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    • 2. 发明授权
    • Absolute image orientation displacement monitoring and manipulation apparatus
    • 绝对图像取向位移监测和操纵装置
    • US08878875B2
    • 2014-11-04
    • US13159227
    • 2011-06-13
    • Ji Hyung ParkDong Wook YoonJoong-Ho LeeKi Won Yeom
    • Ji Hyung ParkDong Wook YoonJoong-Ho LeeKi Won Yeom
    • G06T19/00G06F3/0488G06F3/0484G06F1/16G06T19/20
    • G06T19/20G06F1/1626G06F1/1643G06F1/1694G06F3/04845G06F3/0488G06T2219/2016
    • An image manipulation apparatus for displaying a three-dimensional image of an object displayed on a display apparatus in correspondence with orientation of a mobile apparatus includes: an orientation information processor configured to generate orientation displacement information corresponding to orientation of the mobile apparatus; a renderer configured to generate a rendering image of the three-dimensional image using the three-dimensional image of the object and the orientation displacement information; and a transmitter configured to transmit the rendering image to the display apparatus. An image manipulation method of displaying a three-dimensional image of an object displayed on a display apparatus in correspondence with orientation of a mobile apparatus includes: generating orientation displacement information corresponding to orientation of the mobile apparatus; generating a rendering image of the three-dimensional image using the three-dimensional image and the orientation displacement information; and transmitting the rendering image to the display apparatus.
    • 一种图像处理装置,用于显示与移动装置的方向对应的在显示装置上显示的对象的三维图像,包括:取向信息处理器,被配置为生成与移动装置的取向对应的取向位移信息; 配置为使用所述对象的三维图像和所述取向位移信息生成所述三维图像的再现图像的渲染器; 以及发送器,被配置为将所述再现图像发送到所述显示装置。 根据移动装置的方位显示显示在显示装置上的对象的三维图像的图像处理方法包括:生成与移动装置的取向对应的取向位移信息; 使用所述三维图像和所述取向位移信息生成所述三维图像的再现图像; 以及将所述再现图像发送到所述显示装置。
    • 3. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08279698B2
    • 2012-10-02
    • US13285445
    • 2011-10-31
    • Joong-Ho Lee
    • Joong-Ho Lee
    • G17C7/02
    • G11C11/4097G11C7/02G11C7/1066G11C7/18G11C2207/005
    • A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.
    • 半导体存储器件包括被配置为形成存储单元矩阵并且分别包括第一位线和第二位线的第一和第二子存储器单元区域,以形成对应于预定存储器单元的数据传输路径,附加位线 被配置为跨越第一子存储单元区域并通过与第二位线连接形成数据传送路径;感测和放大单元,被配置为感测和放大通过附加位线和第一位线输入的数据。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08050127B2
    • 2011-11-01
    • US12494844
    • 2009-06-30
    • Joong-Ho Lee
    • Joong-Ho Lee
    • G11C7/02
    • G11C11/4097G11C7/02G11C7/1066G11C7/18G11C2207/005
    • A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.
    • 半导体存储器件包括被配置为形成存储单元矩阵并且分别包括第一位线和第二位线的第一和第二子存储器单元区域,以形成对应于预定存储器单元的数据传输路径,附加位线 被配置为跨越第一子存储单元区域并通过与第二位线连接形成数据传送路径;感测和放大单元,被配置为感测和放大通过附加位线和第一位线输入的数据。
    • 7. 发明授权
    • Semiconductor memory device including repair redundancy memory cell arrays
    • 包括修复冗余存储单元阵列的半导体存储器件
    • US08000158B2
    • 2011-08-16
    • US12490690
    • 2009-06-24
    • Joong-Ho Lee
    • Joong-Ho Lee
    • G11C7/00
    • G11C29/838G11C29/24G11C29/816
    • A semiconductor memory device includes a plurality of memory cell matrixes each of which contains plural memory cell arrays whose number is lager than 2n and smaller than 2n+1, n being a natural number. The semiconductor memory device includes normal memory cell arrays including 2m numbers of memory cell arrays of the plurality of memory cell matrixes, m being a bit of addresses, wherein a data access operation is performed on normal memory cells in the normal memory cell arrays as normal word lines corresponding to the normal memory cells are activated in response to the addresses, and additional redundancy memory cell arrays in the plurality of memory cell matrixes, wherein repair-expected memory cells in the normal memory cell arrays are replaced with the additional redundancy memory cell arrays as redundancy word lines corresponding to the additional redundancy memory cells are activated in response to the addresses corresponding to the repair-expected memory cells.
