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1. 发明授权

US08469368B2 Edge rings for electrostatic chucks 有权
标题翻译：静电卡盘的边缘环
公开(公告)号：US08469368B2
公开(公告)日：2013-06-25
申请号：US12540186
申请日：2009-08-12
申请人： Ian Jared Kenworthy , Kelly Fong , Michael C. Kellogg
发明人： Ian Jared Kenworthy , Kelly Fong , Michael C. Kellogg
IPC分类号： B23B31/28
CPC分类号： H01L21/6831 , H01L21/68735 , Y10T279/23
摘要： A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only a ceramic top piece, a base plate, or coupled to the base plate through a plurality of pins and pin slots. The edge ring is further configured to be concentric with the ceramic top piece. In one embodiment, the edge ring includes an inner edge having an edge step arranged to provide mechanical coupling between the edge ring and the outer periphery of the ceramic top piece. The edge ring further includes an outer edge and a flat portion located between the inner edge and the outer edge. The flat portion is arranged to be both horizontal when the edge ring is placed around the outer periphery of the ceramic top piece and parallel to the substrate.
摘要翻译：用于静电卡盘的公开的装置被配置为将基板保持在等离子体环境中包括边缘环，该边缘环被配置成与陶瓷顶部件，基板的部分接触，或者通过一个多个引脚和引脚插槽。边缘环进一步构造成与陶瓷顶部件同心。在一个实施例中，边缘环包括具有边缘台阶的内边缘，其边缘台阶布置成在边缘环和陶瓷顶部件的外周边之间提供机械联接。边缘环还包括外边缘和位于内边缘和外边缘之间的平坦部分。当边缘环绕陶瓷顶片的外周放置并平行于基底时，平坦部分布置成水平的。

2. 发明申请

US20100044974A1 EDGE RINGS FOR ELECTROSTATIC CHUCKS 有权
标题翻译：用于静电切割机的边缘环
公开(公告)号：US20100044974A1
公开(公告)日：2010-02-25
申请号：US12540186
申请日：2009-08-12
申请人： Ian Jared Kenworthy , Kelly Fong , Michael C. Kellogg
发明人： Ian Jared Kenworthy , Kelly Fong , Michael C. Kellogg
IPC分类号： B23B31/28
CPC分类号： H01L21/6831 , H01L21/68735 , Y10T279/23
摘要： A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only a ceramic top piece, a base plate, or coupled to the base plate through a plurality of pins and pin slots. The edge ring is further configured to be concentric with the ceramic top piece. In one embodiment, the edge ring includes an inner edge having an edge step arranged to provide mechanical coupling between the edge ring and the outer periphery of the ceramic top piece. The edge ring further includes an outer edge and a flat portion located between the inner edge and the outer edge. The flat portion is arranged to be both horizontal when the edge ring is placed around the outer periphery of the ceramic top piece and parallel to the substrate.
摘要翻译：用于静电卡盘的公开的装置被配置为将基板保持在等离子体环境中包括边缘环，该边缘环被配置成与陶瓷顶部件，基板的部分接触，或者通过一个多个引脚和引脚插槽。边缘环还被构造成与陶瓷顶部件同心。在一个实施例中，边缘环包括具有边缘台阶的内边缘，其边缘台阶布置成在边缘环和陶瓷顶部件的外周边之间提供机械联接。边缘环还包括外边缘和位于内边缘和外边缘之间的平坦部分。当边缘环绕陶瓷顶片的外周放置并平行于基底时，平坦部分布置成水平的。

3. 发明授权

US08485128B2 Movable ground ring for a plasma processing chamber 有权
标题翻译：用于等离子体处理室的可动接地环
公开(公告)号：US08485128B2
公开(公告)日：2013-07-16
申请号：US12828120
申请日：2010-06-30
申请人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
发明人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
IPC分类号： H01L21/3065 , C23F1/08 , C23C14/34 , C23C16/00
CPC分类号： H01L21/6719 , H01J37/32 , H01J37/32091 , H01J37/32568 , H01J37/32642 , H01L21/68735 , H01L21/68785
摘要： A movable ground ring of a movable substrate support assembly is described. The movable ground ring is configured to fit around and provide an RF return path to a fixed ground ring of the movable substrate support assembly in an adjustable gap capacitively-coupled plasma processing chamber wherein a semiconductor substrate supported in the substrate support assembly undergoes plasma processing.
摘要翻译：描述了可动基板支撑组件的可动接地环。可移动接地环被配置为围绕并提供到可移动衬底支撑组件的固定接地环的RF返回路径，其中可调节间隙电容耦合等离子体处理室，其中支撑在衬底支撑组件中的半导体衬底经历等离子体处理。

