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1. 发明专利

JP2011085713A Photosensitive resin composition, method for manufacturing circuit board with metal support using the same, and the circuit board with the metal support 有权
标题翻译：光敏树脂组合物，使用金属支持制造电路板的方法以及具有金属支持的电路板
公开(公告)号：JP2011085713A
公开(公告)日：2011-04-28
申请号：JP2009237769
申请日：2009-10-14
申请人： Idemitsu Kosan Co Ltd , Nitto Denko Corp , 出光興産株式会社 , 日東電工株式会社
发明人： FUJII HIROFUMI , HIRASHIMA KATSUTOSHI , TAMURA YASUSHI
IPC分类号： G03F7/004 , G03F7/037 , G03F7/38 , G03F7/40
CPC分类号： H05K1/056 , C08K5/20 , C08K5/3417 , C08K5/3432 , G03F7/0045 , G03F7/0048 , G03F7/0387 , H05K3/0023 , H05K3/287 , H05K2201/0154 , C08L79/04
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of reducing stress generation caused by heat history such as heat treatment, and to provide a method for manufacturing a circuit board with a metal support using the resin composition.
SOLUTION: The photosensitive resin composition contains polyamide acid (A), a dihydropyridine derivative (B), and an amide compound (C) as a solvent. A coating comprising the photosensitive resin composition is formed on the metal support, and subjected to exposure, development and further heating treatment, to thereby form an insulating layer comprising a polyimide film. Then, after forming a conductive layer comprising a prescribed wiring circuit pattern on the insulating layer, the coating comprising the photosensitive resin composition is formed on the conductive layer, and subjected to exposure, development and further heating treatment, to form a coating layer comprising the polyimide film on the conductive layer, and to thereby manufacture the circuit board with the metal support.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供能够减少由热处理引起的热历史引起的应力产生的感光性树脂组合物，并提供使用该树脂组合物制造具有金属载体的电路板的方法。光敏树脂组合物含有聚酰胺酸（A），二氢吡啶衍生物（B）和作为溶剂的酰胺化合物（C）。在金属载体上形成包含感光性树脂组合物的涂层，进行曝光，显影和进一步的加热处理，从而形成包含聚酰亚胺膜的绝缘层。然后，在绝缘层上形成包含规定布线电路图形的导电层之后，在导电层上形成包含感光性树脂组合物的涂层，进行曝光，显影和进一步的加热处理，形成包含聚酰亚胺膜，并且由此制造具有金属支撑体的电路板。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009098455A Photosensitive resin composition, and flexible printed wiring circuit board having cover insulating layer obtained by using same 审中-公开
标题翻译：光敏树脂组合物和具有使用相同绝缘层的柔性印刷电路板
公开(公告)号：JP2009098455A
公开(公告)日：2009-05-07
申请号：JP2007270506
申请日：2007-10-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUJII HIROFUMI , HIRASHIMA KATSUTOSHI , MIZUTANI MASANORI , JO KYOYU
IPC分类号： G03F7/033 , C08G59/40 , G03F7/027 , G03F7/032 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition of a flexible printed wiring circuit board with no tack or few tack. SOLUTION: The photosensitive resin composition contains the following (A)-(D): (A) a carboxyl group-containing linear polymer obtained by addition polymerization of an ethylenic unsaturated compound containing a structural unit of specific hydroxyethyl (meta) acrylate derivative at a ratio of 5-50 wt.% with respect to the entire polymer; (B) an epoxy resin; (C) an ethylenic unsaturated group-containing polymerizable compound; and (D) a photopolymerization initiator. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷布线电路板的感光性树脂组合物，其不粘性或粘性很小。解决方案：感光性树脂组合物含有下述（A） - （D）：（A）含有含有特定羟乙基（甲基）丙烯酸酯的结构单元的烯键式不饱和化合物的含羧基线性聚合物衍生物相对于整个聚合物的5-50重量％的比例; （B）环氧树脂（C）含烯属不饱和基团的可聚合化合物; 和（D）光聚合引发剂。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008243957A Method of manufacturing wiring circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2008243957A
公开(公告)日：2008-10-09
申请号：JP2007079623
申请日：2007-03-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , FUJII HIROFUMI
