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1. 发明授权

US06218717B1 Semiconductor pressure sensor and manufacturing method therefof 有权
标题翻译：半导体压力传感器及其制造方法
公开(公告)号：US06218717B1
公开(公告)日：2001-04-17
申请号：US09231799
申请日：1999-01-15
申请人： Inao Toyoda , Hiroaki Tanaka , Noboru Endo
发明人： Inao Toyoda , Hiroaki Tanaka , Noboru Endo
IPC分类号： H01L2982
CPC分类号： G01L9/0054 , G01L9/0042
摘要： A semiconductor pressure sensor includes a semiconductor substrate having a diaphragm portion. A diaphragm formation region including the diaphragm portion is electrically insulated from a peripheral region therearound. Voltage is applied to the diaphragm formation region via a pad and a wire both formed on a surface of the semiconductor substrate, for fixing a potential of the diaphragm formation region when the sensor is put in an operating state. The fixed potential is set to be equal to or higher than a maximum potential of a gauge diffusion resistive layer formed in the diaphragm formation region. As a result, even when the maximum potential of the gauge diffusion resistive layer is a power supply voltage, it can be prevented that current leaks from the gauge diffusion resistive layer.
摘要翻译：半导体压力传感器包括具有隔膜部分的半导体基板。包括隔膜部分的隔膜形成区域与其周边区域电绝缘。电压通过在半导体基板的表面上形成的焊盘和导线施加到隔膜形成区域，用于在传感器处于工作状态时固定隔膜形成区域的电位。固定电位被设定为等于或高于形成在隔膜形成区域中的量规扩散电阻层的最大电位。结果，即使当量规扩散电阻层的最大电位是电源电压时，也可以防止电流从量规扩散电阻层泄漏。

2. 发明授权

US06833599B2 Sensitivity enhancement of semiconductor magnetic sensor 失效
标题翻译：半导体磁传感器的灵敏度增强
公开(公告)号：US06833599B2
公开(公告)日：2004-12-21
申请号：US10374085
申请日：2003-02-27
申请人： Inao Toyoda , Noboru Endo
发明人： Inao Toyoda , Noboru Endo
IPC分类号： H01L2982
CPC分类号： H01L29/82
摘要： A semiconductor magnetic sensor includes a semiconductor substrate, a source, a drain, a gate, and a carrier condensing means. The source and the drain are located in a surface of the substrate. One of the source and the drain includes adjoining two regions. The gate is located between the source and the drain for drawing minority carriers of the substrate to induce a channel, through which the carriers flow between the source and the drain to form a channel carrier current. The carriers flow into the two regions to form two regional carrier currents. The magnitude of a magnetic field where the sensor is placed is measured using the difference in quantity between the two regional carrier currents. The carrier condensing means locally increases carrier density in the channel carrier current in the proximity of an axis that passes between the two regions in order to increase the difference.
摘要翻译：半导体磁传感器包括半导体衬底，源极，漏极，栅极和载流子冷凝装置。源极和漏极位于衬底的表面中。源头和排水渠之一包括毗邻的两个地区。栅极位于源极和漏极之间，用于引导衬底的少数载流子以引起沟道，载流子通过该沟道在源极和漏极之间流动以形成沟道载流子电流。载体流入两个区域以形成两个区域载流子流。使用两个区域载波电流之间的数量差来测量放置传感器的磁场的大小。载流子冷凝装置局部地增加在两个区域之间通过的轴附近的通道载体电流中的载流子密度，以增加差异。

