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1. 发明申请

US20050056039A1 Integral type air conditioner 有权
标题翻译：一体式空调
公开(公告)号：US20050056039A1
公开(公告)日：2005-03-17
申请号：US10931999
申请日：2004-09-02
申请人： Jae Kim , Myung Kim , Kyung Han
发明人： Jae Kim , Myung Kim , Kyung Han
IPC分类号： F24F1/00 , F24F1/02 , F24F3/16 , F24F13/20 , F25D23/12 , F25D17/04 , F25D17/06
CPC分类号： F24F13/20 , F24F1/0011 , F24F1/027 , F24F3/1603 , F24F2003/1614 , Y02A50/21
摘要： An integral type air conditioner is provided. The integral type air conditioner includes a filter for selectively filtering air discharged to an inside and a passage guide means for introducing air into the filter during an air cleaning operation. The air conditioner also has a cabinet forming an appearance of the air conditioner.
摘要翻译：提供一体型空调。整体型空调包括用于选择性地过滤排出到内部的空气的过滤器和用于在空气净化操作期间将空气引入过滤器的通道引导装置。空调还具有形成空调的外观的机柜。

2. 发明申请

US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20070045644A1
公开(公告)日：2007-03-01
申请号：US11491947
申请日：2006-07-25
申请人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
发明人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

3. 发明申请

US20070158669A1 Chip coated light emitting diode package and manufacturing method thereof 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US20070158669A1
公开(公告)日：2007-07-12
申请号：US11651524
申请日：2007-01-10
申请人： Seon Lee , Kyung Han , Seong Han
发明人： Seon Lee , Kyung Han , Seong Han
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

4. 发明申请

US20070134535A1 Separating plate for polymer electrolyte membrane fuel cell and method for manufacturing the same 审中-公开
标题翻译：聚合物电解质膜燃料电池用分离板及其制造方法
公开(公告)号：US20070134535A1
公开(公告)日：2007-06-14
申请号：US11494021
申请日：2006-07-26
申请人： Min-Kyu Song , Yoo Yang , Kyung Han , Sung Huh , Tae Lim
发明人： Min-Kyu Song , Yoo Yang , Kyung Han , Sung Huh , Tae Lim
IPC分类号： H01M8/02 , H01B1/24 , B32B9/00 , B29C69/00 , C08J5/00
CPC分类号： H01B1/24 , B29C43/003 , B29C43/021 , B29C2043/023 , B29K2103/04 , C08K3/04 , H01M8/0213 , H01M8/0221 , H01M8/0226 , H01M2008/1095 , Y02P70/56 , Y10T428/30
摘要： A separating plate for polymer electrolyte membrane fuel cell and a method for manufacturing the same is provided. Preferred separating plates for polymer electrolyte membrane fuel cell are capable of being light weight and corrosion resistant, as well as being economical to produce and exhibit good physical properties. Preferred separating plates are produced with compositions comprising graphite and phenolic resin.
摘要翻译：提供了一种聚合物电解质膜燃料电池用隔板及其制造方法。用于聚合物电解质膜燃料电池的优选分离板能够重量轻且耐腐蚀，并且经济地生产和表现出良好的物理性能。优选的分离板由包含石墨和酚醛树脂的组合物制备。

5. 发明申请

US20060284203A1 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US20060284203A1
公开(公告)日：2006-12-21
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
发明人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

6. 发明申请

US20060273337A1 Side-emitting LED package and method of manufacturing the same 审中-公开
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20060273337A1
公开(公告)日：2006-12-07
申请号：US11444402
申请日：2006-06-01
申请人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

7. 发明申请

US20060180925A1 LED housing and fabrication method thereof 审中-公开
标题翻译： LED外壳及其制造方法
公开(公告)号：US20060180925A1
公开(公告)日：2006-08-17
申请号：US11325327
申请日：2006-01-05
申请人： Seon Lee , Bum Jin , Kyung Han , Chang Kim
发明人： Seon Lee , Bum Jin , Kyung Han , Chang Kim
IPC分类号： H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/12041 , H01L2924/00014
摘要： The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.
摘要翻译：本发明涉及一种LED外壳及其制造方法。在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。以这种方式，本发明可以通过将电气连接部件与导热部分隔离来克服限制的应用问题。