IPC分类号： H05K3/28 , G03F7/004 , G03F7/20
CPC分类号： G03F7/2004 , G03F7/027 , G03F7/038 , H05K3/0023 , H05K3/0082 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board for suppressing deposition of additive from a solder resist layer, especially deposition of additive under high temperature/high humidity atmosphere, and for improving curability of the solder resist layer. SOLUTION: A prescribed conductor circuit 2 pattern is formed on a base 1. A photosensitive resin composition layer is formed on a conductor circuit 2 pattern forming face by using a photosensitive resin composition. A photosensitive resin composition layer face is irradiated with an active beam through a photomask of a prescribed pattern so as to expose it. The solder resist layer 3a of the prescribed pattern is formed by using developer. The formed solder resist layer 3a is irradiated with ultraviolet rays by using a low pressure mercury lamp. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造布线电路板的方法，用于抑制添加剂从阻焊层沉积，特别是在高温/高湿度气氛下沉积添加剂，并提高阻焊层的固化性。解决方案：在基座1上形成规定的导体电路2图案。通过使用感光性树脂组合物，在导体电路2图案形成面上形成感光性树脂组合物层。通过具有规定图案的光掩模，用活性光束照射感光性树脂组合物层面，使其曝光。通过使用显影剂形成规定图案的阻焊层3a。通过使用低压汞灯照射形成的阻焊层3a的紫外线。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007027450A Reusing method of cleaning member for substrate processing device 有权
标题翻译：衬底加工装置清洗构件的再利用方法
公开(公告)号：JP2007027450A
公开(公告)日：2007-02-01
申请号：JP2005208033
申请日：2005-07-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAMIKAWA AKIRA , TERADA YOSHIO , FUJII HIROFUMI , ISHIZAKA HITOSHI
IPC分类号： H01L21/304 , C09J7/02 , C09J11/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To enable a substrate processing device cleaning member to be reused by removing a cleaning layer to which foreign objects are attached from a substrate using an adhesive tape, when the substrate processing device cleaning member is reused by replacing a cleaning layer to which foreign objects are attached with a new cleaning layer.
SOLUTION: A reusing method of the substrate processing device cleaning member comprises processes of pasting the adhesive tape on the cleaning layer, fixing the cleaning layer on the adhesive tape, and then removing off the adhesive tape and the cleaning layer together from the substrate is reused when the substrate processing device cleaning member equipped with the cleaning layer on a substrate. Especially, a material capable of permeating into the cleaning layer or a material capable of improving an affinity for the cleaning layer, is contained in the adhesive agent of the adhesive tape, so as to work as a means of fixing the cleaning layer firmly on the adhesive tape in the reusing method of the substrate processing device cleaning member.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了使基板处理装置清洁部件能够通过使用胶带从基板上去除附着有异物的清洁层而重新使用，当基板处理装置清洁部件通过更换外部物体附着有新的清洁层的清洁层。解决方案：基板处理装置清洁部件的再利用方法包括将粘合带粘贴在清洁层上，将清洁层固定在粘合带上，然后将粘合带和清洁层从当在衬底上配备有清洁层的衬底处理装置清洁构件时，衬底被重新使用。特别地，粘合剂粘合剂中含有能够渗透到清洁层中的材料或能够改善对清洁层的亲和性的材料，以便将清洁层牢固地固定在粘合剂上在基板处理装置清洁部件的再利用方法中的胶带。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006303337A Conveyance member with cleaning function and method of cleaning substrate processor 审中-公开
标题翻译：具有清洁功能的输送构件和清洁基板处理器的方法
公开(公告)号：JP2006303337A
公开(公告)日：2006-11-02
申请号：JP2005125940
申请日：2005-04-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AMANO YASUHIRO , NAMIKAWA AKIRA , TERADA YOSHIO , FUJII HIROFUMI
IPC分类号： H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a conveyance member with a cleaning function capable of well carrying in a substrate processor and simply and surely cleaning off foreign matters attaching in the processor by the conveyance.
