会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Gas for removing deposit and removal method using same
    • 用于除去沉积物和除去方法的气体使用它
    • US07744769B2
    • 2010-06-29
    • US11543968
    • 2006-10-06
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • B44C1/22H01L21/302
    • C03C15/00C03C17/00C03C2218/33C09K13/00C23F4/00H01L21/31116H01L21/32136Y10S438/905Y10S438/906
    • The invention relates to a gas for removing deposits by a gas-solid reaction. This gas includes a hypofluorite that is defined as being a compound having at least one OF group in the molecule. Various deposits can be removed by the gas, and the gas can easily be made unharmful on the global environment after the removal of the deposits, due to the use of a hypofluorite. The gas may be a cleaning gas for cleaning, for example, the inside of an apparatus for producing semiconductor devices. This cleaning gas comprises 1-100 volume % of the hypofluorite. Alternatively, the gas of the invention may be an etching gas for removing an unwanted portion of a film deposited on a substrate. The unwanted portion can be removed by this etching gas as precisely as originally designed, due to the use of a hypofluorite. The invention further relates to a method for removing a deposit by the gas. This method includes the step (a) bringing the gas into contact with the deposit, thereby to remove the deposit by a gas-solid reaction.
    • 本发明涉及通过气 - 固反应去除沉积物的气体。 该气体包括被定义为在分子中具有至少一个OF基团的化合物的次氟酸盐。 各种沉积物可以被气体除去,并且由于使用次氟酸盐,在清除沉积物之后,气体可以容易地在全球环境中变得不起作用。 气体可以是用于清洁的清洁气体,例如用于制造半导体器件的设备的内部。 该清洁气体包含1-100体积%的次氟酸盐。 或者,本发明的气体可以是用于去除沉积在基板上的膜的不希望的部分的蚀刻气体。 由于使用次氟酸盐,可以通过精确地由原始设计的这种蚀刻气体除去不想要的部分。 本发明还涉及一种通过气体去除沉积物的方法。 该方法包括步骤(a)使气体与沉积物接触,从而通过气固反应除去沉积物。
    • 5. 发明授权
    • Gas for removing deposit and removal method using same
    • 用于除去沉积物和除去方法的气体使用它
    • US07168436B2
    • 2007-01-30
    • US10705532
    • 2003-11-12
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • B08B9/00H01L21/00
    • C03C15/00C03C17/00C03C2218/33C09K13/00C23F4/00H01L21/31116H01L21/32136Y10S438/905Y10S438/906
    • The invention relates to a gas for removing deposits by a gas-solid reaction. This gas includes a hypofluorite that is defined as being a compound having at least one OF group in the molecule. Various deposits can be removed by the gas, and the gas can easily be made unharmful on the global environment after the removal of the deposits, due to the use of a hypofluorite. The gas may be a cleaning gas for cleaning, for example, the inside of an apparatus for producing semiconductor devices. This cleaning gas comprises 1–100 volume % of the hypofluorite. Alternatively, the gas of the invention may be an etching gas for removing an unwanted portion of a film deposited on a substrate. The unwanted portion can be removed by this etching gas as precisely as originally designed, due to the use of a hypofluorite. The invention further relates to a method for removing a deposit by the gas. This method includes the step (a) bringing the gas into contact with the deposit, thereby to remove the deposit by a gas-solid reaction.
