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1. 发明授权

US11037007B2 Biometric device and method thereof and wearable carrier 有权
公开(公告)号：US11037007B2
公开(公告)日：2021-06-15
申请号：US16596770
申请日：2019-10-09
申请人： Industrial Technology Research Institute
发明人： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu
IPC分类号： H04N5/33 , H04N5/225 , G06K9/00
摘要： A biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer. The optical layer is located between the IR LED and the image sensor.

2. 发明授权

US10566125B2 Magnetic transfer module and method for transferring electronic element 有权
公开(公告)号：US10566125B2
公开(公告)日：2020-02-18
申请号：US15822217
申请日：2017-11-27
申请人： Industrial Technology Research Institute
发明人： Ming-Hsien Wu , Yen-Hsiang Fang , Chia-Hsin Chao
IPC分类号： H01F7/20 , B25J15/06 , H05K13/04 , H01F13/00 , H01L21/67 , H01L33/00
摘要： A magnetic transfer module adapted to transfer a plurality of electronic elements. The magnetic transfer module includes an electromagnet and a plurality of transfer unit. The transfer units are connected to the electromagnet, each of the transfer units includes a ferromagnetic material element, and at least one of the transfer units includes a heating element. The electromagnet magnetizes the ferromagnetic material element, such that the ferromagnetic material element magnetically attracts one of the electronic elements. The heating element is disposed between the electromagnet and the ferromagnetic material element, and heats the ferromagnetic material element to demagnetize the ferromagnetic material element while being actuated.

3. 发明申请

US20190019702A1 TRANSFER SUPPORT AND TRANSFER MODULE 审中-公开
公开(公告)号：US20190019702A1
公开(公告)日：2019-01-17
申请号：US15847950
申请日：2017-12-20
申请人： Industrial Technology Research Institute
发明人： Ming-Hsien Wu , Yih-Der Guo , Yen-Hsiang Fang , Yao-Jun Tsai , Yi-Chen Lin
IPC分类号： H01L21/673 , H01L21/683
CPC分类号： H01L21/67333 , H01L21/67144 , H01L21/6838 , H01L24/95 , H01L33/00 , H01L33/0095 , H01L33/20
摘要： A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

4. 发明授权

US10147622B2 Electric-programmable magnetic module 有权
公开(公告)号：US10147622B2
公开(公告)日：2018-12-04
申请号：US15428156
申请日：2017-02-09
申请人： Industrial Technology Research Institute , PlayNitride Inc.
发明人： Ming-Hsien Wu , Yen-Hsiang Fang , Chia-Hsin Chao
IPC分类号： H01L21/67 , H01L21/683 , H01L33/62 , H01L33/00 , H01L21/66 , H01L23/00 , G01R31/26 , H01L33/06 , H01L33/12
摘要： An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.

5. 发明授权

US10134709B1 Substrateless light emitting diode (LED) package for size shrinking and increased resolution of display device 有权
公开(公告)号：US10134709B1
公开(公告)日：2018-11-20
申请号：US15849692
申请日：2017-12-21
申请人： Industrial Technology Research Institute
发明人： Ming-Hsien Wu , Yao-Jun Tsai , Chia-Hsin Chao , Yen-Hsiang Fang , Yi-Chen Lin , Ching-Ya Yeh
IPC分类号： H01L25/16 , H01L25/065 , H01L33/62 , H01L33/58 , H01L33/50 , H01L33/00 , H01L33/54
摘要： A light emitting diode package including a circuit layer, a light-shielding layer, a plurality of light emitting diodes and an encapsulation layer is provided. A thickness of the circuit layer is less than 100 μm. The light-shielding layer is disposed on a first surface of the circuit layer and the light-shielding layer has a plurality of apertures. The light emitting diodes are disposed on the first surface of the circuit layer and in the apertures of the light-shielding layer. The light emitting diodes are electrically connected to the circuit layer. The encapsulation layer covers the light-shielding layer. A refractive index of the encapsulation layer is 1.4 and to 1.7. The Young's modulus of the encapsulation layer is larger than or equal to 1 GPa. A thickness of the encapsulation layer is greater than thicknesses of the light emitting diodes.

6. 发明申请

US20180301265A1 MAGNETIC TRANSFER MODULE AND METHOD FOR TRANSFERRING ELECTRONIC ELEMENT 审中-公开
公开(公告)号：US20180301265A1
公开(公告)日：2018-10-18
申请号：US15822217
申请日：2017-11-27
申请人： Industrial Technology Research Institute
发明人： Ming-Hsien Wu , Yen-Hsiang Fang , Chia-Hsin Chao
IPC分类号： H01F7/20
CPC分类号： H01F7/206 , B25J15/0608 , H01F13/006 , H01L21/67144 , H01L33/0095 , H05K13/0408 , H05K13/041
摘要： A magnetic transfer module adapted to transfer a plurality of electronic elements. The magnetic transfer module includes an electromagnet and a plurality of transfer unit. The transfer units are connected to the electromagnet, each of the transfer units includes a ferromagnetic material element, and at least one of the transfer units includes a heating element. The electromagnet magnetizes the ferromagnetic material element, such that the ferromagnetic material element magnetically attracts one of the electronic elements. The heating element is disposed between the electromagnet and the ferromagnetic material element, and heats the ferromagnetic material element to demagnetize the ferromagnetic material element while being actuated.

