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1. 发明授权

US09557369B2 Integrated time dependent dielectric breakdown reliability testing 有权
标题翻译：集成时间依赖介质击穿可靠性测试
公开(公告)号：US09557369B2
公开(公告)日：2017-01-31
申请号：US13530782
申请日：2012-06-22
申请人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
发明人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
IPC分类号： G01R31/28 , G01R31/311
CPC分类号： G01R31/2855 , G01R31/281 , G01R31/2817 , G01R31/2858 , G01R31/2879 , G01R31/311
摘要： Methods for reliability testing include applying a stress voltage to a device under test (DUT); measuring a leakage current across the DUT; triggering measurement of optical emissions from the DUT based on the timing of the measurement of the leakage current; and correlating measurements of the leakage current with measurements of the optical emissions to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要翻译：可靠性测试方法包括对被测设备（DUT）施加应力电压; 测量穿过DUT的漏电流; 基于泄漏电流测量的定时，触发DUT测量光发射; 并且将泄漏电流的测量与光发射的测量值相关联，以通过将泄漏电流中增加的噪声的实例定位在与增加的光发射的情况相对应的时间内来确定DUT内的缺陷发生的时间和位置。

2. 发明授权

US09448277B2 Integrated time dependent dielectric breakdown reliability testing 有权
标题翻译：集成时间依赖介质击穿可靠性测试
公开(公告)号：US09448277B2
公开(公告)日：2016-09-20
申请号：US13544080
申请日：2012-07-09
申请人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
发明人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
IPC分类号： G01R31/28 , G01R31/311
CPC分类号： G01R31/2855 , G01R31/281 , G01R31/2817 , G01R31/2858 , G01R31/2879 , G01R31/311
摘要： Systems for reliability testing include a picometer configured to measure a leakage current across a device under test (DUT); a camera configured to measure optical emissions from the DUT based on a timing of the measurement of the leakage current; and a test system configured to apply a stress voltage to the DUT and to correlate the leakage current with the optical emissions using a processor to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要翻译：用于可靠性测试的系统包括配置成测量被测器件（DUT）上的漏电流的波长计; 配置为基于所述泄漏电流的测量的定时来测量来自所述DUT的光发射的照相机; 以及被配置为向DUT施加应力电压并且使用处理器将泄漏电流与光发射相关联的测试系统，以通过定位泄漏电流中增加的噪声的实例来确定DUT内的缺陷发生的时间和位置，在时间上对应于增加的光发射的情况。

3. 发明申请

US20130345997A1 INTEGRATED TIME DEPENDENT DIELECTRIC BREAKDOWN RELIABILITY TESTING 有权
标题翻译：集成时间依赖电介质断开可靠性测试
公开(公告)号：US20130345997A1
公开(公告)日：2013-12-26
申请号：US13530782
申请日：2012-06-22
申请人： JIFENG CHEN , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
发明人： JIFENG CHEN , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
IPC分类号： G01R31/12 , G06F19/00
CPC分类号： G01R31/2855 , G01R31/281 , G01R31/2817 , G01R31/2858 , G01R31/2879 , G01R31/311
摘要： Methods for reliability testing include applying a stress voltage to a device under test (DUT); measuring a leakage current across the DUT; triggering measurement of optical emissions from the DUT based on the timing of the measurement of the leakage current; and correlating measurements of the leakage current with measurements of the optical emissions to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要翻译：可靠性测试方法包括对被测设备（DUT）施加应力电压; 测量穿过DUT的漏电流; 基于泄漏电流测量的定时，触发DUT测量光发射; 并且将泄漏电流的测量与光发射的测量值相关联，以通过将泄漏电流中增加的噪声的实例定位在与增加的光发射的情况相对应的时间内来确定DUT内的缺陷发生的时间和位置。