3. 发明授权

US07242065B2 Compact pressure sensor with high corrosion resistance and high accuracy 有权
标题翻译：紧凑型压力传感器，具有高耐腐蚀性和高精度
公开(公告)号：US07242065B2
公开(公告)日：2007-07-10
申请号：US11081525
申请日：2005-03-17
申请人： Ichiharu Kondo , Hiroaki Tanaka , Inao Toyoda , Makoto Totani
发明人： Ichiharu Kondo , Hiroaki Tanaka , Inao Toyoda , Makoto Totani
IPC分类号： H01L29/84 , G01L9/00
CPC分类号： G01L9/0054 , G01L19/148
摘要： A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.
摘要翻译：压力传感器包括传感器芯片和电路芯片。被配置为产生代表被感测的压力的电信号的传感器芯片具有包括感测区域和设置在表面上的多个电接触焊盘的表面。电路芯片包括被配置为处理电信号并且具有设置电路芯片的多个电接触焊盘的表面的电路。电路芯片连接到传感器芯片，使得电路芯片的电接触焊盘分别电连接到传感器芯片的电接触焊盘，电路芯片和传感器芯片的所有电接触焊盘都被密封和隔离流体，并且电路芯片和传感器芯片的表面彼此面对，并且其间具有相同的电接触焊盘。

4. 发明授权

US06973836B2 Semiconductor pressure sensor having diaphragm 失效
标题翻译：具有隔膜的半导体压力传感器
公开(公告)号：US06973836B2
公开(公告)日：2005-12-13
申请号：US10785980
申请日：2004-02-26
申请人： Takashi Katsumata , Inao Toyoda , Hiroaki Tanaka
发明人： Takashi Katsumata , Inao Toyoda , Hiroaki Tanaka
IPC分类号： G01L9/04 , B81B3/00 , G01L1/22 , G01L9/00 , G01L19/04 , H01L29/84
CPC分类号： G01L1/2281 , G01L9/0054 , G01L9/065
摘要： A semiconductor pressure sensor includes a semiconductor substrate having a diaphragm for receiving pressure and a bridge circuit for detecting a distortion of the diaphragm corresponding to the pressure. The bridge circuit includes a pair of first gauge resistors and a pair of second gauge resistors. The first gauge resistors are disposed on a center of the diaphragm, and the second gauge resistors are disposed on a periphery of the diaphragm. Each first gauge resistor has a first resistance, which is larger than a second resistance of each second gauge resistor. The TNO property of the sensor is improved, so that the sensor has high detection accuracy.
摘要翻译：半导体压力传感器包括具有用于接收压力的膜片的半导体衬底和用于检测对应于该压力的膜片的变形的桥接电路。桥接电路包括一对第一规格电阻器和一对第二规格电阻器。第一规格电阻器设置在隔膜的中心，并且第二电阻器设置在隔膜的周边上。每个第一量规电阻器具有大于每个第二规格电阻器的第二电阻的第一电阻。传感器的TNO性能得到改善，传感器检测精度高。

5. 发明申请

US20050166682A1 PRESSURE SENSOR HAVING DIAPHRAGM 有权
标题翻译：带压力传感器的压力传感器
公开(公告)号：US20050166682A1
公开(公告)日：2005-08-04
申请号：US11019286
申请日：2004-12-23
申请人： Hiroaki Tanaka , Inao Toyoda , Yasutoshi Suzuki
发明人： Hiroaki Tanaka , Inao Toyoda , Yasutoshi Suzuki
IPC分类号： G01L1/16 , G01L1/18 , G01L9/00 , G01L9/04 , G01L9/06 , G01L9/08 , G01L19/04 , G01L23/18 , G01L23/22
CPC分类号： G01L1/18 , G01L9/0042 , G01L9/0058 , G01L23/18 , G01L23/22
摘要： A pressure sensor includes: a casing; a sensor chip with a gauge resistor; a boss disposed on the gauge resistor; a metallic diaphragm capable of distorting in accordance with a pressure; and a load transmission member disposed between the metallic diaphragm and the boss. The casing accommodates the sensor chip, the boss and the load transmission member. The casing is covered with the metallic diaphragm. The pressure applied to the diaphragm is detected such that the load corresponding to the pressure is applied to the gauge resistor through the metallic diaphragm, the load transmission member and the boss so that the pressure is measured on the basis of a resistance change of the gauge resistor. The gauge resistor is larger than the boss.
摘要翻译：压力传感器包括：壳体; 具有量规电阻器的传感器芯片; 设在量规电阻上的一个老板; 能够根据压力变形的金属隔膜; 以及设置在所述金属膜和所述凸台之间的载荷传递部件。壳体容纳传感器芯片，凸台和负载传递构件。外壳被金属隔膜覆盖。检测施加到隔膜的压力，使得通过金属隔膜，负载传递构件和凸台将对应于压力的负载施加到量规电阻器，使得基于量规的电阻变化来测量压力电阻。量规电阻大于凸台。

