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    • 1. 发明公开
    • MEASUREMENT ARRANGEMENT
    • 测量安排
    • EP1384253A1
    • 2004-01-28
    • EP01989620.8
    • 2001-12-27
    • Infineon Technologies AGNanoPhotonics AG
    • ABRAHAM, MichaelMARX, Eckhard
    • H01L21/00
    • H01L21/67253H01L21/67772
    • A measurement device (1), i.e. a metrology tool, and a vehicle (2) are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit (3), for, e.g., FOUPs in semiconductor manufacturing, an electronic control system (5) with, e.g., a PC, monitor and keyboard and optionally a vacuum pump (9) is also provided in module frames of the vehicle (2). The measurement arrangement particularly reduces bottleneck situations in equipment qualifying of processing tools (40) during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool (40). With the possible exception of power supply or operator control, the measurement arrangement can operate fully autonomous.
    • 测量装置(1)即计量工具和车辆(2)组合在一起以在制造设施中提供移动计量。 还提供了用于例如半导体制造中的FOUP的装置传送单元(3),具有例如PC,监视器和键盘以及可选的真空泵(9)的电子控制系统(5)的外围设备 (2)的模块框架。 该测量装置特别地减少了在例如半导体制造设施的快速上升阶段期间处理工具(40)的设备合格性中的瓶颈情况,由此节约了成本。 该结构基于PGV或AGV,并且允许在加工工具(40)的位置处直接快速操作。 除电源或操作员控制可能的情况外,测量装置可以完全自主操作。