4. 发明申请

US20140207396A1 INTEGRATED TIME DEPENDENT DIELECTRIC BREAKDOWN RELIABILITY TESTING 审中-公开
标题翻译：集成时间依赖电介质断开可靠性测试
公开(公告)号：US20140207396A1
公开(公告)日：2014-07-24
申请号：US13544080
申请日：2012-07-09
申请人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
发明人： Jifeng Chen , Dirk Pfeiffer , Thomas M. Shaw , Peilin Song , Franco Stellari
IPC分类号： G01R31/28
CPC分类号： G01R31/2855 , G01R31/281 , G01R31/2817 , G01R31/2858 , G01R31/2879 , G01R31/311
摘要： Systems for reliability testing include a picometer configured to measure a leakage current across a device under test (DUT); a camera configured to measure optical emissions from the DUT based on a timing of the measurement of the leakage current; and a test system configured to apply a stress voltage to the DUT and to correlate the leakage current with the optical emissions using a processor to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要翻译：用于可靠性测试的系统包括配置成测量被测器件（DUT）上的漏电流的波长计; 配置为基于所述泄漏电流的测量的定时来测量来自所述DUT的光发射的照相机; 以及被配置为向DUT施加应力电压并且使用处理器将泄漏电流与光发射相关联的测试系统，以通过定位泄漏电流中增加的噪声的实例来确定DUT内的缺陷发生的时间和位置，在时间上对应于增加的光发射的情况。

5. 发明授权

US09075106B2 Detecting chip alterations with light emission 有权
标题翻译：用光发射检测芯片变化
公开(公告)号：US09075106B2
公开(公告)日：2015-07-07
申请号：US12512168
申请日：2009-07-30
申请人： Kerry Bernstein , James Culp , David F. Heidel , Dirk Pfeiffer , Anthony D. Polson , Peilin Song , Franco Stellari , Robert L. Wisnieff
发明人： Kerry Bernstein , James Culp , David F. Heidel , Dirk Pfeiffer , Anthony D. Polson , Peilin Song , Franco Stellari , Robert L. Wisnieff
IPC分类号： G06K9/00 , G01R31/311 , G01R31/00
CPC分类号： G01R31/311
摘要： An emission map of a circuit to be tested for alterations is obtained by measuring the physical circuit to be tested. An emission map of a reference circuit is obtained by measuring a physical reference circuit or by simulating the emissions expected from the reference circuit. The emission map of the circuit to be tested is compared with the emission map of the reference circuit, to determine presence of alterations in the circuit to be tested, as compared to the reference circuit.
摘要翻译：通过测量要测试的物理电路来获得待测试电路的发射图。通过测量物理参考电路或通过模拟从参考电路预期的发射来获得参考电路的发射图。与参考电路相比，要测试的电路的发射图与参考电路的发射图进行比较，以确定待测电路中的变化的存在。

6. 发明申请

US20110026806A1 Detecting Chip Alterations with Light Emission 有权
标题翻译：用光发射检测芯片变化
公开(公告)号：US20110026806A1
公开(公告)日：2011-02-03
申请号：US12512168
申请日：2009-07-30
申请人： Kerry Bernstein , James Culp , David F. Heidel , Dirk Pfeiffer , Anthony D. Polson , Peilin Song , Franco Stellari , Robert L. Wisnieff
发明人： Kerry Bernstein , James Culp , David F. Heidel , Dirk Pfeiffer , Anthony D. Polson , Peilin Song , Franco Stellari , Robert L. Wisnieff
IPC分类号： G03F9/00 , G06F19/00
CPC分类号： G01R31/311
摘要： An emission map of a circuit to be tested for alterations is obtained by measuring the physical circuit to be tested. An emission map of a reference circuit is obtained by measuring a physical reference circuit or by simulating the emissions expected from the reference circuit. The emission map of the circuit to be tested is compared with the emission map of the reference circuit, to determine presence of alterations in the circuit to be tested, as compared to the reference circuit.
摘要翻译：通过测量要测试的物理电路来获得待测试电路的发射图。通过测量物理参考电路或通过模拟从参考电路预期的发射来获得参考电路的发射图。与参考电路相比，要测试的电路的发射图与参考电路的发射图进行比较，以确定待测电路中的变化的存在。

