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1. 发明申请

WO2005043078A3 METHOD OF MAKING AN X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING 审中-公开
标题翻译：使用垂直集成电子技术制造X-Y轴双质量调谐陀螺仪的方法和WAFER-SCAL HERMTIC包装
公开(公告)号：WO2005043078A3
公开(公告)日：2005-10-13
申请号：PCT/US2004031073
申请日：2004-09-17
申请人： INVENSENSE INC
发明人： NASIRI STEVEN S , FLANNERY ANTHONY FRANCIS JR
IPC分类号： G01C19/56 , C23F1/00 , B44C1/22 , C03C15/00
CPC分类号： G01C19/5719
摘要： A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame is provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.
摘要翻译：提供了一种用于制造角速度传感器的方法，其具有横向设置在X-Y平面中并间接连接到框架的两个质量块。两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动成Z向反相振荡并测量由此赋予的角振荡幅度来检测到框架。在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

2. 发明申请

WO2007061963A3 METHOD OF MAKING AN X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING 审中-公开
标题翻译：使用垂直集成电子技术制造X-Y轴双质量调谐陀螺仪的方法和WAFER-SCALE包装
公开(公告)号：WO2007061963A3
公开(公告)日：2009-05-07
申请号：PCT/US2006044919
申请日：2006-11-17
申请人： INVENSENSE INC , NASIRI STEVEN S , SEEGER JOSEPH , LIM MARTIN , FLANNERY JR ANTHONY FRANCIS , CASTRO ALEXANDER
发明人： NASIRI STEVEN S , SEEGER JOSEPH , LIM MARTIN , FLANNERY JR ANTHONY FRANCIS , CASTRO ALEXANDER
IPC分类号： G01P3/00 , G01C19/56
CPC分类号： G01C19/56 , G01C19/5712 , G01C19/5719 , G01C19/574
摘要： A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.
摘要翻译：提供了用于测量X-Y传感器平面中的角速度的X和Y分量的双轴传感器。双轴传感器包括用于测量角速度的X分量的第一子传感器和用于测量角速度的Y分量的第二子传感器。第一子传感器和第二子传感器包含在双轴传感器内的单个气密封中。

3. 发明公开

EP2167419A4 INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS 审中-公开
标题翻译：集成动作处理单元（MPU）与MEMS惯性检测和嵌入式数字电子产品
公开(公告)号：EP2167419A4
公开(公告)日：2014-04-23
申请号：EP08797283
申请日：2008-08-06
申请人： INVENSENSE INC
发明人： NASIRI STEVEN S , SACHS DAVID , TAHERI BABAK
IPC分类号： B81B7/02 , G01C19/56 , G01C19/5769 , G01P1/02 , G01P15/08 , G01P15/125 , G01P15/18
CPC分类号： G01C19/5776 , G01C19/5769 , G01P1/023 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0845 , G01P2015/0865 , G01P2015/088

4. 发明申请

WO2013003784A3 PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT 审中-公开
标题翻译：具有暴露于环境的部件的密封MEMS器件的工艺
公开(公告)号：WO2013003784A3
公开(公告)日：2014-05-08
申请号：PCT/US2012045061
申请日：2012-06-29
申请人： INVENSENSE INC , DANEMAN MICHAEL J , LIM MARTIN , SEEGER JOSEPH , TCHERTKOV IGOR , NASIRI STEVEN S
发明人： DANEMAN MICHAEL J , LIM MARTIN , SEEGER JOSEPH , TCHERTKOV IGOR , NASIRI STEVEN S
IPC分类号： H01L21/00
CPC分类号： H01L23/10 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00238 , B81C2203/0109 , B81C2203/0145 , B81C2203/0792 , G01P15/0802 , G01P15/125 , G02B26/0833 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.
摘要翻译：公开了一种用于向MEMS器件提供暴露于外部环境的部分的方法和系统。该方法包括将处理晶片结合到器件晶片以形成具有设置在手柄和器件晶片之间的介电层的MEMS衬底。该方法包括光刻地限定器件晶片上的至少一个间隔，并将至少一个支架结合到集成电路衬底，以在MEMS衬底和集成电路衬底之间形成密封空腔。该方法包括在处理晶片，支座或集成电路基板中限定至少一个开口，以暴露一部分将器件晶片的一部分暴露于外部环境。

5. 发明申请

WO2006101769A3 METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM 审中-公开
标题翻译： AI / GE在WAFER包装环境中的粘合方法及其生产的产品
公开(公告)号：WO2006101769A3
公开(公告)日：2006-12-14
申请号：PCT/US2006008543
申请日：2006-03-09
申请人： INVENSENSE INC , NASIRI STEVEN S , FLANNERY ANTHONY FRANCIS JR
发明人： NASIRI STEVEN S , FLANNERY ANTHONY FRANCIS JR
IPC分类号： H01L21/00 , H01L21/30 , H01L23/48 , H01L27/14 , H01L29/82
CPC分类号： B81C1/00238 , B23K20/023 , B81B3/0018 , B81B7/007 , B81B2203/0315 , B81B2207/012 , B81B2207/094 , B81C1/00269 , B81C3/001 , B81C2203/0118 , B81C2203/035 , B81C2203/038 , B81C2203/0792 , H01L21/187
摘要： A method of bonding between a first MEMS substrate (102) including at least one pattern substantially germanium layer and a secon CMOS substrate (104) including at least one patterned substantially aluminum layer through an aluminum-germanium bond (110) to create a robust electrical and mechanical contact.
摘要翻译：一种在包括至少一个图案基本上锗层的第一MEMS衬底（102）和通过铝 - 锗键（110）包括至少一个图案化的基本上铝层的第二CMOS衬底（104）之间的结合的方法，以产生坚固的电和机械接触。