7. 发明申请

US20170162767A1 PACKAGE STRUCTURE OF AN ULTRAVIOLET LIGHT EMITTING DIODE 审中-公开
公开(公告)号：US20170162767A1
公开(公告)日：2017-06-08
申请号：US15291043
申请日：2016-10-11
申请人： Industrial Technology Research Institute
发明人： Chien-Chun Lu , Chen-Peng Hsu , Zhi-Wei Koh , Yen-Hsiang Fang
IPC分类号： H01L33/58 , H01L33/48
CPC分类号： H01L33/58 , H01L33/486
摘要： A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.

8. 发明授权

US09653382B2 Semiconductor laser structure 有权
公开(公告)号：US09653382B2
公开(公告)日：2017-05-16
申请号：US14864810
申请日：2015-09-24
申请人： Industrial Technology Research Institute
发明人： Jui-Ying Lin , Yen-Hsiang Fang , Chia-Hsin Chao , Yao-Jun Tsai , Yi-Chen Lin
IPC分类号： H01S5/024 , H01S5/026 , H01S5/34 , H01L23/48 , H01L21/306 , H01L27/02 , H01L33/20 , H01L33/62 , H01L21/768 , H01L23/00 , H01S5/02 , G02B6/12 , G02B6/34 , H01L29/861 , H01L23/60 , H01L23/13 , H01L23/14 , H01L23/498 , H01L21/48 , H01L25/16
CPC分类号： H01L23/481 , G02B6/12 , G02B6/34 , G02B2006/12061 , H01L21/30604 , H01L21/486 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/80 , H01L25/167 , H01L27/0255 , H01L29/861 , H01L33/20 , H01L33/62 , H01L2224/04 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06102 , H01L2224/08148 , H01L2224/08238 , H01L2224/16148 , H01L2224/16238 , H01L2224/29294 , H01L2224/32148 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48148 , H01L2224/48229 , H01L2224/73265 , H01L2224/80801 , H01L2224/80805 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83805 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2933/0066 , H01S5/0208 , H01S5/02469 , H01S5/026 , H01S5/34 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

9. 发明授权

US09607907B2 Electric-programmable magnetic module and picking-up and placement process for electronic devices 有权
公开(公告)号：US09607907B2
公开(公告)日：2017-03-28
申请号：US14954993
申请日：2015-11-30
申请人： Industrial Technology Research Institute , PlayNitride Inc.
发明人： Ming-Hsien Wu , Yen-Hsiang Fang , Chia-Hsin Chao
IPC分类号： H01L21/66 , H01L33/48 , H01L21/683 , H01L21/00 , H01L23/00 , H01L33/00
CPC分类号： H01L21/67144 , G01R31/2635 , H01L21/6835 , H01L22/20 , H01L22/22 , H01L24/75 , H01L24/81 , H01L33/0095 , H01L33/06 , H01L33/12 , H01L33/62 , H01L2221/6835 , H01L2221/68368 , H01L2933/0066
摘要： A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.

10. 发明申请

US20170028647A1 THREE DIMENSIONAL PRINTING SYSTEM 审中-公开
标题翻译：三维打印系统
公开(公告)号：US20170028647A1
公开(公告)日：2017-02-02
申请号：US14979585
申请日：2015-12-28
申请人： Industrial Technology Research Institute
发明人： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu , Ying-Chien Chu
IPC分类号： B29C67/00
CPC分类号： B33Y50/02 , B29C64/129 , B29C64/135 , B29C64/386 , B33Y30/00
摘要： In one exemplary embodiment, a three dimensional printing system may include a tank filled with liquid forming material, a carrier platform, an optical module disposed under the tank, and a control module is provided. The control module is electrically connected to the optical module and the carrier platform, such that the carrier platform is controlled to move in the tank, and the optical module is controlled to generate light irradiating to the liquid forming material to form a solidification layer on the carrier platform. An image position of the optical module is located in a specific position away from the bottom of the tank in the liquid forming material to form a solidification plane, the liquid forming material at the solidification plane is cured and solidified to form the solidification layer, and a plurality of solidification layers are stacked to form a three dimensional object.
摘要翻译：在一个示例性实施例中，三维打印系统可以包括填充有液体形成材料的容器，载体平台，设置在罐下方的光学模块，以及控制模块。控制模块电连接到光学模块和载体平台，使得载体平台被控制为在槽中移动，并且控制光学模块以产生照射到液体形成材料的光以在其上形成凝固层载体平台。光学模块的图像位置位于液体形成材料中远离罐底部的特定位置，以形成凝固平面，固化平面处的液体形成材料固化并固化以形成凝固层，并且堆叠多个凝固层以形成三维物体。

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