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    • 3. 发明申请
    • NVM cell on SOI and method of manufacture
    • NVM单元在SOI及其制造方法
    • US20060186456A1
    • 2006-08-24
    • US11060996
    • 2005-02-18
    • James BurnettRamachandran Muralidhar
    • James BurnettRamachandran Muralidhar
    • H01L29/788
    • G11C16/0416H01L21/26586H01L27/115H01L27/11521H01L29/1083H01L29/7881
    • A non-volatile memory (NVM) device formed in a semiconductor-on-insulator (SOI) substrate has a trap region on the source side only to speed up the process of programming. During programming of an NVM device in partially depleted SOI, holes are generated that slow down the formation of electrons hot enough to jump to the storage layer of the NVM. To reduce this effect, the trap region is formed below the lightly-doped portion of the source region and preferably extends to an area under the gate on the source side. This can be achieved using an angled implant of a neutral impurity, such as xenon, argon, or germanium, while masking the drain side. The trap region thus extends under the gate on the source side to recombine with holes that are generated during programming. The trap region also extends to contact the source.
    • 形成在绝缘体上半导体(SOI))衬底中的非易失性存储器(NVM)器件在源极上具有陷阱区域,仅用于加速编程过程。 在部分耗尽的SOI中的NVM器件的编程期间,产生空穴,其减慢热到足以跳到NVM的存储层的电子的形成。 为了减小这种影响,陷波区域形成在源极区域的轻掺杂部分下方,优选地延伸到源极侧的栅极下方的区域。 这可以使用中性杂质(例如氙,氩或锗)的倾斜注入来实现,同时掩蔽漏极侧。 陷阱区域因此在源极侧的栅极下方与编程期间产生的孔重新组合。 陷阱区域也延伸以接触源。
    • 4. 发明申请
    • Methods for programming a floating body nonvolatile memory
    • 用于编程浮体非易失性存储器的方法
    • US20060186457A1
    • 2006-08-24
    • US11061005
    • 2005-02-18
    • James BurnettRamachandran Muralidhar
    • James BurnettRamachandran Muralidhar
    • H01L29/788
    • H01L21/26586H01L27/115H01L27/11521H01L29/1083H01L29/7881
    • A technique to speed up the programming of a non-volatile memory device that has a floating body actively removes holes from the floating body that have accumulated after performing hot carrier injection (HCI). The steps of HCI and active hole removal can be alternated until the programming is complete. The active hole removal is faster than passively allowing holes to be removed, which can take milliseconds. The active hole removal can be achieved by reducing the drain voltage to a negative voltage and reducing the gate voltage as well. This results in directly withdrawing the holes from the floating body to the drain. Alternatively, reducing the drain voltage while maintaining current flow stops impact ionization while sub channel current collects the holes. Further alternatively, applying a negative gate voltage causes electrons generated by band to band tunneling and impact ionization near the drain to recombine with holes.
    • 一种用于加速具有浮体的非易失性存储装置的编程的技术主动地从执行热载流子注入(HCI)之后累积的浮体中去除空穴。 HCI和有源孔去除的步骤可以交替,直到编程完成。 有源孔移除比被动地更快地允许孔被去除,这可能需要几毫秒。 有源孔去除可以通过将漏极电压降低到负电压并降低栅极电压来实现。 这导致从浮体直接排出孔到排水管。 或者,在保持电流的同时降低漏极电压停止冲击电离,而子通道电流收集孔。 或者,施加负栅极电压使得通过带状隧穿产生的电子和靠近漏极的冲击电离与空穴重新组合。