6. 发明申请

WO2005043079A3 X-Y AXIS DUAL-MASS TUNING FORK GYROSCOPE WITH VERTICALLY INTEGRATED ELECTRONICS AND WAFER-SCALE HERMETIC PACKAGING 审中-公开
标题翻译： X-Y AXIS双质量调音枪具有垂直集成电子和水平放大包装
公开(公告)号：WO2005043079A3
公开(公告)日：2005-08-11
申请号：PCT/US2004034431
申请日：2004-10-12
申请人： INVENSENSE INC
发明人： NASIRI STEVEN S , SEEGER JOSEPH
IPC分类号： G01C19/00 , G01P9/04
CPC分类号： G01C19/5712 , G01C19/5719 , H03H2009/02354
摘要： An angular velocity sensor has two masses (22,24) which are laterally disposed in an X-Y plane and indirectly connected to a frame (34). The two masses (22,24) are linked together by a linkage (28,56,58) such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses (22,24) into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame (34). In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer (20), a cap wafer (42) and a reference wafer (44). In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses (22,24) and an ambient environment.
摘要翻译：角速度传感器具有横向设置在X-Y平面中并间接连接到框架（34）的两个质量（22,24）。两个质量块（22,24）通过连杆（28,56,58）连接在一起，使得它们必须沿着相反的方向移动。传感器绕Y轴的角速度可以通过驱动两个质量 22,24）转换成Z向反相振荡并测量由此赋予框架（34）的角振荡幅度。在优选实施例中，角速度传感器由体MEMS陀螺仪晶片（20），盖晶片（42）和参考晶片（44）制成。在另一优选实施例中，晶片组件提供了质量（22,24）和环境环境之间的密封屏障。

7. 发明申请

WO2012125651A3 WAFER LEVEL PACKAGING OF MEMS DEVICES 审中-公开
标题翻译： MEMS器件的水平包装
公开(公告)号：WO2012125651A3
公开(公告)日：2013-01-03
申请号：PCT/US2012028946
申请日：2012-03-13
申请人： INVENSENSE INC , DANEMAN MICHAEL J , NASIRI STEVEN S , LIM MARTIN
发明人： DANEMAN MICHAEL J , NASIRI STEVEN S , LIM MARTIN
IPC分类号： H01L21/00
CPC分类号： A45D27/42 , B81C1/00238 , B81C2203/0792 , H01L21/76898
摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.
摘要翻译：公开了MEMS器件。 MEMS器件包括MEMS衬底和具有前表面，后表面和一个或多个金属化层的CMOS衬底。前表面接合到MEMS基板上。 MEMS器件包括在CMOS衬底的背面上的一个或多个导电特征以及一个或多个金属化层与一个或多个导电特征之间的电连接。

8. 发明申请

WO2009009803A2 INTEGRATED MOTION PROCESSING UNIT (MPU) WITH MEMS INERTIAL SENSING AND EMBEDDED DIGITAL ELECTRONICS 审中-公开
标题翻译：具有MEMS惯性感测和嵌入式数字电子的集成运动处理单元（MPU）
公开(公告)号：WO2009009803A2
公开(公告)日：2009-01-15
申请号：PCT/US2008072334
申请日：2008-08-06
申请人： INVENSENSE INC , NASIRI STEVEN S , SACHS DAVID , TAHERI BABAK
发明人： NASIRI STEVEN S , SACHS DAVID , TAHERI BABAK
IPC分类号： B81B7/02
CPC分类号： G01C19/5776 , G01C19/5769 , G01P1/023 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0845 , G01P2015/0865 , G01P2015/088
摘要： A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog to digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
摘要翻译：一个可操作安装在电路板表面上的模块。该模块包括线性加速度计以提供与至少一个轴线上的线性加速度的测量相对应的第一测量输出，以及第一旋转传感器，其可操作以提供与围绕至少一个轴线的旋转测量相对应的第二测量输出。加速度计和第一旋转传感器形成在第一基板上。该模块还包括专用集成电路（ASIC），以接收来自线性加速度计的第一测量输出和来自第一旋转传感器的第二测量输出。该ASIC包括模数转换器并且被实现在第二衬底上。第一基板垂直结合到第二基板。

9. 发明公开

EP2727136A4 PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT 失效
标题翻译：方法的密封式MEMS器件具有杰出PART
公开(公告)号：EP2727136A4
公开(公告)日：2015-06-10
申请号：EP12804454
申请日：2012-06-29
申请人： INVENSENSE INC
发明人： DANEMAN MICHAEL J , LIM MARTIN , SEEGER JOSEPH , TCHERTKOV IGOR , NASIRI STEVEN S
IPC分类号： H01L21/50 , H01L29/84
CPC分类号： H01L23/10 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00238 , B81C2203/0109 , B81C2203/0145 , B81C2203/0792 , G01P15/0802 , G01P15/125 , G02B26/0833 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.

10. 发明公开

EP2255297A4 INTERFACING APPLICATION PROGRAMS AND MOTION SENSORS OF A DEVICE 有权
标题翻译：接口应用程序和运动传感器一个器件
公开(公告)号：EP2255297A4
公开(公告)日：2014-03-26
申请号：EP09701666
申请日：2009-01-15
申请人： INVENSENSE INC
发明人： NASIRI STEVEN S , JIANG JOSEPH , SACHS DAVID
IPC分类号： G06F15/76 , G06F3/01
CPC分类号： G06F3/0346 , A63F13/211 , A63F2300/105 , A63F2300/209 , B81B7/02 , G01C19/42 , G01P15/02 , G06F3/017 , G06F3/038
摘要： Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.

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