器件中的硅可移动结构和用作反射表面的金层之间提供粘附层。所得膜含有钛和氧。改变沉积膜的条件改变膜的固有应力，这改变了由于膜的存在引起的衬底形状的变化。具有期望的固有应力的膜可以通过控制膜沉积时的氧分压来获得。在一个实施例中，在钛沉积期间存在的气氛中的氧分压大于约2×10 -7乇，优选约1×10 -6乇至约2×10乇， SUP> -6 Torr。

2. 发明授权

US06611001B2 Laser package 失效
公开(公告)号：US06611001B2
公开(公告)日：2003-08-26
申请号：US09777934
申请日：2001-02-06
申请人： Mark Anthony Cappuzzo , John Van Atta Gates, II , Louis T. Gomez , Gerard Edmond Henein , Isaac Ryazansky , Joseph Shmulovich
发明人： Mark Anthony Cappuzzo , John Van Atta Gates, II , Louis T. Gomez , Gerard Edmond Henein , Isaac Ryazansky , Joseph Shmulovich
IPC分类号： H01L3300
CPC分类号： H01S5/02276 , H01L2224/48091 , H01S5/02216 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01L2924/00014
摘要： A compact laser package having a submount with a plurality of electrical contact pads and a plurality of electrical connection lines formed thereon. The submount may be configured to receive at least one optical component thereon, the at least one optical component being in electrical communication with at least one of the plurality of electrical connection lines. A lid is provided, the lid having a recessed portion and a groove formed therein, the recessed portion being positioned in an interior of the lid and the groove being positioned to intersect the recessed portion and a peripheral edge of the lid. The submount is generally configured to cooperatively engage the lid to form a hermetically sealed laser package.

3. 发明授权

US06366730B1 Tunable optical waveguides 有权
标题翻译：可调光波导
公开(公告)号：US06366730B1
公开(公告)日：2002-04-02
申请号：US09542096
申请日：2000-04-03
申请人： Mark Anthony Cappuzzo , Christopher Richard Doerr , John VanAtta Gates , Louis T. Gomez , Dirk Joachim Muehlner
发明人： Mark Anthony Cappuzzo , Christopher Richard Doerr , John VanAtta Gates , Louis T. Gomez , Dirk Joachim Muehlner
IPC分类号： G02B610
CPC分类号： G02F1/011 , G02B2006/12069 , G02B2006/12147 , G02F1/0147 , G02F2001/0113
摘要： The specification describes thermo-optically controlled waveguides where the thermo-optic control is a heater strip precisely aligned to the waveguide core by using the heater strip as an etch mask to define at least part of the core/upper cladding structure. In one embodiment the heater strip mask is larger than the underlying waveguide core so as to produce, on etching, a core surrounded with a minimum of cladding material on the sidewalls of the core, and a confined heat channel between the waveguide core and the heater strip. In a second embodiment the heater strip is used as an etch mask to define a core cladding stack, and a third cladding layer is deposited to clad the sidewalls of the core. In this embodiment, the cladding material in the stack can be optimized for thermal conductivity, and the third cladding material can be optimized for thermo-optic sensitivity.
摘要翻译：本说明书描述了热光控制波导，其中热光控制是通过使用加热条作为蚀刻掩模来精确对准波导芯的加热带，以限定芯/上包层结构的至少一部分。在一个实施例中，加热器带掩模大于下面的波导芯，以便在蚀刻时产生用芯的侧壁上的最小包层材料包围的芯，以及在波导芯和加热器之间的限定的热通道跳闸。在第二实施例中，加热条用作蚀刻掩模以限定芯包层叠层，并且沉积第三覆层以包覆芯的侧壁。在该实施例中，堆叠中的包层材料可以优化用于热导率，并且第三包层材料可以被优化用于热光敏感性。

4. 发明授权

US06225191B1 Process for the manufacture of optical integrated circuits 失效
标题翻译：光集成电路制造工艺
公开(公告)号：US06225191B1
公开(公告)日：2001-05-01
申请号：US08635252
申请日：1996-04-12
申请人： Louis Nelson Ahlquist , Mark Anthony Cappuzzo , Louis T. Gomez , Joseph Shmulovich , Judith Martin Szalkowski
发明人： Louis Nelson Ahlquist , Mark Anthony Cappuzzo , Louis T. Gomez , Joseph Shmulovich , Judith Martin Szalkowski
IPC分类号： H01L2146
CPC分类号： H01L21/02076 , G02B6/13 , H01L21/6836 , H01L21/78 , H01L2221/68327 , Y10S438/906
摘要： The specification describes wafer fabrication cleaning processes for silicon optical bench technology. The cleaning processes are designed to remove debris in situ after dicing silicon wafers mounted on a tape carrier. They were also developed specifically to avoid staining and residues that often result from using standard dicing approaches in silicon optical bench integrated circuit manufacture.
摘要翻译：该规范描述了硅光学平台技术的晶圆制造清洗工艺。清洁过程被设计为在切割安装在带载体上的硅晶片之后原位去除碎屑。它们也被专门开发，以避免在硅光学台式集成电路制造中使用标准切割方法常常产生的染色和残留物。

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