专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120139066A1 MEMS MICROPHONE 审中-公开
标题翻译： MEMS麦克风
公开(公告)号：US20120139066A1
公开(公告)日：2012-06-07
申请号：US13252733
申请日：2011-10-04
申请人： Chang Han JE , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
发明人： Chang Han JE , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
IPC分类号： H01L29/84
CPC分类号： H04R19/005 , H04R1/222 , H04R19/04 , H04R31/00
摘要： Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode.
摘要翻译：公开了一种微机电系统（MEMS）麦克风，包括：基板; 通过处理衬底形成的声学室; 形成在所述声室上并固定到所述基板的下电极; 隔膜，形成在所述下电极上，以与所述下电极隔开预定间隔; 以及形成在隔膜的中心部分处的隔膜排出孔。根据本公开的示例性实施例，可以有效地减少由MEMS麦克风中的隔膜和下电极之间的空气层产生的衰减，从而使得可以获得高灵敏度特性并减少所需的时间和成本去除隔膜和下电极之间的牺牲层。

2. 发明申请

US20120098076A1 ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：声学传感器及其制造方法
公开(公告)号：US20120098076A1
公开(公告)日：2012-04-26
申请号：US13012489
申请日：2011-01-24
申请人： Jaewoo LEE , Chang Han Je , Woo Seok Yang , Jongdae Kim
发明人： Jaewoo LEE , Chang Han Je , Woo Seok Yang , Jongdae Kim
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： H04R31/00 , H04R19/005 , H04R19/02
摘要： Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.
摘要翻译：提供了一种声学传感器。声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

3. 发明申请

US20130094675A1 MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译： MEMS麦克风及其制造方法
公开(公告)号：US20130094675A1
公开(公告)日：2013-04-18
申请号：US13601896
申请日：2012-08-31
申请人： Chang Han Je , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
发明人： Chang Han Je , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
IPC分类号： H04R1/00 , H04R31/00
CPC分类号： H04R1/00 , B81B3/007 , B81B2201/0257 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
摘要： Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.
摘要翻译：公开了一种MEMS麦克风及其制造方法。 MEMS麦克风包括：基板; 形成在所述基板的前表面内的后声室; 形成在所述基板上并具有排气孔的振动板; 形成在振动板上的固定电极; 以及由后声室的底部支撑并通过排气孔连接到固定电极的固定电极支撑件。

4. 发明授权

US08415717B2 Acoustic sensor 有权
标题翻译：声传感器
公开(公告)号：US08415717B2
公开(公告)日：2013-04-09
申请号：US13012489
申请日：2011-01-24
申请人： Jaewoo Lee , Chang Han Je , Woo Seok Yang , Jongdae Kim
发明人： Jaewoo Lee , Chang Han Je , Woo Seok Yang , Jongdae Kim
IPC分类号： H01L29/84
CPC分类号： H04R31/00 , H04R19/005 , H04R19/02
摘要： Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.
摘要翻译：提供了一种声学传感器。声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

5. 发明授权

US08705777B2 MEMS microphone and method of manufacturing the same 失效
标题翻译： MEMS麦克风及其制造方法相同
公开(公告)号：US08705777B2
公开(公告)日：2014-04-22
申请号：US13601896
申请日：2012-08-31
申请人： Chang Han Je , Jae Woo Lee , Woo Seok Yang , Jong Dae Kim
发明人： Chang Han Je , Jae Woo Lee , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R1/00 , H04R31/00
CPC分类号： H04R1/00 , B81B3/007 , B81B2201/0257 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
摘要： Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.
摘要翻译：公开了一种MEMS麦克风及其制造方法。 MEMS麦克风包括：基板; 形成在所述基板的前表面内的后声室; 形成在所述基板上并具有排气孔的振动板; 形成在振动板上的固定电极; 以及由后声室的底部支撑并通过排气孔连接到固定电极的固定电极支撑件。

6. 发明申请

US20130100779A1 ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF 有权
标题翻译：声学传感器及其制造方法
公开(公告)号：US20130100779A1
公开(公告)日：2013-04-25
申请号：US13557108
申请日：2012-07-24
申请人： Jae Woo LEE , Chang Han Je , Woo Seok Yang , Jong Dae Kim
发明人： Jae Woo LEE , Chang Han Je , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R17/00 , H04R31/00
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R19/04 , H04R31/00 , Y10T29/49005 , H01L2924/00014
摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.
摘要翻译：根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

7. 发明授权

US09066184B2 Acoustic sensor and fabrication method thereof 有权
标题翻译：声传感器及其制造方法
公开(公告)号：US09066184B2
公开(公告)日：2015-06-23
申请号：US13557108
申请日：2012-07-24
申请人： Jae Woo Lee , Chang Han Je , Woo Seok Yang , Jong Dae Kim
发明人： Jae Woo Lee , Chang Han Je , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R31/00 , H04R19/00 , H04R19/04
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R19/04 , H04R31/00 , Y10T29/49005 , H01L2924/00014
摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.
摘要翻译：根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

