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1. 发明申请

US20210030914A1 AIR PURIFIER AND AUTOMBILE AIR CONDITIONER WITH AIR PURIFIER 有权
公开(公告)号：US20210030914A1
公开(公告)日：2021-02-04
申请号：US16525616
申请日：2019-07-30
申请人： Industrial Technology Research Institute
发明人： Karthickraj Muthuramalingam , Chen-Peng Hsu , Chien-Chun Lu
IPC分类号： A61L9/20 , B01D53/86
摘要： The disclosure is directed to an air purifier and an automobile air conditioner with an air purifier. The air purifier includes a reactor, a column, an air guider and a plurality of light emitting elements. The reactor includes an air inlet and an air outlet. The column is disposed in the reactor, and the column has a N-side walls. The air guider is disposed on the column, and the air guider is coated with a photocatalyst. The light emitting elements are placed on the N side walls of the column configured to irradiate on the photocatalyst, where each of the light emitting elements has an emitting angle of θ and θ*N>360°.

2. 发明授权

US10633264B2 Purifying device 有权
公开(公告)号：US10633264B2
公开(公告)日：2020-04-28
申请号：US15869101
申请日：2018-01-12
申请人： Industrial Technology Research Institute , Changhua Christian Hospital
发明人： Chen-Peng Hsu , Cheng-Da Shaw , Chien-Chun Lu , Yi-Keng Fu , Hung-Ming Wu
IPC分类号： C02F1/32 , C02F1/00
CPC分类号： C02F1/32 , C02F1/002 , C02F2201/326 , C02F2303/04 , C02F2307/02
摘要： A purifying device including a container, at least one cover, a sensing assembly and an ultraviolet source is provided. The container has a containing space, wherein the containing space is adapted to contain a liquid. The cover is adapted to be connected to the container to cover the containing space. The sensing assembly is disposed on the cover, wherein the sensing assembly is adapted to sense a usage state of the cover. The ultraviolet source is disposed on the cover and is adapted to generate an ultraviolet emitted to outside of the cover, wherein the ultraviolet source is turned on or turned off according the usage state of the cover.

3. 发明申请

US20180193499A1 LIGHT SOURCE APPARATUS AND METHOD OF USING THE SAME 审中-公开
公开(公告)号：US20180193499A1
公开(公告)日：2018-07-12
申请号：US15826690
申请日：2017-11-30
申请人： Industrial Technology Research Institute
发明人： Chien-Chun Lu , Chen-Peng Hsu , Yi-Keng Fu , Chia-Fen Hsieh
IPC分类号： A61L2/10 , A61L2/24
摘要： A light source apparatus comprises a main body, a plurality of light source modules and a processor. The main body includes a plurality of configuration areas distributed on a surface of the main body. The plurality of configuration areas is oriented towards different directions, respectively. The plurality of light source modules is located in the plurality of configuration areas, respectively. Each of the plurality of light source modules includes a circuit substrate and an ultraviolet emitting device. The processor is electrically connected to the plurality of light source modules. The processor is adapted to drive the ultraviolet emitting device of each of the plurality of light source modules. A method of using a light source apparatus is also provided.

4. 发明授权

US09391239B2 Light emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US09391239B2
公开(公告)日：2016-07-12
申请号：US14166864
申请日：2014-01-29
申请人： Industrial Technology Research Institute
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Shih-Yi Wen , Chi-Chin Yang , Yu-Hsiang Chang , Re-Ching Lin , Hung-Lieh Hu
IPC分类号： H01L33/40 , H01L33/20 , H01L33/38 , H01L33/48 , H01L33/62
CPC分类号： H01L33/405 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.
摘要翻译：发光二极管包括半导体层叠结构，基板，第一电极，第二电极和第三电极。半导体堆叠结构包括第一半导体层，第二半导体层和发光层。第一半导体层具有彼此相对的第一表面和第二表面，并且具有第一区域和第二区域。第二半导体层设置在第二表面上。发光层设置在第一半导体层和第二半导体层之间。衬底上具有第一导电层和第二导电层。第一电极设置在第二半导体层和第一导电层之间。第二电极设置在第一表面上。第三电极设置在第二区域和第二导电层之间，并且电连接到第二电极。

