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1. 发明专利

JP2011153193A Phosphorus-containing vinyl monomer, process for producing the same, phosphorus-containing polymerized product using the process and resin composition containing the polymerized product 审中-公开
标题翻译：含有含磷的乙烯基单体，其制造方法，使用该方法的含磷聚合物和含有聚合物的树脂组合物
公开(公告)号：JP2011153193A
公开(公告)日：2011-08-11
申请号：JP2010014822
申请日：2010-01-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , HIRASHIMA KATSUTOSHI
IPC分类号： C08F18/12 , C07F9/6574 , C08F2/44 , C08F218/12 , G03F7/027 , G03F7/033
摘要： PROBLEM TO BE SOLVED: To provide a phosphorus-containing vinyl monomer which takes an environmental aspect by being non-halogenated into consideration, has excellent flame retardance, and can inhibit the exudation and deposition of a flame retardant component and a process for producing the same. SOLUTION: The phosphorus-containing vinyl monomer is obtained by reacting a substituted or nonsubstituted 9,10-dihydro-9-oxa-10-phospha/phenanthrene-10-oxide with an α, β-unsaturated carboxylic acid ester of a terminal-unsaturated alcohol. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供考虑到非卤化而具有环境方面的含磷乙烯基单体，具有优异的阻燃性，并且可以抑制阻燃组分的渗出和沉积以及用于生产相同。解决方案：含磷乙烯基单体是通过使取代或未取代的9,10-二氢-9-氧杂-10-磷/菲-10-氧化物与α，β-不饱和羧酸酯末端不饱和醇。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009276725A Photosensitive resin composition, and method for manufacturing flexible printed wiring circuit board and flexible printed wiring circuit board with cover insulating layer using the same 审中-公开
标题翻译：光敏性树脂组合物及其制造方法，用于制造柔性印刷线路板和具有覆盖绝缘层的柔性印刷电路板
公开(公告)号：JP2009276725A
公开(公告)日：2009-11-26
申请号：JP2008130728
申请日：2008-05-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , HIRASHIMA KATSUTOSHI , FUJII HIROFUMI
IPC分类号： G03F7/033 , C08F2/44 , C08F20/30 , C08F30/00 , C08G59/42 , G03F7/004 , G03F7/027 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible printed wiring circuit board, which can form a cover insulating layer which is excellent in resistance to the heat of soldering, insulation reliability and folding endurance and is excellent in flame retardancy without using halogen in consideration of the environment. SOLUTION: The photosensitive resin composition comprises (A) a linear polymer including a specific (meth)acrylic ester structural unit having a carboxyl group in a terminal, (B) an ethylenically unsaturated group-containing polymerizable compound, and (D) a thermosetting compound having a functional group which heat-crosslinks with the carboxyl group of the (meth)acrylic ester structural unit included in the linear polymer (A). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷布线电路板的感光性树脂组合物，其可以形成耐焊接热性，绝缘可靠性和耐折性优异且阻燃性优异的覆盖绝缘层考虑到环境而不使用卤素的阻滞性。光敏树脂组合物包含（A）包含末端具有羧基的特定的（甲基）丙烯酸酯结构单元的线性聚合物，（B）含烯属不饱和基团的聚合性化合物，（D）具有与线性聚合物（A）中所含的（甲基）丙烯酸酯结构单元的羧基热交联的官能团的热固化性化合物。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2005005355A Dicing die-bonded film 审中-公开
标题翻译：定制胶带
公开(公告)号：JP2005005355A
公开(公告)日：2005-01-06
申请号：JP2003164721
申请日：2003-06-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUMURA TAKESHI , MIZUTANI MASANORI , MISUMI SADAHITO
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/58 , H01L21/68
