会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • OPC trimming for performance
    • OPC修剪性能
    • US07627836B2
    • 2009-12-01
    • US11164044
    • 2005-11-08
    • James A. CulpLars W. LiebmannRajeev MalikK. Paul MullerShreesh NarasimhaStephen L. RunyonPatrick M. Williams
    • James A. CulpLars W. LiebmannRajeev MalikK. Paul MullerShreesh NarasimhaStephen L. RunyonPatrick M. Williams
    • G06F17/50
    • G06F17/5068
    • An iterative timing analysis is analytically performed before a chip is fabricated, based on a methodology using optical proximity correction techniques for shortening the gate lengths and adjusting metal line widths and proximity distances of critical time sensitive devices. The additional mask is used as a selective trim to form shortened gate lengths or wider metal lines for the selected, predetermined transistors, affecting the threshold voltages and the RC time constants of the selected devices. Marker shapes identify a predetermined subgroup of circuitry that constitutes the devices in the critical timing path. The analysis methodology is repeated as often as needed to improve the timing of the circuit with shortened designed gate lengths and modified RC timing constants until manufacturing limits are reached. A mask is made for the selected critical devices using OPC techniques.
    • 基于使用光学邻近校正技术的方法,在芯片制造之前分析地执行迭代时序分析,以缩短栅极长度并调整关键时间敏感器件的金属线宽度和接近距离。 附加掩模用作选择性修整以形成用于所选择的预定晶体管的缩短的栅极长度或更宽的金属线,影响所选器件的阈值电压和RC时间常数。 标记形状识别构成关键定时路径中的装置的电路的预定子组。 根据需要经常重复分析方法,以在缩短设计的栅极长度和修改的RC定时常数的情况下改善电路的时序,直到达到制造限值。 使用OPC技术为所选的关键设备制作掩码。
    • 4. 发明授权
    • Automated sensitivity definition and calibration for design for manufacturing tools
    • 自动灵敏度定义和校准用于制造工具的设计
    • US08141027B2
    • 2012-03-20
    • US12652409
    • 2010-01-05
    • James A. CulpJason D. HibbelerLars W. LiebmannTina Wagner
    • James A. CulpJason D. HibbelerLars W. LiebmannTina Wagner
    • G06F17/50
    • G06F17/5081G06F2217/12Y02P90/265
    • A method of automatic calibration of a design for manufacturing (DfM) simulation tool includes providing, as a first input, one or more defined rules for each of one or more semiconductor device levels to be simulated by the tool, and providing, as a second input, a plurality of defined feature size threshold ranges and increments for use in histogram generation of a number of failures with respect to a reference circuit; providing, as a third input, the reference circuit; executing the defined rules for the semiconductor device levels to be simulated, and outputting a fail count for the reference circuit at each defined threshold value, thereby generating histogram data of fail count versus threshold for the reference circuit; and providing, as a fourth input, a defined fail count metric, thereby calibrating the DfM tool for use with respect to a target circuit.
    • 一种用于制造设计(DfM)模拟工具的自动校准的方法包括为由工具模拟的一个或多个半导体器件级别中的每一个提供一个或多个限定规则作为第一输入,并且作为第二输入提供第二 输入,多个定义的特征尺寸阈值范围和增量,用于相对于参考电路的多个故障的直方图生成; 提供参考电路作为第三输入; 执行要被模拟的半导体器件电平的限定规则,并在每个定义的阈值处输出参考电路的故障计数,由此产生参考电路的故障计数与阈值的直方图数据; 并且作为第四输入提供定义的故障计数度量,从而校准用于目标电路的DfM工具。
    • 8. 发明授权
    • Electrically driven optical proximity correction
    • 电驱动光学邻近校正
    • US07865864B2
    • 2011-01-04
    • US12024188
    • 2008-02-01
    • Shayak BanerjeeJames A. CulpPraveen ElakkumananLars W. Liebmann
    • Shayak BanerjeeJames A. CulpPraveen ElakkumananLars W. Liebmann
    • G06F17/50
    • G06F17/5081G03F1/36
    • An approach that provides electrically driven optical proximity correction is described. In one embodiment, there is a method for performing an electrically driven optical proximity correction. In this embodiment, an integrated circuit mask layout representative of a plurality of layered shapes each defined by features and edges is received. A lithography simulation is run on the mask layout. An electrical characteristic is extracted from the output of the lithography simulation for each layer of the mask layout. A determination as to whether the extracted electrical characteristic is in conformance with a target electrical characteristic is made. Edges of the plurality of layered shapes in the mask layout are adjusted in response to determining that the extracted electrical characteristic for a layer in the mask layout fails to conform with the target electrical characteristic.
    • 描述了提供电驱动光学邻近校正的方法。 在一个实施例中,存在执行电驱动光学邻近校正的方法。 在本实施例中,接收表示由特征和边缘定义的多个分层形状的集成电路掩模布局。 在掩模布局上运行光刻仿真。 从掩模布局的每层的光刻模拟的输出中提取电特性。 确定提取的电特性是否与目标电特性一致。 响应于确定提取的掩模布局中的层的电特性不符合目标电特性,调整掩模布局中的多个分层形状的边缘。
    • 9. 发明申请
    • ELECTRICALLY DRIVEN OPTICAL PROXIMITY CORRECTION
    • 电动驱动光学临近校正
    • US20090199151A1
    • 2009-08-06
    • US12024188
    • 2008-02-01
    • Shayak BanerjeeJames A. CulpPraveen ElakkumananLars W. Liebmann
    • Shayak BanerjeeJames A. CulpPraveen ElakkumananLars W. Liebmann
    • G06F17/50
    • G06F17/5081G03F1/36
    • An approach that provides electrically driven optical proximity correction is described. In one embodiment, there is a method for performing an electrically driven optical proximity correction. In this embodiment, an integrated circuit mask layout representative of a plurality of layered shapes each defined by features and edges is received. A lithography simulation is run on the mask layout. An electrical characteristic is extracted from the output of the lithography simulation for each layer of the mask layout. A determination as to whether the extracted electrical characteristic is in conformance with a target electrical characteristic is made. Edges of the plurality of layered shapes in the mask layout are adjusted in response to determining that the extracted electrical characteristic for a layer in the mask layout fails to conform with the target electrical characteristic.
    • 描述了提供电驱动光学邻近校正的方法。 在一个实施例中,存在执行电驱动光学邻近校正的方法。 在本实施例中,接收表示由特征和边缘定义的多个分层形状的集成电路掩模布局。 在掩模布局上运行光刻仿真。 从掩模布局的每层的光刻模拟的输出中提取电特性。 确定提取的电特性是否与目标电特性一致。 响应于确定提取的掩模布局中的层的电特性不符合目标电特性,调整掩模布局中的多个分层形状的边缘。