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    • 1. 发明授权
    • Method for producing organosilane
    • 生产有机硅烷的方法
    • US07355060B2
    • 2008-04-08
    • US10580265
    • 2004-11-09
    • Tsuyoshi OgawaYoshihiro MuramatsuMitsuya Ohashi
    • Tsuyoshi OgawaYoshihiro MuramatsuMitsuya Ohashi
    • C07F7/08
    • C07F7/0896
    • By reducing an organosilane represented by the formula (1), SiXnR4-n  (1) (wherein X represents a halogen or alkoxide, n represents an integer of 1-3, and R represents an alkyl group or aryl group), there is produced a corresponding organosilane represented by the formula (2), SiHnR4-n  (2) (wherein n represents an integer of 1-3, and R represents an alkyl group or aryl group). In this production method, an aromatic hydrocarbon series organic solvent is used as a reaction solvent, and aluminum lithium hydride is used as a hydrogenating agent.
    • 通过还原由式(1)表示的有机硅烷,<?in-line-formula description =“In-line Formulas”end =“lead”→> SiX n R 4-n (1)<?in-line-formula description =“In-line Formulas”end =“tail”?>(其中X表示卤素或醇盐,n表示1-3的整数,R表示 烷基或芳基),产生由式(2)表示的相应有机硅烷,<?in-line-formula description =“In-line Formulas”end =“lead”?> SiH n n (2)<?in-line-formula description =“In-line Formulas”end =“tail”?>(其中n表示1-3的整数, R表示烷基或芳基)。 在该制造方法中,使用芳香族烃系有机溶剂作为反应溶剂,使用氢化铝锂作为氢化剂。
    • 2. 发明申请
    • Method for producing organosilane
    • 生产有机硅烷的方法
    • US20070149798A1
    • 2007-06-28
    • US10580265
    • 2004-11-09
    • Tsuyoshi OgawaYoshihiro MuramatsuMitsuya Ohashi
    • Tsuyoshi OgawaYoshihiro MuramatsuMitsuya Ohashi
    • C07F7/00
    • C07F7/0896
    • By reducing an organosilane represented by the formula (1), SiXnR4-n   (1) (wherein X represents a halogen or alkoxide, n represents an integer of 1-3, and R represents an alkyl group or aryl group), there is produced a corresponding organosilane represented by the formula (2), SiHnR4-n   (2) (wherein n represents an integer of 1-3, and R represents an alkyl group or aryl group). In this production method, an aromatic hydrocarbon series organic solvent is used as a reaction solvent, and aluminum lithium hydride is used as a hydrogenating agent.
    • 通过还原由式(1)表示的有机硅烷,<?in-line-formula description =“In-line Formulas”end =“lead”→> SiX n R 4-n (1)<?in-line-formula description =“In-line Formulas”end =“tail”?>(其中X表示卤素或醇盐,n表示1-3的整数,R表示 烷基或芳基),产生由式(2)表示的相应有机硅烷,<?in-line-formula description =“In-line Formulas”end =“lead”?> SiH n n (2)<?in-line-formula description =“In-line Formulas”end =“tail”?>(其中n表示1-3的整数, R表示烷基或芳基)。 在该制造方法中,使用芳香族烃系有机溶剂作为反应溶剂,使用氢化铝锂作为氢化剂。
    • 5. 发明授权
    • Gas for removing deposit and removal method using same
    • 用于除去沉积物和除去方法的气体使用它
    • US07744769B2
    • 2010-06-29
    • US11543968
    • 2006-10-06
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • B44C1/22H01L21/302
    • C03C15/00C03C17/00C03C2218/33C09K13/00C23F4/00H01L21/31116H01L21/32136Y10S438/905Y10S438/906
    • The invention relates to a gas for removing deposits by a gas-solid reaction. This gas includes a hypofluorite that is defined as being a compound having at least one OF group in the molecule. Various deposits can be removed by the gas, and the gas can easily be made unharmful on the global environment after the removal of the deposits, due to the use of a hypofluorite. The gas may be a cleaning gas for cleaning, for example, the inside of an apparatus for producing semiconductor devices. This cleaning gas comprises 1-100 volume % of the hypofluorite. Alternatively, the gas of the invention may be an etching gas for removing an unwanted portion of a film deposited on a substrate. The unwanted portion can be removed by this etching gas as precisely as originally designed, due to the use of a hypofluorite. The invention further relates to a method for removing a deposit by the gas. This method includes the step (a) bringing the gas into contact with the deposit, thereby to remove the deposit by a gas-solid reaction.
    • 本发明涉及通过气 - 固反应去除沉积物的气体。 该气体包括被定义为在分子中具有至少一个OF基团的化合物的次氟酸盐。 各种沉积物可以被气体除去,并且由于使用次氟酸盐,在清除沉积物之后,气体可以容易地在全球环境中变得不起作用。 气体可以是用于清洁的清洁气体,例如用于制造半导体器件的设备的内部。 该清洁气体包含1-100体积%的次氟酸盐。 或者,本发明的气体可以是用于去除沉积在基板上的膜的不希望的部分的蚀刻气体。 由于使用次氟酸盐,可以通过精确地由原始设计的这种蚀刻气体除去不想要的部分。 本发明还涉及一种通过气体去除沉积物的方法。 该方法包括步骤(a)使气体与沉积物接触,从而通过气固反应除去沉积物。
    • 6. 发明授权
    • Gas for removing deposit and removal method using same
    • 用于除去沉积物和除去方法的气体使用它
    • US07168436B2
    • 2007-01-30
    • US10705532
    • 2003-11-12
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • Isamu MouriTetsuya TamuraMitsuya Ohashi
    • B08B9/00H01L21/00
    • C03C15/00C03C17/00C03C2218/33C09K13/00C23F4/00H01L21/31116H01L21/32136Y10S438/905Y10S438/906
    • The invention relates to a gas for removing deposits by a gas-solid reaction. This gas includes a hypofluorite that is defined as being a compound having at least one OF group in the molecule. Various deposits can be removed by the gas, and the gas can easily be made unharmful on the global environment after the removal of the deposits, due to the use of a hypofluorite. The gas may be a cleaning gas for cleaning, for example, the inside of an apparatus for producing semiconductor devices. This cleaning gas comprises 1–100 volume % of the hypofluorite. Alternatively, the gas of the invention may be an etching gas for removing an unwanted portion of a film deposited on a substrate. The unwanted portion can be removed by this etching gas as precisely as originally designed, due to the use of a hypofluorite. The invention further relates to a method for removing a deposit by the gas. This method includes the step (a) bringing the gas into contact with the deposit, thereby to remove the deposit by a gas-solid reaction.
    • 本发明涉及通过气 - 固反应去除沉积物的气体。 该气体包括被定义为在分子中具有至少一个OF基团的化合物的次氟酸盐。 各种沉积物可以被气体除去,并且由于使用次氟酸盐,在清除沉积物之后,气体可以容易地在全球环境中变得不起作用。 气体可以是用于清洁的清洁气体,例如用于制造半导体器件的设备的内部。 该清洁气体包含1-100体积%的次氟酸盐。 或者,本发明的气体可以是用于去除沉积在基板上的膜的不希望的部分的蚀刻气体。 由于使用次氟酸盐,可以通过精确地由原始设计的这种蚀刻气体除去不想要的部分。 本发明还涉及一种通过气体去除沉积物的方法。 该方法包括步骤(a)使气体与沉积物接触,从而通过气固反应除去沉积物。