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a dicing die-bonded film that is excellent in balance characteristics between the holding force required at the time of dicing a work and the peelable property required at the time of peeling a chip-like work obtained by dicing integrally with its die bonding adhesive layer. SOLUTION: The dicing die-bonded film has an adhesive layer (2) on a supporting substrate (1) and the die bonding adhesive layer (3) on the adhesive layer (2). The surface of the adhesive layer (2) is formed to have a contact angle θ of ≥70° to methylene iodide. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种切割模压接合薄膜，其在切割工作时所需的保持力与剥离所获得的芯片状工件时所需的可剥离性之间具有优异的平衡特性通过与其芯片粘合粘合剂层一体地切割。解决方案：切割模片粘合膜在支撑基板（1）上具有粘合剂层（2）和粘合剂层（2）上的芯片粘合层（3）。粘合剂层（2）的表面与二碘甲烷形成接触角θ≥70°。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004231932A Adhesive composition, adhesive film, and semiconductor device using this 审中-公开
公开(公告)号：JP2004231932A
公开(公告)日：2004-08-19
申请号：JP2003152683
申请日：2003-05-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MISUMI SADAHITO , MATSUMURA TAKESHI , MIZUTANI MASANORI
IPC分类号： C09J7/00 , C08G59/18 , C09J11/00 , C09J109/02 , C09J113/00 , C09J161/10 , C09J163/00 , C09J163/02 , C09J163/04 , C09J175/04 , H01L21/52
CPC分类号： C09J163/00 , C08G59/188 , C08L2666/02 , C08L2666/08 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming an adhesive film excellent in storage stability, and giving stable fixing strength without variation in a coated amount when used for fixing a semiconductor chip to an electrode member, and to provide an adhesive film (for die-bonding) obtained from the composition. SOLUTION: This adhesive composition comprises an epoxy resin (A), a phenolic resin (B), a synthetic rubber (C) and a curing accelerator-containing microcapsule (D) having a core/shell structure in which a core part containing the curing accelerator is encapsulated in a shell part formed of a thermoplastic resin. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2011134778A Developing device, developing method, and manufacturing method of wiring circuit board 审中-公开
标题翻译：开发设备，开发方法和线路板制造方法
公开(公告)号：JP2011134778A
公开(公告)日：2011-07-07
申请号：JP2009290804
申请日：2009-12-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAWAMURA YOSHIHIRO , MIZUTANI MASANORI , BABA TOSHIKAZU
IPC分类号： H05K3/06 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a developing device which can obtain a high-reliability resist layer, and to provide a developing method and a manufacturing method for a wiring circuit board.
SOLUTION: A conductor pattern 10b is formed on an insulating layer 10a. One face of a photosensitive resist film SR is stuck on the insulating layer 10a, including the conductor pattern 10b, and an intermediate sheet TU is formed. A support film F2 is stuck on the other face of the photosensitive resist film SR. Then, the photosensitive resist film SR is exposed. In the developing device 400, the support film F2 is peeled from the photosensitive resist film SR and developer is supplied so that it is brought into contact with a boundary of a sticking part and a peeling section of the photosensitive resist film SR and the support film F2; and the photosensitive resist film SR is developed, and the wiring circuit board is completed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可获得高可靠性抗蚀剂层的显影装置，并提供一种用于布线电路板的显影方法和制造方法。解决方案：导体图案10b形成在绝缘层10a上。感光性抗蚀剂膜SR的一面粘贴在包含导体图案10b的绝缘层10a上，形成中间片TU。支撑膜F2粘附在感光抗蚀剂膜SR的另一面上。然后，曝光光敏抗蚀剂膜SR。在显影装置400中，支撑膜F2从光敏抗蚀剂膜SR剥离，并且提供显影剂，使其与光敏抗蚀剂膜SR和支撑膜的粘着部分和剥离部分的边界接触 F2; 并且感光性抗蚀剂膜SR显影，并且布线电路板完成。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010107624A Photosensitive resin composition, method for producing flexible printed wiring board using the same, and flexible printed wiring board having cover insulation layer 有权
