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    • 7. 发明申请
    • Light emitting device unit for AC voltage
    • 用于交流电压的发光装置单元
    • US20070217210A1
    • 2007-09-20
    • US11655830
    • 2007-01-22
    • Jae-wook JeongHyung-kun KimJae-hee ChoYu-sik Kim
    • Jae-wook JeongHyung-kun KimJae-hee ChoYu-sik Kim
    • B60Q1/06
    • H05B33/0821F21K9/00Y02B20/348
    • A light emitting diode unit for AC voltage is provided. The light emitting diode unit includes a sub-mount on which electric wires are formed; a first light emitting diode array in which a plurality of first light emitting diodes are serially connected to the sub-mount; and a second light emitting diode array, in which a plurality of second light emitting diodes are connected to the sub-mount as bridge circuits, connecting to the first light emitting diode array. Therefore, rectification can be performed through the bridge circuit without an additional rectifying device by connecting the light emitting diodes to the bridge circuit in series, and thus the structure of the unit can be simplified and a size of the light emitting diode unit can be reduced.
    • 提供了用于交流电压的发光二极管单元。 发光二极管单元包括其上形成电线的子座; 第一发光二极管阵列,其中多个第一发光二极管串联连接到所述副安装座; 以及第二发光二极管阵列,其中多个第二发光二极管连接到作为桥接电路的子座,连接到第一发光二极管阵列。 因此,通过将发光二极管串联连接到桥式电路,可以通过桥式电路进行整流,而不需要额外的整流装置,因此可以简化单元的结构,并且可以减小发光二极管单元的尺寸 。
    • 8. 发明申请
    • Led module and method of manufacturing the same
    • LED模块及其制造方法
    • US20090278154A1
    • 2009-11-12
    • US12458581
    • 2009-07-16
    • Hyung-kun KimJae-hee ChoYu-sik Kim
    • Hyung-kun KimJae-hee ChoYu-sik Kim
    • H01L33/00
    • H01L33/508H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
    • Provided are a light emitting diode (LED) module and a method of manufacturing the same. The LED module may include a package housing including an inner space, a light-emitting chip in the inner space of the package housing, a phosphor layer including a fluorescent material and converting light emitted from the light-emitting chip to light having a longer wavelength than that of the light emitted from the light-emitting chip. The concentration of the fluorescent material of the phosphor layer may be inhomogeneous. The method of manufacturing the LED module may include providing or forming a package housing having an inner space and including a light-emitting chip in the inner space, measuring a radiation pattern of light emitted from the light-emitting chip, and forming a phosphor layer including a fluorescent material on the light-emitting chip and having characteristics that may be determined according to the radiation pattern.
    • 提供了一种发光二极管(LED)模块及其制造方法。 LED模块可以包括包括内部空间的封装壳体,在封装壳体的内部空间中的发光芯片,包括荧光材料的荧光体层,将从发光芯片发射的光转换成具有较长波长的光 比从发光芯片发出的光的强度高。 荧光体层的荧光材料的浓度可能不均匀。 制造LED模块的方法可以包括提供或形成具有内部空间并且在内部空间中包括发光芯片的封装壳体,测量从发光芯片发射的光的辐射图案,以及形成荧光体层 包括在发光芯片上的荧光材料,并且具有可以根据辐射图案确定的特性。
    • 9. 发明申请
    • LED module and method of manufacturing the same
    • LED模块及其制造方法
    • US20080029778A1
    • 2008-02-07
    • US11806906
    • 2007-06-05
    • Hyung-kun KimJae-hee ChoYu-sik Kim
    • Hyung-kun KimJae-hee ChoYu-sik Kim
    • H01L33/00H01L21/00
    • H01L33/508H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
    • Provided are a light emitting diode (LED) module and a method of manufacturing the same. The LED module may include a package housing including an inner space, a light-emitting chip in the inner space of the package housing, a phosphor layer including a fluorescent material and converting light emitted from the light-emitting chip to light having a longer wavelength than that of the light emitted from the light-emitting chip. The concentration of the fluorescent material of the phosphor layer may be inhomogeneous. The method of manufacturing the LED module may include providing or forming a package housing having an inner space and including a light-emitting chip in the inner space, measuring a radiation pattern of light emitted from the light-emitting chip, and forming a phosphor layer including a fluorescent material on the light-emitting chip and having characteristics that may be determined according to the radiation pattern.
    • 提供了一种发光二极管(LED)模块及其制造方法。 LED模块可以包括包括内部空间的封装壳体,在封装壳体的内部空间中的发光芯片,包括荧光材料的荧光体层,将从发光芯片发射的光转换成具有较长波长的光 比从发光芯片发出的光的强度高。 荧光体层的荧光材料的浓度可能不均匀。 制造LED模块的方法可以包括提供或形成具有内部空间并且在内部空间中包括发光芯片的封装壳体,测量从发光芯片发射的光的辐射图案,以及形成荧光体层 包括在发光芯片上的荧光材料,并且具有可以根据辐射图案确定的特性。
    • 10. 发明授权
    • Method of manufacturing vertical light emitting device
    • 制造垂直发光装置的方法
    • US07888153B2
    • 2011-02-15
    • US12805132
    • 2010-07-14
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • H01L21/00
    • H01L33/0079H01L33/44
    • Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.
    • 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。