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1. 发明申请

WO2010086806A2 REFRIGERATION SYSTEM AND METHOD FOR CONTROLLING A REFRIGERATION SYSTEM 审中-公开
标题翻译：制冷系统和控制制冷系统的方法
公开(公告)号：WO2010086806A2
公开(公告)日：2010-08-05
申请号：PCT/IB2010/050371
申请日：2010-01-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , SMITH, Brian
发明人： MICHEL, Bruno , SMITH, Brian
IPC分类号： F25B5/04 , F25B49/02
CPC分类号： F25B5/04 , F25B2600/21 , H05K7/20809 , H05K7/20836
摘要： A refrigeration system comprises a compressor (COMP), a condenser (COND) and at least one multi-stage evaporator (MSE) with at least one first evaporator (FBE) as a first stage and at least one expansion device evaporator (EDE) as at least one further stage downstream the corresponding first stage. Each first evaporator (FBE) is arranged at a respective first compo¬ nent (Cl) for absorbing heat dissipated by the respective first component (Cl). Each expan¬ sion device evaporator (EDE) is arranged at a respective at least one further component (FC) for absorbing heat dissipated by the respective further component (FC). A flow of a working fluid (WF) of the refrigeration system is controlled such that the working fluid (WF) is in a liquid state when entering the first stage and is in a vapor state when leaving a last stage of the respective multi-stage evaporator (MSE).
摘要翻译：制冷系统包括压缩机（COMP），冷凝器（COND）和至少一个多级蒸发器（MSE），其具有至少一个作为第一级的第一蒸发器（FBE）和至少一个膨胀装置蒸发器（EDE），作为在相应的第一阶段下游的至少一个另外的阶段。每个第一蒸发器（FBE）布置在相应的第一组分（Cl）处，用于吸收由相应的第一组分（C1）消散的热量。每个膨胀装置蒸发器（EDE）被布置在相应的至少一个另外的部件（FC）上，用于吸收由相应的另一部件（FC）消散的热量。控制制冷系统的工作流体（WF）的流动，使得工作流体（WF）在进入第一阶段时处于液体状态，并且当离开相应多级的最后阶段时处于蒸气状态蒸发器（MSE）。

2. 发明申请

WO2012038843A1 ELECTROCHEMICALLY POWERED INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：电化学集成电路封装
公开(公告)号：WO2012038843A1
公开(公告)日：2012-03-29
申请号：PCT/IB2011/053477
申请日：2011-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
发明人： BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
IPC分类号： H01L23/58
CPC分类号： H01L23/58 , H01L23/34 , H01L23/44 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01M8/04029 , H01M8/04276 , H01M8/1097 , H01M8/188 , Y02E60/528 , H01L2924/00
摘要： The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.
摘要翻译：本发明特别涉及一种集成电路封装（10c）。所述封装具有层状结构，其中IC和电极（17）布置成与层结构的层（16）电连接。包装还包括一个或多个流体回路段（19），每个流体回路段（19）各自意图接收相应的电解质溶液（或两个不同的溶液，参见下面描述的双流氧化还原模式）。涉及的每个溶液都具有可溶性电活性物质。流体部分设计成在操作中接收和允许电解质溶液接触相应的电极，例如为IC供电。当电极集成到封装中时，可以在IC附近提供电力，从而提高电源的效率。最后，当液体原位参与时，可以考虑合适的除热，应注意的是电力输送和散热需求是一致的。

3. 发明申请

WO2002093991A1 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE 审中-公开
标题翻译：用于电镀沉积和在基材上形成金属的方法
公开(公告)号：WO2002093991A1
公开(公告)日：2002-11-21
申请号：PCT/IB2002/001225
申请日：2002-04-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