标题翻译：感光性树脂组合物，使用其的柔性印刷布线板的制造方法，以及具有覆盖绝缘层的柔性印刷布线板
公开(公告)号：JP2010107624A
公开(公告)日：2010-05-13
申请号：JP2008277830
申请日：2008-10-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , FUJII HIROFUMI , HIRASHIMA KATSUTOSHI
IPC分类号： G03F7/033 , C08F30/02 , G03F7/004 , G03F7/027 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible printed wiring board, including no halogen with consideration given to an environment, having excellent flame retardancy and insulation reliability, and forming a cover insulation layer which hardly causes deposition of a flame retardant component. SOLUTION: The photosensitive resin composition includes: a linear polymer (A) containing a structural unit represented by the residue of a compound, wherein a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is added to a (meth)acryloyl group in an allyl (meth)acrylate, and a carboxyl group; an ethylenically unsaturated group-containing polymerizable compound (B); a photopolymerization initiator (C); and a thermosetting compound (D). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了提供一种考虑到环境而不含卤素的柔性印刷电路板用感光性树脂组合物，具有优异的阻燃性和绝缘可靠性，并且形成难以沉积的绝缘层阻燃组分。光敏树脂组合物包括：含有由化合物残基表示的结构单元的线性聚合物（A），其中加入9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物（甲基）丙烯酸烯丙酯中的（甲基）丙烯酰基和羧基; 含烯键式不饱和基团的可聚合化合物（B）; 光聚合引发剂（C）; 和热固性化合物（D）。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2006301186A Photosensitive resin composition and wiring circuit board obtained using same 审中-公开
标题翻译：使用相同的感光树脂组合物和接线电路板
公开(公告)号：JP2006301186A
公开(公告)日：2006-11-02
申请号：JP2005121095
申请日：2005-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI , ONISHI KENJI
IPC分类号： G03F7/032 , G03F7/004 , G03F7/027 , G03F7/033 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in tackiness, folding endurance, low stress property and resistance to the heat of soldering and having good alkali developability and insulation, and to provide a wiring circuit board obtained using the same. SOLUTION: The photosensitive resin composition contains (A) a carboxyl group-containing linear polymer, (B) a polymerizable compound containing an ethylenically unsaturated group, (C) a photopolymerization initiator, (D) an epoxy resin represented by formula (1) and (E) at least one of a bisphenol A type epoxy resin having a weight average molecular weight of 900-60,000 and a bisphenol F type epoxy resin having a weight average molecular weight of 900-60,000. The photosensitive resin composition has a storage elastic modulus at 25°C before ultraviolet exposure being 10-800 MPa. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供粘合性，耐折性，低应力性和耐焊接热性以及良好的碱显影性和绝缘性优异的感光性树脂组合物，并且提供一种使用其获得的布线电路板。光敏树脂组合物含有（A）含羧基的线型聚合物，（B）含有烯属不饱和基团的聚合性化合物，（C）光聚合引发剂，（D）式（D）表示的环氧树脂 1）和（E）重均分子量为900〜60,000的双酚A型环氧树脂和重均分子量为900〜600,000的双酚F型环氧树脂中的至少一种。感光性树脂组合物在紫外线照射之前的25℃下的储能弹性模量为10〜800MPa。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2015030765A 粘着シート、粘着層付き光学フィルム、および画像表示装置审中-公开