6. 发明授权

US06422088B1 Sensor failure or abnormality detecting system incorporated in a physical or dynamic quantity detecting apparatus 有权
标题翻译：传感器故障或异常检测系统结合在物理或动态量检测装置中
公开(公告)号：US06422088B1
公开(公告)日：2002-07-23
申请号：US09666085
申请日：2000-09-21
申请人： Nobukazu Oba , Yoshifumi Murakami , Yukihiko Tanizawa , Hiroaki Tanaka , Seiichiro Ishio , Inao Toyoda , Yasutoshi Suzuki
发明人： Nobukazu Oba , Yoshifumi Murakami , Yukihiko Tanizawa , Hiroaki Tanaka , Seiichiro Ishio , Inao Toyoda , Yasutoshi Suzuki
IPC分类号： G01L900
CPC分类号： G01L27/007 , G01D3/08 , G01L9/0054 , G01L9/02 , G01R17/10
摘要： A reference voltage generating circuit is constituted by resistors RE and RF each having a resistance not influenced by an application of pressure. The reference voltage generating circuit is connected between one and the other ends of a bridge circuit. A failure judgement of the bridge circuit is performed based on a comparison of a voltage difference VBC between two midpoints B and C of the bridge circuit and voltage differences VCE and VBE between a reference voltage level of the reference voltage generating circuit and the voltage levels of two midpoints B and C.
摘要翻译：参考电压发生电路由电阻器RE和RF构成，每个电阻器不受施加压力的影响。参考电压产生电路连接在桥接电路的一端和另一端之间。基于桥电路的两个中点B和C之间的电压差VBC与参考电压产生电路的参考电压电平之间的电压差VCE和VBE的比较，执行桥电路的故障判断，两个中点B和C.

7. 发明授权

US07176541B2 Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：US07176541B2
公开(公告)日：2007-02-13
申请号：US11137404
申请日：2005-05-26
申请人： Hiroaki Tanaka , Inao Toyoda , Ichiharu Kondo , Makoto Totani
发明人： Hiroaki Tanaka , Inao Toyoda , Ichiharu Kondo , Makoto Totani
IPC分类号： H01L29/84
CPC分类号： G01L19/147 , G01L9/0054
摘要： A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.
摘要翻译：压力传感器芯片包括隔膜和垫片。柔性印刷电路板（FPC）包括具有通孔的树脂片和形成在树脂片内并被密封的布线图案。树脂片被压配合到压力传感器芯片，使得隔膜在通孔处露出。布线图案连接到焊盘，并且布线图案和焊盘之间的接合部用树脂片密封。

