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    • 3. 发明申请
    • NON-VOLATILE MEMORY DEVICE
    • 非易失性存储器件
    • US20110084329A1
    • 2011-04-14
    • US12713736
    • 2010-02-26
    • Jang-hyun YOUJin-taek ParkYoung-woo ParkJung-dal Choi
    • Jang-hyun YOUJin-taek ParkYoung-woo ParkJung-dal Choi
    • H01L29/792
    • H01L29/792H01L27/11565H01L27/11573H01L29/4234
    • A non-volatile memory device includes a semiconductor layer including a cell region and a peripheral region, a cell region gate structure disposed in the cell region of the semiconductor layer, and wherein the cell region gate structure includes a tunneling insulating layer and a first blocking insulating layer, a second blocking insulating layer, and a third blocking insulating layer. The non-volatile memory device further includes a peripheral region gate structure formed in the peripheral region of the semiconductor layer. The peripheral region gate structure includes a first peripheral region insulating layer including a same material as a material included in the tunneling insulating layer and a second peripheral region insulating layer including a same material as a material included in the third blocking insulating layer.
    • 非易失性存储器件包括包括单元区域和外围区域的半导体层,设置在半导体层的单元区域中的单元区域栅极结构,并且其中单元区域栅极结构包括隧道绝缘层和第一阻挡层 绝缘层,第二阻挡绝缘层和第三阻挡绝缘层。 非易失性存储器件还包括形成在半导体层的周边区域中的外围区域栅极结构。 周边区域栅极结构包括:第一周边区域绝缘层,其包括与包含在隧道绝缘层中的材料相同的材料;以及第二周边区域绝缘层,其包括与包含在第三阻挡绝缘层中的材料相同的材料。
    • 4. 发明授权
    • Non-volatile memory device
    • 非易失性存储器件
    • US08169018B2
    • 2012-05-01
    • US12713736
    • 2010-02-26
    • Jang-hyun YouJin-taek ParkYoung-woo ParkJung-dal Choi
    • Jang-hyun YouJin-taek ParkYoung-woo ParkJung-dal Choi
    • H01L29/792
    • H01L29/792H01L27/11565H01L27/11573H01L29/4234
    • A non-volatile memory device includes a semiconductor layer including a cell region and a peripheral region, a cell region gate structure disposed in the cell region of the semiconductor layer, and wherein the cell region gate structure includes a tunneling insulating layer and a first blocking insulating layer, a second blocking insulating layer, and a third blocking insulating layer. The no-volatile memory device further includes a peripheral region gate structure formed in the peripheral region of the semiconductor layer. The peripheral region gate structure includes a first peripheral region insulating layer including a same material as a material included in the tunneling insulating layer and a second peripheral region insulating layer including a same material as a material included in the third blocking insulating layer.
    • 非易失性存储器件包括包括单元区域和外围区域的半导体层,设置在半导体层的单元区域中的单元区域栅极结构,并且其中单元区域栅极结构包括隧道绝缘层和第一阻挡层 绝缘层,第二阻挡绝缘层和第三阻挡绝缘层。 非易失性存储器件还包括形成在半导体层的周边区域中的外围区域栅极结构。 周边区域栅极结构包括:第一周边区域绝缘层,其包括与包含在隧道绝缘层中的材料相同的材料;以及第二周边区域绝缘层,其包括与包含在第三阻挡绝缘层中的材料相同的材料。
    • 7. 发明申请
    • Memory device and method of fabricating the same
    • 存储器件及其制造方法
    • US20100327371A1
    • 2010-12-30
    • US12805962
    • 2010-08-26
    • Chang-Hyun LeeJung-dal Choi
    • Chang-Hyun LeeJung-dal Choi
    • H01L27/088H01L21/8239
    • H01L27/115G11C16/0483H01L27/11521H01L27/11524H01L27/11568
    • A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
    • 一种非易失性存储器,包括串联的多个存储晶体管,其中在其间的源极/漏极和沟道区域是第一类型和选择晶体管,在多个存储晶体管的每个端部串联,其中每个选择的沟道区域 晶体管是第一类型。 第一种类型可以是n型或p型。 非易失性存储器还可以包括串联在选择晶体管之一和串联的多个存储晶体管之间的多个存储晶体管的一端的第一虚拟选择晶体管,以及多个存储晶体管的另一端的第二虚拟选择晶体管 串联在另一个选择晶体管和多个存储晶体管之间的存储晶体管。