8. 发明申请

US20050110027A1 LED lamp having heat dissipating portion 审中-公开
标题翻译： LED灯具有散热部分
公开(公告)号：US20050110027A1
公开(公告)日：2005-05-26
申请号：US10873298
申请日：2004-06-23
申请人： Seung Park , Yong Choi , Yoon Na , Kyung Han
发明人： Seung Park , Yong Choi , Yoon Na , Kyung Han
IPC分类号： H01L27/15 , H01L31/0203 , H01L33/62 , H01L33/64
CPC分类号： H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is an LED (Light Emitting Diode) lamp including a light emitting diode having first and second electrodes; a first lead frame, provided with a cup portion formed at one end thereof and a first lead portion extended from the cup portion to the other end thereof, and electrically connected to the first electrode; a second lead frame, provided with a diode connecting portion adjacent to the cup portion and a second lead portion adjacent to the first lead portion, spaced from the first lead, and electrically connected to the second electrode; a mold for sealing the light emitting diode, the cup and diode connecting portion; and a heat dissipating portion, having a designated area, formed on at least one selected from the group consisting of a lower portion of the cup portion, a lower portion of the diode connecting portion, the first lead portion and the second lead portion.
摘要翻译：公开了一种LED（发光二极管）灯，其包括具有第一和第二电极的发光二极管; 第一引线框架，其设置有形成在其一端的杯部分和从杯部延伸到另一端的第一引线部分，并且电连接到第一电极; 第二引线框架，设置有与杯部分相邻的二极管连接部分和与第一引线部分相邻的第二引线部分，与第一引线间隔开并且电连接到第二电极; 用于密封发光二极管，杯和二极管连接部分的模具; 以及具有指定区域的散热部，形成在从由杯部的下部，二极管连接部的下部，第一引导部和第二引线部组成的组中选择的至少一个上形成。

9. 发明申请

US20050076730A1 Variable motion control device and method of use 失效
标题翻译：可变运动控制装置及其使用方法
公开(公告)号：US20050076730A1
公开(公告)日：2005-04-14
申请号：US10933401
申请日：2004-09-03
申请人： Kyung Han
发明人： Kyung Han
IPC分类号： F16H20060101 , F16H27/00 , F16H29/04 , F16H35/02 , F16H37/02 , F16H37/08
CPC分类号： F16H3/721 , F16H29/04 , Y10T74/15
摘要： Variable motion control devices and methods of use. The devices and methods relate to providing an output, such as a rotational shaft output, transmitted from a rotational shaft input, with the output varying based on a control input. The devices and methods are used, for example, to provide a variable output for use with a compressor, power take off, or transmission or differential application. To provide the variable output, the devices and methods include use of mechanical component systems, such as spur gear planetary systems, ring gear planetary systems, bevel gear arrangements, or combinations of such features. The control input is implemented, for example, by arrangements of bindably meshed gears, tension between pulleys joined by belts or similar arrangements of sprockets and chains, use of magnetic clutches, hydraulic or pneumatic controls, or braking devices.
摘要翻译：可变运动控制装置及其使用方法。装置和方法涉及提供从旋转轴输入传递的输出，例如旋转轴输出，输出基于控制输入而变化。例如，使用装置和方法来提供与压缩机一起使用的可变输出，动力输出或传动或差动应用。为了提供可变输出，装置和方法包括使用机械部件系统，例如正齿轮行星系统，环形齿轮行星系统，锥齿轮装置或这些特征的组合。控制输入例如通过可绑定的啮合齿轮的布置来实现，通过皮带轮连接的滑轮之间的张力或链轮和链条的类似布置，磁力离合器，液压或气动控制器或制动装置的使用。

10. 发明申请

US20070034416A1 Weldable ultrahard materials and associated methods of manufacture 失效
标题翻译：可焊接超硬材料及相关制造方法
公开(公告)号：US20070034416A1
公开(公告)日：2007-02-15
申请号：US11200860
申请日：2005-08-09
申请人： Hyun Cho , Kyung Han , Tim Valentine
发明人： Hyun Cho , Kyung Han , Tim Valentine
IPC分类号： E21B10/36
CPC分类号： E21B10/46 , B22F7/062 , B22F2998/00 , B22F2998/10 , B23K15/0093 , B23K20/02 , B23K20/12 , B23K26/32 , B23K31/025 , B23K2103/04 , B23K2103/05 , B23K2103/08 , B23K2103/14 , B23K2103/18 , B23K2103/26 , B23K2103/50 , B23K2103/52 , C22C26/00 , C22C2026/006 , Y10S228/903 , B22F3/14
摘要： A weldable ultrahard insert can include an ultrahard working layer and a weldable metal layer metallically bonded with the working layer. The ultrahard working layer can be any ultrahard material such as PCD, PCBN, metal carbide, ceramic, diamond, or the like. The weldable ultrahard inserts can be formed by charging a reaction vessel with ultrahard materials, including precursors thereof, and placing a weldable metal layer in the reaction vessel with an optional intermediate layer. The assembly can be subjected to a pressure and a temperature sufficient to metallically bond the weldable metal layer to the ultrahard material. The weldable layer is formed as part of the insert in situ which facilitates subsequent welding of the insert to a tool substrate without risking damage to the ultrahard material.
摘要翻译：可焊接的超硬镶嵌件可以包括超硬工作层和与工作层金属结合的可焊接金属层。超硬工作层可以是任何超硬材料，例如PCD，PCBN，金属碳化物，陶瓷，金刚石等。可焊接超硬刀片可以通过将超硬材料（包括其前体）装入反应容器中，并将可焊接的金属层放置在具有任选的中间层的反应容器中来形成。该组件可以承受足以使可焊接金属层与超硬材料金属结合的压力和温度。可焊接层作为插入件的一部分原位形成，其有助于将插入件随后焊接到工具衬底，而不会对超硬材料造成损害。

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