8. 发明授权

US06865951B2 Semiconductor pressure sensor 失效
标题翻译：半导体压力传感器
公开(公告)号：US06865951B2
公开(公告)日：2005-03-15
申请号：US10791890
申请日：2004-03-04
申请人： Takashi Katsumata , Inao Toyoda , Hiroaki Tanaka
发明人： Takashi Katsumata , Inao Toyoda , Hiroaki Tanaka
IPC分类号： B81B3/00 , G01L9/00 , G01L9/04 , G01L9/16 , H01L29/84
CPC分类号： G01L9/0054 , G01L9/0042
摘要： In a diaphragm (30) having a square shape comprising four sides of a pair of first sides (31, 32) extending along the crystal axis direction and a pair of second sides (33, 34) extending along the crystal axis direction, when an axis bisecting each of the first sides (31, 32) of the diaphragm (30) and passing through the center point of the diaphragm is set as a first axis K1 and an axis vertically-intersecting to the first axis K1 and passing through the center point of the diaphragm is set as a second axis K2, each of the side gages Rs1, Rs2 is located on a virtual line T1, T2, T3, T4 which extends from the center point of each of the center gages Rc1, Rc2 to the peripheral portion of the diaphragm (30) and intersects to the first axis K1 and the second axis K2 at 45°.
摘要翻译：在具有沿着<110>晶轴方向延伸的一对第一边（31,32）的四边的正方形的隔膜（30）和沿着<110>晶体轴方向延伸的一对第二侧（33,34）当将隔膜（30）的每个第一边（31,32）平分并穿过隔膜的中心点的轴设置为第一轴线K1和与第一轴线垂直相交的轴线时，晶轴方向 K1并且通过隔膜的中心点被设定为第二轴线K2，侧面规格Rs1，Rs2中的每一个位于从中心的每个中心点延伸的虚拟线T1，T2，T3，T4上将Rc1，Rc2测量到隔膜（30）的周边部分，并且以45°与第一轴线K1和第二轴线K2相交。

9. 发明申请

US20050210993A1 Compact pressure sensor with high corrosion resistance and high accuracy 有权
标题翻译：紧凑型压力传感器，具有高耐腐蚀性和高精度
公开(公告)号：US20050210993A1
公开(公告)日：2005-09-29
申请号：US11079475
申请日：2005-03-15
申请人： Inao Toyoda , Hiroaki Tanaka , Ichiharu Kondo , Makoto Totani
发明人： Inao Toyoda , Hiroaki Tanaka , Ichiharu Kondo , Makoto Totani
IPC分类号： B60C23/00 , B60C23/04 , G01L9/00 , G01L9/06 , G01L17/00 , G01L19/06 , G01L19/14 , G01L23/24
CPC分类号： B60C23/0408 , G01L9/0055 , G01L19/0069 , G01L19/0627 , G01L19/147 , G01L23/24
摘要： A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.
摘要翻译：压力传感器主要包括传感器芯片，电路芯片和基板。传感器芯片被配置为产生代表正在感测的压力的电信号，并且包括感测区域和多个接触焊盘。电路芯片包括被配置为处理电信号的电路和多个接触焊盘。基板包括在树脂片内具有开口和多个导体的树脂片。基片连接到传感器芯片和电路芯片上，以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力，传感器芯片和电路芯片的接触垫电气连接到基板的导体，并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

10. 发明申请

US20050205950A1 Compact pressure sensor with high corrosion resistance and high accuracy 有权
标题翻译：紧凑型压力传感器，具有高耐腐蚀性和高精度
公开(公告)号：US20050205950A1
公开(公告)日：2005-09-22
申请号：US11081525
申请日：2005-03-17
申请人： Ichiharu Kondo , Hiroaki Tanaka , Inao Toyoda , Makoto Totani
发明人： Ichiharu Kondo , Hiroaki Tanaka , Inao Toyoda , Makoto Totani
IPC分类号： G01L9/00 , G01L19/06 , H01L29/84
CPC分类号： G01L9/0054 , G01L19/148
摘要： A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.
摘要翻译：压力传感器包括传感器芯片和电路芯片。被配置为产生代表被感测的压力的电信号的传感器芯片具有包括感测区域和设置在表面上的多个电接触焊盘的表面。电路芯片包括被配置为处理电信号并且具有设置电路芯片的多个电接触焊盘的表面的电路。电路芯片连接到传感器芯片，使得电路芯片的电接触焊盘分别电连接到传感器芯片的电接触焊盘，电路芯片和传感器芯片的所有电接触焊盘都被密封和隔离流体，并且电路芯片和传感器芯片的表面彼此面对，并且其间具有相同的电接触焊盘。

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