7. 发明授权

US08193009B2 Apparatus and methods for packaging electronic devices for optical testing 失效
标题翻译：用于包装电子设备进行光学测试的装置和方法
公开(公告)号：US08193009B2
公开(公告)日：2012-06-05
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/66
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译：提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。

8. 发明申请

US20090286353A1 Apparatus and Methods for Packaging Electronic Devices for Optical Testing 失效
标题翻译：用于包装用于光学测试的电子设备的装置和方法
公开(公告)号：US20090286353A1
公开(公告)日：2009-11-19
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/52
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译：提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。

9. 发明申请

US20060220664A1 Optical trigger for PICA technique 失效
标题翻译： PICA技术的光触发器
公开(公告)号：US20060220664A1
公开(公告)日：2006-10-05
申请号：US11098850
申请日：2005-04-05
申请人： Franco Stellari , Peilin Song
发明人： Franco Stellari , Peilin Song
IPC分类号： G01R31/302
CPC分类号： G01R31/31709 , G01R31/311
摘要： Optical triggering system and method for synchronizing a test of an integrated circuit chip with its operation. An optical triggering system includes a testing mechanism, such as a PICA testing mechanism, for testing an integrated circuit chip. An optical trigger mechanism generates an optical trigger signal for synchronizing a test of the integrated circuit chip with its operation. The optical trigger mechanism provides an optical trigger signal having reduced jitter and a higher frequency rate than an electrical trigger signal resulting in a more accurate test of the integrated circuit chip.
摘要翻译：用于使集成电路芯片的测试与其操作同步的光触发系统和方法。光触发系统包括用于测试集成电路芯片的诸如PICA测试机构的测试机构。光学触发机构产生用于使集成电路芯片的测试与其操作同步的光学触发信号。光学触发机构提供具有比电触发信号更少的抖动和更高频率的光学触发信号，导致集成电路芯片的更准确的测试。

10. 发明授权

US09581642B2 Method and system for quickly identifying circuit components in an emission image 有权
标题翻译：用于快速识别发射图像中电路元件的方法和系统
公开(公告)号：US09581642B2
公开(公告)日：2017-02-28
申请号：US12778544
申请日：2010-05-12
申请人： Peilin Song , Franco Stellari
发明人： Peilin Song , Franco Stellari
IPC分类号： G06T7/00 , G01R31/311
CPC分类号： G01R31/311 , G01R31/2853 , G06T7/001 , G06T7/11 , G06T2207/10056 , G06T2207/30148
摘要： A system and method for localization and resolvability of an integrated circuit includes selecting one or more electrical stimuli to be applied to a device under test such that the electrical stimuli are chosen to provide a baseline image and a distinguishing image effect as a result of the chosen stimuli when applied to the device under test. The one or more electrical stimuli are applied to the device under test. Emissions from the device under test are measured to provide a measurement data set from the one or more electrical stimuli using one or more measurement tools for collecting the baseline image and the distinguishing image effect. The measurement data set is analyzed to localize and evaluate circuit structures by comparing the baseline image and the distinguishing image effect.
摘要翻译：用于集成电路的定位和可解析性的系统和方法包括选择要施加到被测器件的一个或多个电刺激，使得选择电刺激以提供基线图像和作为所选择的结果的结果的区别图像效果当被施加到被测设备时刺激。一个或多个电刺激被施加到被测设备。测量来自被测器件的发射，以使用一个或多个测量工具从一个或多个电刺激提供测量数据集，用于收集基线图像和区分图像效果。分析测量数据集，通过比较基线图像和区分图像效果来定位和评估电路结构。

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