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1. 发明授权

US07250831B2 Filter comprising inductor, duplexer using the filter and fabricating methods thereof 有权
标题翻译：滤波器包括使用滤波器的电感器，双工器及其制造方法
公开(公告)号：US07250831B2
公开(公告)日：2007-07-31
申请号：US11130156
申请日：2005-05-17
申请人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Hae-seok Park , Seog-woo Hong
发明人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Hae-seok Park , Seog-woo Hong
IPC分类号： H03H9/70 , H03H9/54
CPC分类号： H03H9/564 , H03H3/02 , H03H9/0542 , H03H9/0571 , H03H9/173 , H03H9/568 , H03H9/605 , H03H9/706 , Y10T29/42
摘要： A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected to an external terminal; at least one first film bulk acoustic resonator serially connecting the first port to the second port on the substrate; at least one second film bulk acoustic resonator parallel connected to an interconnection node formed between the first port and the second port; and at least one inductor serially connecting the second film bulk acoustic resonator to the ground port. The inductor included in the filter is fabricated with the first and second film bulk acoustic resonators as one body. Accordingly, a small-sized filter may be fabricated through a simplified process.
摘要翻译：提供了使用气隙型膜体声波谐振器的滤波器。本发明的滤光器包括：基板，其上形成有第一端口，第二端口和接地端口，以连接到外部端子; 将所述第一端口与所述基板上的所述第二端口串联连接的至少一个第一膜体声波谐振器; 至少一个第二膜体声波谐振器并联连接到形成在第一端口和第二端口之间的互连节点; 以及将第二膜体声波谐振器串联连接到接地端口的至少一个电感器。包括在滤波器中的电感器由第一和第二膜体声波谐振器制成为一体。因此，可以通过简化的过程制造小尺寸的过滤器。

2. 发明申请

US20050253668A1 Filter comprising inductor, duplexer using the filter and fabricating methods thereof 有权
标题翻译：滤波器包括使用滤波器的电感器，双工器及其制造方法
公开(公告)号：US20050253668A1
公开(公告)日：2005-11-17
申请号：US11130156
申请日：2005-05-17
申请人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Hae-seok Park , Seog-woo Hong
发明人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Hae-seok Park , Seog-woo Hong
IPC分类号： H01L41/09 , H01L41/187 , H01L41/22 , H01L41/311 , H03H3/02 , H03H9/05 , H03H9/17 , H03H9/54 , H03H9/56 , H03H9/58 , H03H9/60 , H03H9/70
CPC分类号： H03H9/564 , H03H3/02 , H03H9/0542 , H03H9/0571 , H03H9/173 , H03H9/568 , H03H9/605 , H03H9/706 , Y10T29/42
摘要： A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected to an external terminal; at least one first film bulk acoustic resonator serially connecting the first port to the second port on the substrate; at least one second film bulk acoustic resonator parallel connected to an interconnection node formed between the first port and the second port; and at least one inductor serially connecting the second film bulk acoustic resonator to the ground port. The inductor included in the filter is fabricated with the first and second film bulk acoustic resonators as one body. Accordingly, a small-sized filter may be fabricated through a simplified process.
摘要翻译：提供了使用气隙型膜体声波谐振器的滤波器。本发明的滤光器包括：基板，其上形成有第一端口，第二端口和接地端口，以连接到外部端子; 将所述第一端口与所述基板上的所述第二端口串联连接的至少一个第一膜体声波谐振器; 至少一个第二膜体声波谐振器并联连接到形成在第一端口和第二端口之间的互连节点; 以及将第二膜体声波谐振器串联连接到接地端口的至少一个电感器。包括在滤波器中的电感器由第一和第二膜体声波谐振器制成为一体。因此，可以通过简化的过程制造小尺寸的过滤器。

