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    • 1. 发明授权
    • Chemical vapor deposition method
    • 化学气相沉积法
    • US07410676B2
    • 2008-08-12
    • US11080237
    • 2005-03-14
    • Jae-Ho KimSang-Joon Park
    • Jae-Ho KimSang-Joon Park
    • H05H1/24
    • C23C16/45544C23C16/45514C23C16/45538C23C16/45565C23C16/4557C23C16/45574C23C16/515
    • A chemical vapor deposition method comprises steps of: a) injecting a source gas into a chamber so that the source gas is adsorbed on a substrate; b) injecting a purge gas into the chamber for a predetermined period of time so that the source gas remaining in the chamber is purged; c) injecting a reactant gas into a plasma generating portion, and generating plasma at the plasma generating portion by applying a first-level RF power source to a RF electrode plate so that radical of the reactant gas is adsorbed on the substrate; d) injecting a purge gas into the chamber for a predetermined period of time so that the reactant gas remaining in the chamber is purged; and e) applying a second-level RF power source to the plasma generating portion at the step a), b) and d) while the steps a) to d) are being repeated.
    • 一种化学气相沉积方法包括以下步骤:a)将源气体注入室中,使源气体吸附在基底上; b)将吹扫气体注入所述室中预定的时间段,以便清除残留在所述室中的源气体; c)将反应气体注入到等离子体产生部分中,并通过向RF电极板施加第一级RF电源而在等离子体产生部分产生等离子体,使得反应气体的自由基被吸附在基板上; d)将吹扫气体注入所述室中预定的时间,以便清除残留在所述室中的反应气体; 以及e)在重复步骤a)至d)的同时,在步骤a),b)和d)向等离子体产生部分施加二级RF电源。
    • 2. 发明申请
    • Chemical vapor deposition method
    • 化学气相沉积法
    • US20050217582A1
    • 2005-10-06
    • US11080237
    • 2005-03-14
    • Jae-Ho KimSang-Joon Park
    • Jae-Ho KimSang-Joon Park
    • C23C16/455C23C16/44C23C16/515H01L21/205C23C16/00
    • C23C16/45544C23C16/45514C23C16/45538C23C16/45565C23C16/4557C23C16/45574C23C16/515
    • The present invention relates to chemical vapor deposition apparatus. In the chemical vapor deposition apparatus, an RF power source connection portion connected to an external RF power source is installed on an upper side of a chamber; an RF electrode plate is installed within the chamber to be spaced with a predetermined gap from an inner upper surface of the chamber and to be spaced with a predetermined gap from a showerhead disposed below the RF electrode plate; plasma is generated in a first buffer portion, which is defined by a gap between the RF electrode plate and an upper surface of the showerhead, by means of the electric power applied from the external RF power source to the RF electrode plate; the showerhead is divided into two sections in a vertical direction and a second buffer portion is defined by a space between the two sections; reactant gases are supplied to the first buffer portion in which the plasma is generated; and source gases are supplied to the second buffer portion.
    • 本发明涉及化学气相沉积装置。 在化学气相沉积装置中,连接到外部RF电源的RF电源连接部安装在室的上侧; 射频电极板安装在腔室内以与腔室的内上表面隔开预定的间隙,并与设置在RF电极板下方的喷头隔开预定间隙; 通过从外部RF电源向RF电极板施加的电力,在由RF电极板和喷头的上表面之间的间隙限定的第一缓冲部分中产生等离子体; 淋浴头沿​​垂直方向分为两部分,第二缓冲部分由两部分之间的空间限定; 将反应气体供给到其中产生等离子体的第一缓冲部分; 并且源气体被供应到第二缓冲部分。
    • 3. 发明授权
    • Plasma chemical vapor deposition apparatus
    • 等离子体化学气相沉积装置
    • US06886491B2
    • 2005-05-03
    • US10102108
    • 2002-03-19
    • Jae-Ho KimSang-Joon Park
    • Jae-Ho KimSang-Joon Park
    • C23C16/455C23C16/44C23C16/515H01L21/205C23C16/00
    • C23C16/45544C23C16/45514C23C16/45538C23C16/45565C23C16/4557C23C16/45574C23C16/515
    • The present invention relates to chemical vapor deposition apparatus. In the chemical vapor deposition apparatus, an RF power source connection portionconnected to an external RF power source is installed on an upper side of a chamber; an RF electrode plate is installed within the chamber to be spaced with a predetermined gap from an inner upper surface of the chamber and to be spaced with a predetermined gap from a showerhead disposed below the RF electrode plate; plasma is generated in a first buffer portion, which is defined by a gap between the RF electrode plate and an upper surface of the showerhead, by means of the electric power applied from the external RF power source to the RF electrode plate; the showerhead is divided into two sections in a vertical direction and a second buffer portion is defined by a space between the two sections; reactant gases are supplied to the first buffer portion in which the plasma is generated; and source gases are supplied to the second buffer portion.
    • 本发明涉及化学气相沉积装置。 在化学气相沉积设备中,连接到外部RF电源的RF电源连接部分安装在室的上侧; 射频电极板安装在腔室内以与腔室的内上表面隔开预定的间隙,并与设置在RF电极板下方的喷头隔开预定间隙; 通过从外部RF电源向RF电极板施加的电力,在由RF电极板和喷头的上表面之间的间隙限定的第一缓冲部分中产生等离子体; 淋浴头在垂直方向上分为两部分,第二缓冲部分由两部分之间的空间限定; 将反应气体供给到其中产生等离子体的第一缓冲部分; 并且源气体被供应到第二缓冲部分。
    • 6. 发明授权
    • Air conditioning system for car
    • 汽车空调系统
    • US08302674B2
    • 2012-11-06
    • US11989949
    • 2006-05-08
    • Jae-Ho KimYong-Jun JeeSeong-Seok Han
    • Jae-Ho KimYong-Jun JeeSeong-Seok Han
    • B60H1/32
    • B60H3/0085B60H1/00064B60H2003/065
    • An air conditioning system, which can automatically remove a malodor generated due to condensate water remaining in an evaporator during a predetermined period of time after operation of an air conditioner or turning-off of the air conditioner and control a filtering mode time of a filter to filter an air. The air conditioning system characteristically comprises a shiftable deodorization filter (30 or 40) located on a flow channel of the cool air passageway and operationally moved to a filtering mode position so as to screen the flow channel of the cool air passageway during a predetermined period of time after an air conditioner is turned on or off, whereby the air passing through the cool air passageway C and a malodor contained in the air are filtered.
    • 一种空调系统,其能够在空调机的运转或空调的关闭之后的预定时间段内自动除去由于蒸发器中残留的冷凝水而产生的恶臭,并且将过滤器的过滤模式时间控制到 过滤空气 空调系统特征在于包括位于冷空气通道的流动通道上的可移动除臭过滤器(30或40),并可操作地移动到过滤模式位置,以便在预定时间段内屏蔽冷气通道的流动通道 打开或关闭空调后的时间,从而过滤通过冷气通道C的空气和包含在空气中的恶臭。