5. 发明授权

US09231168B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US09231168B2
公开(公告)日：2016-01-05
申请号：US14267919
申请日：2014-05-02
申请人： Industrial Technology Research Institute
发明人： Re-Ching Lin , Shih-Yi Wen , Chen-Peng Hsu , Hung-Lieh Hu , Yu-Chen Yu , Chia-Fen Hsieh
IPC分类号： H01L33/00 , H01L33/50
CPC分类号： H01L33/501
摘要： A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.
摘要翻译：提供了包括芯片载体部分，发光二极管芯片和封装材料的发光二极管封装结构。发光二极管芯片设置在封装的芯片载体部分上。封装材料填充在芯片载体部分中并覆盖发光二极管芯片。包装材料包括基质材料，多个第一粉末颗粒和多个第二粉末颗粒。第一粉末颗粒和第二粉末颗粒分布在基质材料中。每个第一粉末颗粒是波长转换材料。每个第二粉末颗粒具有壳状结构。

6. 发明授权

US11312642B2 Fluid sterilizing device 有权
公开(公告)号：US11312642B2
公开(公告)日：2022-04-26
申请号：US16381816
申请日：2019-04-11
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Chien-Chun Lu , Chen-Peng Hsu , Karthickraj Muthuramalingam
IPC分类号： C02F1/32 , C02F1/00
摘要： A fluid sterilizing device includes a first reaction chamber, a second reaction chamber, a communication chamber and a light source. The first reaction chamber is connected to a fluid inlet. The second reaction chamber is connected to a fluid outlet. The communication chamber is connected the first reaction chamber with the second reaction chamber. The light source is configured to emit sterilization light to enter the first reaction chamber and the second reaction chamber. The fluid inlet allows a fluid to enter the first reaction chamber, the communication chamber allows the fluid to pass through and enter the second reaction chamber, and a flow velocity distribution of the fluid in the second reaction chamber is different from that of the fluid in the first reaction chamber.

7. 发明申请

US20190233309A1 FLUID STERILIZING DEVICE 审中-公开
公开(公告)号：US20190233309A1
公开(公告)日：2019-08-01
申请号：US16381816
申请日：2019-04-11
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Chien-Chun Lu , Chen-Peng Hsu , Karthickraj Muthuramalingam
IPC分类号： C02F1/32
CPC分类号： C02F1/325 , C02F2201/322
摘要： A fluid sterilizing device includes a first reaction chamber, a second reaction chamber, a communication chamber and a light source. The first reaction chamber is connected to a fluid inlet. The second reaction chamber is connected to a fluid outlet. The communication chamber is connected the first reaction chamber with the second reaction chamber. The light source is configured to emit sterilization light to enter the first reaction chamber and the second reaction chamber. The fluid inlet allows a fluid to enter the first reaction chamber, the communication chamber allows the fluid to pass through and enter the second reaction chamber, and a flow velocity distribution of the fluid in the second reaction chamber is different from that of the fluid in the first reaction chamber.

8. 发明授权

US10134963B2 Package structure of an ultraviolet light emitting diode 有权
公开(公告)号：US10134963B2
公开(公告)日：2018-11-20
申请号：US15291043
申请日：2016-10-11
申请人： Industrial Technology Research Institute
发明人： Chien-Chun Lu , Chen-Peng Hsu , Zhi-Wei Koh , Yen-Hsiang Fang
IPC分类号： H01L33/58 , H01L33/48
摘要： A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.

9. 外观设计

USD801181S1 Container 有权
公开(公告)号：USD801181S1
公开(公告)日：2017-10-31
申请号：US29566699
申请日：2016-06-02
申请人： Industrial Technology Research Institute
设计人： Zhi-Wei Koh , Chien-Chun Lu , Chen-Peng Hsu , Yen-Hsiang Fang

10. 发明授权

US09548424B2 Light emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US09548424B2
公开(公告)日：2017-01-17
申请号：US14586925
申请日：2014-12-30
申请人： Industrial Technology Research Institute , TYNTEK CORPORATION
发明人： Chia-Fen Hsieh , Yao-Jun Tsai , Zhi-Wei Koh , Shih-Yi Wen , Chen-Peng Hsu , Chia-Chun Yu , Yen-Chu Li , Chun-Yi Tung
IPC分类号： H01L33/40 , H01L33/20 , H01L33/38 , H01L33/48 , H01L33/62
CPC分类号： H01L33/405 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/486 , H01L33/62 , H01L2224/16225 , H01L2224/17 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.
摘要翻译：发光二极管包括半导体层叠结构，基板，第一电极，第二电极和第三电极。半导体堆叠结构包括第一半导体层，第二半导体层和发光层。在掺杂半导体层上形成具有粗糙结构的光提取层，以提高LED的发光效率。此外，通过光提取层可以提高半导体层叠结构的强度，提高LED的可靠性和制造工序的制造成品率。

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