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    • 1. 发明申请
    • MICROMACHINED RESONANT MAGNETIC FIELD SENSORS
    • 微型谐振磁场传感器
    • WO2012121821A3
    • 2012-11-01
    • PCT/US2012023756
    • 2012-02-03
    • INVENSENSE INCSEEGER JOSEPHLO CHIUNG CCAGDASER BARISSHAEFFER DEREK
    • SEEGER JOSEPHLO CHIUNG CCAGDASER BARISSHAEFFER DEREK
    • G01R31/00
    • G01R33/038G01R33/0286
    • A micromachined magnetic field sensor comprising is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem.
    • 公开了一种微加工磁场传感器。 微加工磁场包括基片; 驱动子系统,所述驱动子系统包括多个梁,以及连接到所述基板的至少一个锚固件; 用于沿着第一轴线提供穿过所述驱动子系统的电流的机构; 以及响应于沿着第三轴的磁场沿第二轴作用在驱动子系统上的洛伦兹力。 微加工磁场传感器还包括感测子系统,感测子系统包括多个光束,以及至少一个连接到衬底的锚; 其中所述感测子系统的一部分沿着第四轴线移动; 驱动子系统和感测子系统之间的耦合弹簧,其引起感测子系统响应于磁场的运动; 以及用于检测感测子系统的运动的位置传感器。
    • 6. 发明申请
    • X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING
    • X-Y AXIS双质量调音枪具有垂直集成电子和水平放大包装
    • WO2005043079A3
    • 2005-08-11
    • PCT/US2004034431
    • 2004-10-12
    • INVENSENSE INC
    • NASIRI STEVEN SSEEGER JOSEPH
    • G01C19/00G01P9/04
    • G01C19/5712G01C19/5719H03H2009/02354
    • An angular velocity sensor has two masses (22,24) which are laterally disposed in an X-Y plane and indirectly connected to a frame (34). The two masses (22,24) are linked together by a linkage (28,56,58) such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses (22,24) into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame (34). In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer (20), a cap wafer (42) and a reference wafer (44). In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses (22,24) and an ambient environment.
    • 角速度传感器具有横向设置在X-Y平面中并间接连接到框架(34)的两个质量(22,24)。 两个质量块(22,24)通过连杆(28,56,58)连接在一起,使得它们必须沿着相反的方向移动。传感器绕Y轴的角速度可以通过驱动两个质量 22,24)转换成Z向反相振荡并测量由此赋予框架(34)的角振荡幅度。 在优选实施例中,角速度传感器由体MEMS陀螺仪晶片(20),盖晶片(42)和参考晶片(44)制成。 在另一优选实施例中,晶片组件提供了质量(22,24)和环境环境之间的密封屏障。