    • 半导体存储器件包括多个存储单元矩阵,每个存储单元矩阵包含多于2n并且小于2n + 1的多个存储单元阵列,n是自然数。 半导体存储器件包括包括多个存储单元矩阵的2m个存储单元阵列的正常存储单元阵列,m是地址位,其中在正常存储单元阵列中的正常存储单元上执行数据访问操作,如正常 对应于正常存储器单元的字线响应于地址被激活,并且多个存储单元矩阵中的附加冗余存储单元阵列,其中正常存储器单元阵列中的修复预期存储单元被替换为附加冗余存储单元 对应于附加冗余存储单元的冗余字线的阵列响应于对应于修复预期存储单元的地址被激活。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100290296A1
    • 2010-11-18
    • US12490690
    • 2009-06-24
    • Joong-Ho Lee
    • Joong-Ho Lee
    • G11C29/00
    • G11C29/838G11C29/24G11C29/816
    • A semiconductor memory device includes a plurality of memory cell matrixes each of which contains plural memory cell arrays whose number is lager than 2n and smaller than 2n+1, n being a natural number. The semiconductor memory device includes normal memory cell arrays including 2m numbers of memory cell arrays of the plurality of memory cell matrixes, m being a bit of addresses, wherein a data access operation is performed on normal memory cells in the normal memory cell arrays as normal word lines corresponding to the normal memory cells are activated in response to the addresses, and additional redundancy memory cell arrays in the plurality of memory cell matrixes, wherein repair-expected memory cells in the normal memory cell arrays are replaced with the additional redundancy memory cell arrays as redundancy word lines corresponding to the additional redundancy memory cells are activated in response to the addresses corresponding to the repair-expected memory cells.
    • 半导体存储器件包括多个存储单元矩阵,每个存储单元矩阵包含多于2n并且小于2n + 1的多个存储单元阵列,n是自然数。 半导体存储器件包括包括多个存储单元矩阵的2m个存储单元阵列的正常存储单元阵列,m是地址位,其中在正常存储单元阵列中的正常存储单元上执行数据访问操作,如正常 对应于正常存储器单元的字线响应于地址被激活,并且多个存储单元矩阵中的附加冗余存储单元阵列,其中正常存储器单元阵列中的修复预期存储单元被替换为附加冗余存储单元 对应于附加冗余存储单元的冗余字线的阵列响应于对应于修复预期存储单元的地址被激活。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY APPARATUS
    • 半导体存储器
    • US20090147614A1
    • 2009-06-11
    • US12170262
    • 2008-07-09
    • Joong-Ho Lee
    • Joong-Ho Lee
    • G11C8/00
    • G11C11/4097G11C7/02G11C7/08G11C7/12G11C7/18G11C11/4091G11C11/4094
    • A semiconductor memory includes a cell mat configured to include a plurality of memory cells to which a first bit line pair or a second bit line pair is connected; a sense amplifier configured to amplify a positive sensing line and a negative sensing line in response to a first bit line equalize signal; a column selecting unit configured to connect the positive sensing line and the negative sensing line to a first data bus and a second data bus, respectively, in response to a column selection signal; and a share control unit configured to connect the positive sensing line and a positive first bit line of the first bit line pair or a positive second bit line of the second bit line pair in response to a second bit line equalize signal, a positive share control signal and a negative share control signal.
    • 半导体存储器包括被配置为包括连接第一位线对或第二位线对的多个存储单元的单元阵列; 感测放大器,被配置为响应于第一位线均衡信号放大正感测线路和负感测线路; 列选择单元,被配置为分别响应于列选择信号将正感测线和负感测线连接到第一数据总线和第二数据总线; 以及共享控制单元,被配置为响应于第二位线均衡信号,连接第一位线对的正感测线和正的第一位线或第二位线对的正的第二位线,正共享控制 信号和负共享控制信号。