    • 本发明涉及通过气 - 固反应去除沉积物的气体。 该气体包括被定义为在分子中具有至少一个OF基团的化合物的次氟酸盐。 各种沉积物可以被气体除去,并且由于使用次氟酸盐,在清除沉积物之后,气体可以容易地在全球环境中变得不起作用。 气体可以是用于清洁的清洁气体,例如用于制造半导体器件的设备的内部。 该清洁气体包含1-100体积%的次氟酸盐。 或者,本发明的气体可以是用于去除沉积在基板上的膜的不希望的部分的蚀刻气体。 由于使用次氟酸盐,可以通过精确地由原始设计的这种蚀刻气体除去不想要的部分。 本发明还涉及一种通过气体去除沉积物的方法。 该方法包括步骤(a)使气体与沉积物接触,从而通过气固反应除去沉积物。
    • 6. 发明授权
    • Gas for removing deposit and removal method using same
    • 用于除去沉积物和除去方法的气体使用它
    • US06673262B1
    • 2004-01-06
    • US09208022
    • 1998-12-09
    • Isamu MoriTetsuya TamuraMitsuya Ohashi
    • Isamu MoriTetsuya TamuraMitsuya Ohashi
    • C09K1308
    • C03C15/00C03C17/00C03C2218/33C09K13/00C23F4/00H01L21/31116H01L21/32136Y10S438/905Y10S438/906
    • The invention relates to a gas for removing deposits by a gas-solid reaction. This gas includes a hypofluorite that is defined as being a compound having at least one OF group in the molecule. Various deposits can be removed by the gas, and the gas can easily be made unharmful on the global environment after the removal of the deposits, due to the use of a hypofluorite. The gas may be a cleaning gas for cleaning, for example, the inside of an apparatus for producing semiconductor devices. This cleaning gas comprises 1-100 volume % of the hypofluorite. Alternatively, the gas of the invention may be an etching gas for removing an unwanted portion of a film deposited on a substrate. The unwanted portion can be removed by this etching gas as precisely as originally designed, due to the use of a hypofluorite. The invention further relates to a method for removing a deposit by the gas. This method includes the step (a) bringing the gas into contact with the deposit, thereby to remove the deposit by a gas-solid reaction.
    • 本发明涉及通过气 - 固反应去除沉积物的气体。 该气体包括被定义为在分子中具有至少一个OF基团的化合物的次氟酸盐。 各种沉积物可以被气体除去,并且由于使用次氟酸盐,在清除沉积物之后,气体可以容易地在全球环境中变得不起作用。 气体可以是用于清洁的清洁气体,例如用于制造半导体器件的设备的内部。 该清洁气体包含1-100体积%的次氟酸盐。 或者,本发明的气体可以是用于去除沉积在基板上的膜的不希望的部分的蚀刻气体。 由于使用次氟酸盐,可以通过精确地由原始设计的这种蚀刻气体除去不想要的部分。 本发明还涉及一种通过气体去除沉积物的方法。 该方法包括步骤(a)使气体与沉积物接触,从而通过气固反应除去沉积物。
    • 9. 发明授权
    • Sheet material transport apparatus and recording apparatus
    • 片材输送装置和记录装置
    • US08172217B2
    • 2012-05-08
    • US13015489
    • 2011-01-27
    • Tetsuya TamuraAkira NemuraHiroki Chino
    • Tetsuya TamuraAkira NemuraHiroki Chino
    • B65H5/00B65H5/22
    • B65H5/06
    • A sheet material transport apparatus includes a second planetary gear engaging with a transmission gear and providing planetary motion around the transmission gear. The second planetary gear is in a second separated position not capable of engaging with a first planetary gear during forward-direction rotation. The transmission gear engages with the first planetary gear and rotates in a direction that causes a second transport roller to rotate in the forward rotation direction, and positioned to engage with the first planetary gear that is positioned in a first engaging position during reverse rotation. A load is placed on the transmission gear by the second transport roller. The transmission gear rotates in the opposite direction to the forward-direction rotation. The second planetary gear applies a force on the first planetary gear in the direction that separates the first planetary gear from the transmission gear due to rotation.
    • 片材输送装置包括与传动齿轮啮合的第二行星齿轮,并且围绕传动齿轮提供行星运动。 第二行星齿轮在向前旋转期间不能与第一行星齿轮接合的第二分离位置。 传动齿轮与第一行星齿轮接合并沿着使第二输送辊沿正转方向旋转的方向旋转,并且定位成与反向旋转期间位于第一接合位置的第一行星齿轮接合。 通过第二传送辊将负载放置在传动齿轮上。 传动齿轮沿与正向旋转相反的方向旋转。 第二行星齿轮由于旋转而使第一行星齿轮沿着使第一行星齿轮与变速齿轮分离的方向施加力。