3. 发明授权

US08720023B2 Method of manufacturing a monolithic duplexer 有权
标题翻译：制造单片双工器的方法
公开(公告)号：US08720023B2
公开(公告)日：2014-05-13
申请号：US12647188
申请日：2009-12-24
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/15 , H03H3/007
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A method for fabricating subminiature, high-performance monolithic duplexer is disclosed. The method comprises depositing and patterning a lower electrode on an upper surface of an insulation layer on a substrate, so as to expose a first part of the insulation layer; depositing a piezoelectric layer on an upper surface of the exposed insulation layer and the lower electrode; depositing a metal on the upper part of the piezoelectric layer and patterning the metal to form a resonance part and a trimming inductor, wherein the lower electrode electrically couples the resonance part and the trimming inductor; fabricating air gap type FBARs (film bulk acoustic resonances) by forming a cavity by etching the substrate under the resonance part; and bonding a packaging substrate on the substrate, the packaging substrate having a phase shifting part which substantially prevents inflow of signal between the air gap type FBARs.
摘要翻译：公开了一种用于制造超小型高性能单片双工器的方法。该方法包括在基板上的绝缘层的上表面上沉积和图案化下电极，以暴露绝缘层的第一部分; 在暴露的绝缘层和下电极的上表面上沉积压电层; 在所述压电层的上部沉积金属并图案化所述金属以形成谐振部分和微调电感器，其中所述下部电极电耦合所述谐振部分和所述微调电感器; 通过在谐振部分下蚀刻衬底来形成空腔来制造气隙型FBAR（膜体声共振）; 以及将封装基板接合在所述基板上，所述封装基板具有基本上防止所述气隙型FBAR之间的信号流入的相移部。

4. 发明申请

US20060109065A1 Monolithic duplexer 有权
标题翻译：单片双工器
公开(公告)号：US20060109065A1
公开(公告)日：2006-05-25
申请号：US11262889
申请日：2005-11-01
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/70
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.
摘要翻译：公开了一种超小型高性能单片双工器。单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

5. 发明授权

US07663450B2 Monolithic duplexer 有权
标题翻译：单片双工器
公开(公告)号：US07663450B2
公开(公告)日：2010-02-16
申请号：US11262889
申请日：2005-11-01
申请人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
发明人： Yun-kwon Park , In-sang Song , Seok-chul Yun , Seog-woo Hong , Byeoung-ju Ha , Dong-ha Shim , Hae-seok Park , Kuang-woo Nam , Duck-hwan Kim
IPC分类号： H03H9/70
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706 , Y10T29/42 , Y10T29/43 , Y10T29/4902 , Y10T29/49155
摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.
摘要翻译：公开了一种超小型高性能单片双工器。单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

6. 发明授权

US07498900B2 System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
标题翻译：包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构
公开(公告)号：US07498900B2
公开(公告)日：2009-03-03
申请号：US11517371
申请日：2006-09-08
申请人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
发明人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
IPC分类号： H03H9/00
CPC分类号： H01L27/0805 , H03H9/0571 , H03H9/588 , H03H9/706
摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.
摘要翻译：防止发射机和接收机滤波器之间影响的双工器。双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。因此，可以有效地截获元素之间的物理效应。

7. 发明申请

US20070126527A1 System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
标题翻译：包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构
公开(公告)号：US20070126527A1
公开(公告)日：2007-06-07
申请号：US11517371
申请日：2006-09-08
申请人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
发明人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
IPC分类号： H03H9/70
CPC分类号： H01L27/0805 , H03H9/0571 , H03H9/588 , H03H9/706
摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.
摘要翻译：防止发射机和接收机滤波器之间影响的双工器。双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。因此，可以有效地截获元素之间的物理效应。

8. 发明授权

US07615842B2 Inductor integrated chip 有权
标题翻译：电感集成芯片
公开(公告)号：US07615842B2
公开(公告)日：2009-11-10
申请号：US11473079
申请日：2006-06-23
申请人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H01L29/00
CPC分类号： H03H9/0542 , H03H9/105
摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
摘要翻译：提供一种电感器集成芯片及其制造方法。电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

9. 发明申请

US20070138594A1 Inductor integrated chip and fabrication method thereof 有权
标题翻译：电感集成芯片及其制造方法
公开(公告)号：US20070138594A1
公开(公告)日：2007-06-21
申请号：US11473079
申请日：2006-06-23
申请人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H01L29/00
CPC分类号： H03H9/0542 , H03H9/105
摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
摘要翻译：提供一种电感器集成芯片及其制造方法。电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

10. 发明申请

US20070139139A1 Coupled resonator filter and fabrication method thereof 有权
标题翻译：耦合谐振滤波器及其制造方法
公开(公告)号：US20070139139A1
公开(公告)日：2007-06-21
申请号：US11455190
申请日：2006-06-19
申请人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H03H9/54
CPC分类号： H03H9/584 , H03H3/04 , H03H9/587 , H03H9/588
摘要： A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.
摘要翻译：提供耦合谐振滤波器和制造耦合谐振滤波器的方法。该方法包括：在基板的表面上依次堆叠第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极; 顺序地构图第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极，以暴露第一，第二和第三电极的区域; 形成分别连接到第一，第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

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