4. 发明申请

US20120258603A1 CLAMPED MONOLITHIC SHOWERHEAD ELECTRODE 有权
标题翻译：钳式单声道淋浴电极
公开(公告)号：US20120258603A1
公开(公告)日：2012-10-11
申请号：US13526974
申请日：2012-06-19
申请人： Roger Patrick , Gregory R. Bettencourt , Michael C. Kellogg
发明人： Roger Patrick , Gregory R. Bettencourt , Michael C. Kellogg
IPC分类号： H01L21/302
CPC分类号： H01L21/3065 , C23C16/45565 , C23C16/4557 , H01J37/32091 , H01J37/3244 , H01J37/32458 , H01J37/32532 , H01J37/32541 , H01J37/32568 , H01J37/32605 , Y10S403/12 , Y10S403/13
摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.
摘要翻译：用于等离子体反应室的电极组件，用于半导体衬底处理。该组件包括上部喷头电极，其通过一系列间隔开的凸轮锁定机械地附接到背板。保护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从电极的上表面延伸的锁定销。

5. 发明授权

US08900398B2 Local plasma confinement and pressure control arrangement and methods thereof 有权
标题翻译：局部血浆限制和压力控制布置及其方法
公开(公告)号：US08900398B2
公开(公告)日：2014-12-02
申请号：US12872982
申请日：2010-08-31
申请人： Rajinder Dhindsa , Michael C. Kellogg , Babak Kadkhodayan , Andrew D. Bailey, III
发明人： Rajinder Dhindsa , Michael C. Kellogg , Babak Kadkhodayan , Andrew D. Bailey, III
IPC分类号： H01L21/3065 , H01J37/32
CPC分类号： H01J37/32642 , H01J37/32623
摘要： An arrangement for performing pressure control within a processing chamber substrate processing is provided. The arrangement includes a peripheral ring configured at least for surrounding a confined chamber volume that is configured for sustaining a plasma for etching the substrate during substrate processing. The peripheral ring includes a plurality of slots that is configured at least for exhausting processed byproduct gas from the confined chamber volume during substrate processing. The arrangement also includes a conductive control ring that is positioned next to the peripheral ring and is configured to include plurality of slots. The pressure control is achieved by moving the conductive control ring relative to the peripheral ring such that a first slot on the peripheral ring and a second slot on the conductive control ring are offset with respect to one another in a range of zero offset to full offset.
摘要翻译：提供了一种用于在处理室衬底处理中执行压力控制的装置。该装置包括至少围绕限制室容积配置的外围环，该限定室容积被配置为在衬底处理期间维持用于刻蚀衬底的等离子体。周边环包括多个狭槽，其被构造成至少在衬底处理期间从受限腔体积中排出经处理的副产物气体。该布置还包括导电控制环，该导电控制环位于外围环旁边并且被配置为包括多个狭槽。通过相对于外围环移动导电控制环来实现压力控制，使得外围环上的第一槽和导电控制环上的第二槽相对于彼此在零偏移到全偏移的范围内彼此偏移。

6. 发明授权

US08847495B2 Movable grounding arrangements in a plasma processing chamber and methods therefor 有权
标题翻译：等离子体处理室中的可移动接地装置及其方法
公开(公告)号：US08847495B2
公开(公告)日：2014-09-30
申请号：US13616641
申请日：2012-09-14
申请人： Anthony de la Llera , Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
发明人： Anthony de la Llera , Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
IPC分类号： H01J7/24
CPC分类号： H01J37/32082 , H01J37/32577
摘要： A plasma processing systems having at least one plasma processing chamber, comprising a movable grounding component, an RF contact component configured to receive RF energy from an RF source when the RF source provides the RF energy to the RF contact component, and a ground contact component coupled to ground. The plasma processing system further includes an actuator operatively coupled to the movable grounding component for disposing the movable grounding component in a first position and a second position. The first position represents a position whereby the movable grounding component is not in contact with at least one of the RF contact component and the ground contact component. The second position represents a position whereby the movable grounding component is in contact with both the RF contact component and the ground contact component.
摘要翻译：一种具有至少一个等离子体处理室的等离子体处理系统，包括可移动接地部件，RF接触部件，其被配置为当RF源向RF接触部件提供RF能量时从RF源接收RF能量;以及接地部件加上地面。等离子体处理系统还包括可操作地耦合到可移动接地部件的致动器，用于将可移动接地部件设置在第一位置和第二位置。第一位置表示可移动接地部件不与RF接触部件和接地部件中的至少一个接触的位置。第二位置表示可移动接地部件与RF接触部件和接地部件接触的位置。