标题翻译：压敏粘合片，带压敏粘合层的光学胶片和图像显示装置
公开(公告)号：JP2015030765A
公开(公告)日：2015-02-16
申请号：JP2013159586
申请日：2013-07-31
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： MIZUTANI MASANORI , FUJITA MASAHITO , MOTEGI YUSUKE , OGASAWARA AKIKO
IPC分类号： C09J7/00 , C09J7/02 , C09J133/04 , C09J133/14
摘要：【課題】前面透明板、タッチパネル、画像表示パネルの間の貼り合わせに用いた際に、画像表示装置の表示ムラが抑制され、かつ端面からのはみ出しの少ない粘着シート、ならびに当該粘着シートを備える光学フィルムおよび画像表示装置を提供する。【解決手段】本発明粘着シートは、50℃,0.01Hzにおける損失正接tanδが0.60以上であり、かつ50℃,0.001Hzにおける損失正接tanδが1.00以下であることが好ましい。本発明の粘着シート22は、例えば、印刷段差部70aを有する前面透明板70と画像表示パネル60表面に配置される光学フィルム10との貼り合わせに用いられる。【選択図】図1
摘要翻译：要解决的问题：提供一种抑制图像显示装置的显示不规则性并且在用于前透明板，触摸面板和图像显示器之间的接合时从端面几乎不挤出的压敏粘合片并提供包括该压敏粘合片的光学膜和图像显示装置。解决方案：压敏粘合片优选在50℃和0.01Hz下显示出0.60以上的损耗角正切tanδ和损耗角正切在50℃和0.001Hz下tanδ为1.00以下。例如，使用压敏粘合片22来粘合具有印刷台阶部分70a的前透明板70和设置在图像显示面板60的表面上的光学膜10。

9. 发明专利

JP2014156552A Adhesive composition, optical adhesive sheet, optical film, and display 有权
标题翻译：胶粘组合物，光学胶粘剂，光学胶片和显示
公开(公告)号：JP2014156552A
公开(公告)日：2014-08-28
申请号：JP2013028403
申请日：2013-02-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKARADA SHO , YAMAMOTO SHINYA , KAMIYA KATSUHIKO , IMANISHI KIYOE , MIZUTANI MASANORI
IPC分类号： C09J133/12 , C09J4/00 , C09J7/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming an adhesive layer having excellent adhesive properties to an adherend at high temperature (eg. 85°C) and an adhesive sheet including the adhesive layer.SOLUTION: An adhesive composition includes an acrylic polymer and a photoreactive monomer. The acrylic polymer includes a monomer component of methyl methacrylate with a content of 3-30 wt.% based on the entire monomer component (100 wt.%) composing the acrylic polymer.
摘要翻译：要解决的问题：提供一种粘合剂组合物，其能够在高温（例如85℃）下形成对被粘物具有优异粘合性的粘合剂层和包含粘合剂层的粘合剂片。溶液：粘合剂组合物包含丙烯酸类聚合物和光反应性单体。丙烯酸类聚合物包括基于构成丙烯酸类聚合物的全部单体组分（100重量％）含量为3-30重量％的甲基丙烯酸甲酯的单体组分。

10. 发明专利

JP2013221034A Ultraviolet-curing optical resin adhesive composition, image display device using the same, and method for producing the image display device 审中-公开
标题翻译：超光固化光学树脂粘合剂组合物，使用其的图像显示装置以及用于生产图像显示装置的方法
公开(公告)号：JP2013221034A
公开(公告)日：2013-10-28
申请号：JP2012091346
申请日：2012-04-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUTANI MASANORI
IPC分类号： C09J4/02 , C09J11/06 , C09J109/00 , G02F1/1333 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet-curing optical resin adhesive composition not adversely affecting brightness and contrast with respect to image quality, having excellent transparency and the like, and capable of being cured with ultraviolet rays in a low cumulative light quantity; an image display device using the composition; and a method for producing the image display device.SOLUTION: An ultraviolet-curing optical resin adhesive composition, which is an optical resin adhesive composition to fill a gap such as that between an image display panel and a protective cover plate, includes, as essential components, a (meth)acrylate compound (A) represented by general formula (1') and a photopolymerization initiator (B).
摘要翻译：要解决的问题：提供一种紫外线固化型光学树脂粘合剂组合物，其对于图像质量没有不利影响的亮度和对比度，具有优异的透明度等，并且能够以低累积光量的紫外线固化; 使用该组合物的图像显示装置; 以及用于制造图像显示装置的方法。解决方案：作为填充诸如图像显示面板和保护盖板之间的间隙的光学树脂粘合剂组合物的紫外线固化光学树脂粘合剂组合物包括：组分，由通式（1'）表示的（甲基）丙烯酸酯化合物（A）和光聚合引发剂（B）。

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