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1. 发明申请

US20060273337A1 Side-emitting LED package and method of manufacturing the same 审中-公开
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20060273337A1
公开(公告)日：2006-12-07
申请号：US11444402
申请日：2006-06-01
申请人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Myoung Choi , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

2. 发明申请

US20070019416A1 Light emitting diode package having dual lens structure for lateral light emission 有权
标题翻译：具有用于横向发光的双透镜结构的发光二极管封装
公开(公告)号：US20070019416A1
公开(公告)日：2007-01-25
申请号：US11488067
申请日：2006-07-18
申请人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
发明人： Kyung Han , Myoung Choi , Seon Lee , Seong Han , Hun Hahm , Chang Song
IPC分类号： F21V7/00
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , G02B19/0071 , H01L33/60 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/48247 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.
摘要翻译：具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

3. 发明申请

US20070029572A1 LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method 审中-公开
标题翻译：具有改善的焊接结构的LED，将LED焊接到PCB的方法以及通过该方法制造的LED组件
公开(公告)号：US20070029572A1
公开(公告)日：2007-02-08
申请号：US11497233
申请日：2006-08-02
申请人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
发明人： Kyung Han , Seon Lee , Hun Hahm , Seong Han , Chang Song , Young Park
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H05K3/3426 , H05K3/3494 , H05K2201/10106 , H05K2201/10651 , H05K2201/1084 , H05K2203/0195 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.
摘要翻译：本发明涉及具有改进的焊接结构的LED，将LED组装到PCB的方法以及通过该方法制造的LED组件。 LED包括LED芯片和一对引线，端部电连接LED芯片，另一端连接到外部电源，其中形成有孔或切口部分。 LED还包括容纳LED芯片侧的引线的一部分的封装体，以及位于LED芯片侧的封装体的表面上的透明透镜，用于横向发光。这样可以提高钎焊焊接条件，同时提高焊接后的焊接强度。

4. 发明申请

US20060284203A1 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US20060284203A1
公开(公告)日：2006-12-21
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
发明人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

5. 发明申请

US20060273338A1 High power LED package and fabrication method thereof 有权
公开(公告)号：US20060273338A1
公开(公告)日：2006-12-07
申请号：US11445227
申请日：2006-06-02
申请人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
发明人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

6. 发明申请

US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20070045644A1
公开(公告)日：2007-03-01
申请号：US11491947
申请日：2006-07-25
申请人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
发明人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

7. 发明申请

US20060267036A1 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20060267036A1
公开(公告)日：2006-11-30
申请号：US11442414
申请日：2006-05-30
申请人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
发明人： Seon Lee , Hun Hahm , Dae Kim , Young Song , Young Park , Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

8. 发明申请

US20070108460A1 LED package 审中-公开
标题翻译： LED封装
公开(公告)号：US20070108460A1
公开(公告)日：2007-05-17
申请号：US11593085
申请日：2006-11-06
申请人： Seon Lee , Myoung Choi , Chang Song , Young Park
发明人： Seon Lee , Myoung Choi , Chang Song , Young Park
IPC分类号： H01L33/00 , H01L29/22
CPC分类号： H01L33/54 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01L2924/00014
摘要： An LED package is provided. A light emitting chip generates light when current is applied. A frame is electrically connected to the light emitting chip via a wire, and has the light emitting chip mounted thereon. A molding fixes the frame thereto, and has a cavity surrounding the light emitting chip and an embossed protrusion formed on a top surface thereof. A lens is domed upward from the embossed protrusion along an outer periphery of the embossed protrusion. The lens is made of a light transmissible resin filled in the cavity. The invention ensures a sufficient view angle of light generated from the LED chip, thereby increasing light extraction efficiency. This consequently simplifies an assembly process, allowing mass production and reducing manufacturing costs.
摘要翻译：提供LED封装。当施加电流时，发光芯片产生光。框架经由导线电连接到发光芯片，并且其上安装有发光芯片。模制件将框架固定在其上，并且具有围绕发光芯片的空腔和形成在其顶表面上的压花突起。透镜从压花突起沿着压纹凸起的外周向上圆顶。透镜由填充在空腔中的透光树脂制成。本发明确保从LED芯片产生的光的足够的视角，从而提高光提取效率。因此简化了组装过程，从而允许批量生产并降低制造成本。

9. 发明申请

US20070029564A1 Side-view light emitting diode having protective device 有权
标题翻译：具有保护装置的侧视发光二极管
公开(公告)号：US20070029564A1
公开(公告)日：2007-02-08
申请号：US11497232
申请日：2006-08-02
申请人： Kyung Han , Myoung Choi , Seon Lee , Jong Park , Chang Kim
发明人： Kyung Han , Myoung Choi , Seon Lee , Jong Park , Chang Kim
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , Y10S257/918 , H01L2924/00014
摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.
摘要翻译：在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。包装体容纳第一和第二引线框架以形成第一和第二开放区域。第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。至少第一密封剂是透明的。

10. 发明申请

US20070158669A1 Chip coated light emitting diode package and manufacturing method thereof 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US20070158669A1
公开(公告)日：2007-07-12
申请号：US11651524
申请日：2007-01-10
申请人： Seon Lee , Kyung Han , Seong Han
发明人： Seon Lee , Kyung Han , Seong Han
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

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