7. 发明授权

US08826855B2 C-shaped confinement ring for a plasma processing chamber 有权
标题翻译：用于等离子体处理室的C形限制环
公开(公告)号：US08826855B2
公开(公告)日：2014-09-09
申请号：US12828065
申请日：2010-06-30
申请人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
发明人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306 , H01J37/32
CPC分类号： H01J37/32642 , H01J37/32091 , H01J37/32623
摘要： Described herein is a confinement ring useful as a component of a capacitively-coupled plasma processing chamber. Inner surfaces of the confinement ring provide an extended plasma confinement zone surrounding a gap between an upper electrode and a lower electrode on which a semiconductor substrate is supported during plasma processing in the chamber.
摘要翻译：这里描述的是用作电容耦合等离子体处理室的组件的限制环。限制环的内表面提供了在腔室中的等离子体处理期间围绕上部电极和下部电极之间的间隙的延长的等离子体限制区域，其上支撑半导体衬底。

8. 发明申请

US20140060739A1 RF GROUND RETURN IN PLASMA PROCESSING SYSTEMS AND METHODS THEREFOR 审中-公开
标题翻译：等离子体处理系统中的RF接地回路及其方法
公开(公告)号：US20140060739A1
公开(公告)日：2014-03-06
申请号：US13662331
申请日：2012-10-26
申请人： Rajinder Dhindsa , Alexei Marakhtanov , Michael C. Kellogg , Andy Desepte , Andrew D. Bailey, III
发明人： Rajinder Dhindsa , Alexei Marakhtanov , Michael C. Kellogg , Andy Desepte , Andrew D. Bailey, III
IPC分类号： H01J37/04
CPC分类号： H01J37/04 , H01J37/32091 , H01J37/32174
摘要： Methods and apparatus for operating the plasma processing chamber of a plasma processing tool in at least two modes are disclosed. In the first mode, the substrate-bearing assembly is movable within a gap-adjustable range to adjust the gap between the electrodes to accommodate different processing requirements. In this first mode, RF ground return path continuity is maintained irrespective of the gap distance as long as the gap distance is within the gap-adjustable range. In the second mode, the substrate bearing assembly is capable of moving to further open the gap to accommodate unimpeded substrate loading/unloading.
摘要翻译：公开了以至少两种模式操作等离子体处理工具的等离子体处理室的方法和装置。在第一模式中，基板支承组件可在间隙可调节范围内移动，以调节电极之间的间隙以适应不同的加工要求。在该第一模式中，只要间隙距离在间隙可调整范围内，RF接地返回路径连续性被维持而与间隙距离无关。在第二模式中，基板支承组件能够移动以进一步打开间隙以适应无阻碍的基板装载/卸载。

9. 发明申请

US20100003824A1 Clamped showerhead electrode assembly 有权
标题翻译：夹紧淋浴头电极组件
公开(公告)号：US20100003824A1
公开(公告)日：2010-01-07
申请号：US12216526
申请日：2008-07-07
申请人： Babak Kadkhodayan , Rajinder Dhindsa , Anthony de la Llera , Michael C. Kellogg
发明人： Babak Kadkhodayan , Rajinder Dhindsa , Anthony de la Llera , Michael C. Kellogg
IPC分类号： H01L21/3065 , C23C16/00 , B05C11/00
CPC分类号： H01J37/32532 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01J37/32568 , H01J37/32605
摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.
摘要翻译：用于等离子体反应室的电极组件，用于半导体衬底处理。组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销电极。为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

10. 发明授权

US09171702B2 Consumable isolation ring for movable substrate support assembly of a plasma processing chamber 有权
标题翻译：用于等离子体处理室的可移动衬底支撑组件的消耗性隔离环
公开(公告)号：US09171702B2
公开(公告)日：2015-10-27
申请号：US12828098
申请日：2010-06-30
申请人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
发明人： Michael C. Kellogg , Alexei Marakhtanov , Rajinder Dhindsa
IPC分类号： C23C16/00 , C23C16/50 , C23F1/00 , H01L21/306 , H01J37/32 , C23C16/458
CPC分类号： H05K5/0247 , C23C16/4585 , H01B5/04 , H01J37/32091 , H01J37/32495 , H01J37/32623 , H01J37/32642 , H01J37/32733 , H01L21/68735
摘要： A consumable isolation ring of a movable substrate support assembly is described. The consumable isolation ring is configured to be supported on a step of a movable ground ring fit around a fixed ground ring. The consumable isolation ring is configured to electrically isolate the movable ground ring from a dielectric ring of the movable substrate support assembly.
摘要翻译：描述可移动基板支撑组件的可消耗隔离环。消耗性隔离环被配置为支撑在固定接地环周围的可动接地环的台阶上。消耗性隔离环被构造成将可移动接地环与可移动衬底支撑组件的介质环电隔离。

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