SOLUTION: In the conveyance member with a cleaning function having a cleaning layer made of a heat-resistant polymer resin on at least one of surfaces of the member, the cleaning layer has surface free energy of 25 mJ/m
2 or more and Vicker's hardness of 15 or larger.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够良好地承载在基板处理器中的清洁功能的输送构件，并且通过输送简单且可靠地清除附着在处理器中的异物。解决方案：在具有清洁功能的传送构件中，在该构件的至少一个表面上具有由耐热聚合物树脂制成的清洁层，清洁层具有25mJ / m 2的表面自由能< 2 或更高，维氏硬度为15或更大。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005206786A Heat resistant resin composition and dust removing substrate using the same 审中-公开
标题翻译：耐热树脂组合物，并使用其除尘基材
公开(公告)号：JP2005206786A
公开(公告)日：2005-08-04
申请号：JP2004183788
申请日：2004-06-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUJII HIROFUMI , UENDA DAISUKE , TERADA YOSHIO , FUNATSU ASAMI , NAMIKAWA AKIRA , MARUOKA NOBUAKI , ISHIZAKA HITOSHI , AMANO YASUHIRO
IPC分类号： C08G73/10
摘要： PROBLEM TO BE SOLVED: To obtain a heat resistant resin, which can be used for HDD and parts of semiconductors, or the like, in a situation where the occurrence of a considerable damage is presumed by silicone contamination, and can be used specifically for dust removal, and to provide further a dust removing substrate using the same.
SOLUTION: The heat resistant resin is prepared from a secondary diamine compound containing a butadiene-acrylonitrile copolymer structure and a tetracarboxylic acid anhydride. The dust removing substrate is prepared by using this resin.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得可用于HDD和半导体部件等的耐热性树脂，在由硅氧烷污染推定出现相当大的损坏的情况下，并且可以使用专门用于除尘，并且还提供使用其的除尘基板。解决方案：耐热树脂由含有丁二烯 - 丙烯腈共聚物结构的二胺化合物和四羧酸酐制备。通过使用该树脂制备除尘基板。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2009098456A Photosensitive resin composition and flexible printed wiring circuit board having cover insulating layer obtained by using same 有权
标题翻译：光敏树脂组合物和柔性印刷线路板具有使用相同的绝缘层绝缘层
公开(公告)号：JP2009098456A
公开(公告)日：2009-05-07
申请号：JP2007270507
申请日：2007-10-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUJII HIROFUMI , HIRASHIMA KATSUTOSHI , MIZUTANI MASANORI , JO KYOYU
IPC分类号： G03F7/027 , C08F2/44 , C08F220/36 , C08G59/42 , G03F7/004 , G03F7/033 , H05K3/28
CPC分类号： H05K3/287 , G03F7/027 , G03F7/033 , G03F7/038 , H05K1/0393
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can suppress deposition of a contained composition, and prevent contamination of a product or the like as well as can achieve excellent flame retardancy, resolution property, and flexibility. SOLUTION: The photosensitive resin composition includes the following (A)-(E). The photosensitive resin composition contains the (A) component at a ratio of 5-30 wt.% with respect to the whole photosensitive resin composition. (A) is a cyclic phosphazene compound of a specific structure. (B) is a carboxyl group containing linear polymer obtained by addition polymerization of an ethylenic unsaturated compound. (C) is an epoxy resin. (D) is an ethylenic unsaturated group-containing polymerizable compound, and (E) is a photopolymerization initiator. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题的方案：提供能够抑制所含组合物的沉积，防止产品等的污染以及可以获得优异的阻燃性，分辨性和柔软性的感光性树脂组合物。光敏树脂组合物包含以下（A） - （E）。感光性树脂组合物相对于整个感光性树脂组合物含有比例为5-30重量％的（A）成分。（A）是具体结构的环状磷腈化合物。（B）是通过烯属不饱和化合物的加成聚合获得的含有羧基的线性聚合物。（C）是环氧树脂。（D）是含烯属不饱和基团的聚合性化合物，（E）是光聚合引发剂。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008083683A Photosensitive resin composition for flexible circuit board and flexible circuit board obtained by using the same 审中-公开
标题翻译：用于柔性电路板和使用该柔性电路板的柔性电路板的感光性树脂组合物
公开(公告)号：JP2008083683A
公开(公告)日：2008-04-10
申请号：JP2007180838
申请日：2007-07-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUJII HIROFUMI , MORITA KOSUKE , MIZUTANI MASANORI , OKAWA TADAO , YOSHIMI TAKESHI , TADA KOICHIRO , ONISHI KENJI
IPC分类号： G03F7/004 , C08F290/06 , C08F299/00 , C08G59/20 , C08G59/42 , G03F7/027 , G03F7/033 , H05K3/28