8. 发明申请

US20120148073A1 PIEZOELECTRIC SPEAKER 有权
标题翻译：压电扬声器
公开(公告)号：US20120148073A1
公开(公告)日：2012-06-14
申请号：US13289225
申请日：2011-11-04
申请人： Hye-Jin KIM , Woo Seok Yang , Jongdae Kim
发明人： Hye-Jin KIM , Woo Seok Yang , Jongdae Kim
IPC分类号： H04R17/00
CPC分类号： H04R17/005 , H04R2201/003 , H04R2307/025 , H04R2499/15
摘要： Disclosed is a piezoelectric speaker including: a piezoelectric layer that converts electrical signals into oscillation and outputs sound; an electrode that is formed on a top or a bottom of the piezoelectric layer to apply the electrical signals to the piezoelectric layer; an acoustic diaphragm that is made of a hetero material including a first acoustic diaphragm and a second acoustic diaphragm and is attached to the bottom of the piezoelectric layer on which the electrode is formed; and a frame attached in a form enclosing a side of the acoustic diaphragm.
摘要翻译：公开了一种压电扬声器，包括：将电信号转换为振荡并输出声音的压电层; 形成在压电层的顶部或底部上以将电信号施加到压电层的电极; 由包括第一声膜和第二声膜的异质材料制成并且附着在其上形成有电极的压电层的底部的声膜; 以及以包围隔膜的一侧的形式附接的框架。

9. 发明授权

US09077287B2 Sound detecting circuit and amplifier circuit thereof 有权
标题翻译：声音检测电路及其放大电路
公开(公告)号：US09077287B2
公开(公告)日：2015-07-07
申请号：US13531437
申请日：2012-06-22
申请人： Yi-Gyeong Kim , Min-Hyung Cho , Tae Moon Roh , Jong-Kee Kwon , Woo Seok Yang , Jongdae Kim
发明人： Yi-Gyeong Kim , Min-Hyung Cho , Tae Moon Roh , Jong-Kee Kwon , Woo Seok Yang , Jongdae Kim
IPC分类号： H03F99/00 , H03F3/08
CPC分类号： H03F3/08
摘要： Disclosed is a sound detecting circuit which includes a sensing unit configured to generate an AC signal in response to a sound pressure level of a sound signal; an amplification unit configured to amplify the AC signal; and a bias voltage generating unit configured to generate a bias voltage to be provided to the amplification unit. The bias voltage generating unit comprises a current source configured to provide a power current; and a current-voltage converting circuit configured to convert the power current into the bias voltage and to reduce a noise due to the power current.
摘要翻译：公开了一种声音检测电路，其包括：感测单元，被配置为响应于声音信号的声压级产生AC信号; 放大单元，被配置为放大AC信号; 以及偏置电压产生单元，被配置为产生要提供给所述放大单元的偏置电压。偏置电压产生单元包括被配置为提供功率电流的电流源; 以及电流电压转换电路，被配置为将功率电流转换成偏置电压并且减少由于功率电流引起的噪声。

10. 发明授权

US09068896B2 Process independent temperature sensor based on oscillator 有权
标题翻译：基于振荡器的独立温度传感器
公开(公告)号：US09068896B2
公开(公告)日：2015-06-30
申请号：US13620594
申请日：2012-09-14
申请人： Seok Ju Yun , Young-deuk Jeon , Tae Moon Roh , Jong-Kee Kwon , Woo Seok Yang , Jongdae Kim
发明人： Seok Ju Yun , Young-deuk Jeon , Tae Moon Roh , Jong-Kee Kwon , Woo Seok Yang , Jongdae Kim
IPC分类号： G01K11/00 , G01K7/32
CPC分类号： G01K7/32
摘要： The inventive concept discloses a new temperature sensor structure based on oscillator which is insensitive to a process change and improves an error rate of temperature output. The temperature sensor based on oscillator compares an oscillator circuit structure insensitive to a temperature change with an oscillator circuit structure having a frequency change in proportion to a temperature change to output a relative difference between the two oscillator circuit structures and thereby it is compensated itself. In the temperature sensor based on oscillator, a problem of performance reduction due to an external environment and a process deviation of temperature sensor is improved and an output distortion and temperature nonlinearity are effectively improved. Thus, since the temperature sensor based on oscillator has a structure of high performance, low power and low cost, it can be variously used in a detection equipment of temperature environment.
摘要翻译：本发明的概念公开了一种基于振荡器的新型温度传感器结构，其对过程变化不敏感并且提高了温度输出的误差率。基于振荡器的温度传感器将对温度变化不敏感的振荡器电路结构与具有与温度变化成比例的频率变化的振荡器电路结构进行比较，以输出两个振荡器电路结构之间的相对差，由此自身进行补偿。在基于振荡器的温度传感器中，提高了由于外部环境导致的性能降低和温度传感器的工艺偏差的问题，并且有效地提高了输出失真和温度非线性。因此，由于基于振荡器的温度传感器具有高性能，低功率和低成本的结构，因此可以被多种用于温度环境的检测设备中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式