CPC分类号： H05K3/287 , C08F2/50 , C08K5/103 , C08K5/49 , C08L63/00 , C08L2205/02 , C09D4/06 , C09D133/14 , G03F7/027 , G03F7/038 , H05K1/0393 , H05K2201/012
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible circuit board having excellent flame retardancy and with non-halogenation for consideration of environmental aspects, and to provide the flexible circuit board obtained by using the same. SOLUTION: The photosensitive resin composition for the flexible circuit board includes (A) a linear polymer containing a carboxyl group obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; (C) a photopolymerization initiator; and (D) a phosphorated epoxy resin containing phosphorous atoms at ≥2 wt.% based on a total molecular weight thereof. The flexible circuit board is obtained by forming a photosensitive resin composition layer on a conductor circuit pattern by using the photosensitive resin composition; and exposing the layer in a prescribed pattern; and developing it to form a cover insulation layer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：提供一种用于考虑环境方面的具有优异的阻燃性和非卤化性的柔性电路板的感光性树脂组合物，并提供通过使用该柔性电路板获得的柔性电路板。解决方案：用于柔性电路板的感光性树脂组合物包括（A）含有通过加成聚合烯属不饱和化合物而得到的羧基的线性聚合物; （B）含有烯属不饱和基团的聚合性化合物; （C）光聚合引发剂; 和（D）磷酸化环氧树脂，其含有基于其总分子量为≥2重量％的磷原子。柔性电路板是通过使用感光性树脂组合物在导体电路图案上形成感光性树脂组合物而获得的; 并以规定的图案曝光该层; 并开发它以形成覆盖绝缘层。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005301072A Method for manufacturing resin transfer material 审中-公开
标题翻译：制造树脂转移材料的方法
公开(公告)号：JP2005301072A
公开(公告)日：2005-10-27
申请号：JP2004119426
申请日：2004-04-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAGUCHI YOSHIO , MIZUTANI MASANORI , FUJII HIROFUMI
IPC分类号： G03F7/004
摘要： PROBLEM TO BE SOLVED: To provide a resin transfer material, free of remaining of a resin layer in unwanted portions and capable of attaining reliable pattern formation, when being patterned after transfer, and capable of improving reliability. SOLUTION: A resin layer 2, comprising a photosensitive polyamic acid resin, is formed on a first release material 1, and the resin layer 2 formed on the first release material 1 is stuck on a second release material 4 and peeled from the first release material 1 to form the objective resin transfer material 5 with the resin layer 2 formed on the second release material 4. COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2010107624A Photosensitive resin composition, method for producing flexible printed wiring board using the same, and flexible printed wiring board having cover insulation layer 有权
标题翻译：感光性树脂组合物，使用其的柔性印刷布线板的制造方法，以及具有覆盖绝缘层的柔性印刷布线板
公开(公告)号：JP2010107624A
公开(公告)日：2010-05-13
申请号：JP2008277830
申请日：2008-10-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , FUJII HIROFUMI , HIRASHIMA KATSUTOSHI
IPC分类号： G03F7/033 , C08F30/02 , G03F7/004 , G03F7/027 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible printed wiring board, including no halogen with consideration given to an environment, having excellent flame retardancy and insulation reliability, and forming a cover insulation layer which hardly causes deposition of a flame retardant component. SOLUTION: The photosensitive resin composition includes: a linear polymer (A) containing a structural unit represented by the residue of a compound, wherein a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is added to a (meth)acryloyl group in an allyl (meth)acrylate, and a carboxyl group; an ethylenically unsaturated group-containing polymerizable compound (B); a photopolymerization initiator (C); and a thermosetting compound (D). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了提供一种考虑到环境而不含卤素的柔性印刷电路板用感光性树脂组合物，具有优异的阻燃性和绝缘可靠性，并且形成难以沉积的绝缘层阻燃组分。光敏树脂组合物包括：含有由化合物残基表示的结构单元的线性聚合物（A），其中加入9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物（甲基）丙烯酸烯丙酯中的（甲基）丙烯酰基和羧基; 含烯键式不饱和基团的可聚合化合物（B）; 光聚合引发剂（C）; 和热固性化合物（D）。版权所有（C）2010，JPO＆INPIT

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