4. 发明申请

WO2013001390A1 ADSORPTION HEAT EXCHANGER DEVICES 审中-公开
标题翻译：吸附式热交换器装置
公开(公告)号：WO2013001390A1
公开(公告)日：2013-01-03
申请号：PCT/IB2012/052900
申请日：2012-06-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
发明人： RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
IPC分类号： F25B17/08 , F25B37/00
CPC分类号： F25B17/08 , B82Y30/00 , C01B32/158 , C01P2006/32 , F25B17/083 , F25B37/00 , F28F3/02 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y02P20/124 , Y10S977/742
摘要： Adsorption heat exchanger devices (11, 30) are provided for solid sorption refrigeration systems (1). Such a device includes a heat exchanger (12) having a plurality of projections (17) arranged for extending into an adsorbate of the system (1) in use. An adsorption structure (13, 31) is formed on the heat exchanger (12) for adsorption of said adsorbate. The adsorption structure (13, 31) comprises a plurality of elongate adsorption elements (20) extending outwardly from each of said projections (17) of the heat exchanger (12).
摘要翻译：为固体吸附制冷系统（1）提供吸附热交换器装置（11,30）。这种装置包括具有多个突起（17）的热交换器（12），其布置成在使用中延伸到系统（1）的吸附物中。在热交换器（12）上形成吸附结构（13,31），用于吸附所述被吸附物质。吸附结构（13,31）包括从热交换器（12）的每个所述突起（17）向外延伸的多个细长的吸附元件（20）。

5. 发明申请

WO2012055781A1 THERMAL POWER PLANE FOR INTEGRATED CIRCUITS 审中-公开
标题翻译：用于集成电路的热电源
公开(公告)号：WO2012055781A1
公开(公告)日：2012-05-03
申请号：PCT/EP2011/068426
申请日：2011-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
发明人： BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
IPC分类号： H01L23/498 , H01L23/50 , H01L23/528
CPC分类号： H01L23/50 , H01L23/3677 , H01L23/38 , H01L23/473 , H01L23/481 , H01L23/49833 , H01L23/5286 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/09701 , Y10T29/49002 , Y10T29/49155 , H01L2924/014
摘要： A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
摘要翻译：提供了一种用于传递功率并构成最小热阻的火力发电平面的机构。该机构包括经由第一组耦合装置耦合到经由第二组耦合装置耦合到处理器层的信令和输入/输出（I / O）层和电力输送层的处理器层。在该机构中，功率传递层专用于仅传递功率，并且不向机构的元件提供数据通信信号。在该机构中，电力输送层包括多个导体，多个绝缘材料，一个或多个接地平面以及多个通过层压体的通孔。在该机制中，信令和输入/输出（I / O）层专用于仅向数据通信信号发送数据通信信号并从处理器层接收数据通信信号，并且不向处理器层的元件供电。

6. 发明申请

WO2012085716A1 SOLID SORPTION REFRIGERATION 审中-公开
标题翻译：固体制冷
公开(公告)号：WO2012085716A1
公开(公告)日：2012-06-28
申请号：PCT/IB2011/055370
申请日：2011-11-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , RUCH, Patrick
发明人： MICHEL, Bruno , RUCH, Patrick
IPC分类号： F25B17/08 , F28F13/18 , F25B35/04
CPC分类号： B21D53/02 , F25B15/00 , F25B17/08 , F25B35/04 , F28F13/185 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y10T29/4935 , Y10T29/49359
摘要： Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).
摘要翻译：为固体吸附制冷系统（1）提供集成吸附和热交换器装置，以及制造这种装置的方法。集成的吸附和热交换器装置（20,30,45,52）包括其中形成有可渗透所述系统（1）的被吸附物的多孔吸附结构（21,31,44,53）的固体材料，，以及在所述系统（1）的操作中不渗透所述被吸附物的热交换器结构（22,32），用于与所述多孔吸附结构进行热交换。

7. 发明申请

WO2009037648A2 INTEGRATED CIRCUIT STACK 审中-公开
标题翻译：集成电路堆栈
公开(公告)号：WO2009037648A2
公开(公告)日：2009-03-26
申请号：PCT/IB2008/053768
申请日：2008-09-17
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas J. , LINDERMAN, Ryan Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo E.
发明人： BRUNSCHWILER, Thomas J. , LINDERMAN, Ryan Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo E.
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
摘要翻译：本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆叠（1）。本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。

8. 发明申请

WO2004056470A1 SURFACE TREATMENT 审中-公开
标题翻译：表面处理
公开(公告)号：WO2004056470A1
公开(公告)日：2004-07-08
申请号：PCT/IB2003/005129
申请日：2003-11-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , AMONTOV, Sergey , DELAMARCHE, Emmanuel , MICHEL, Bruno
发明人： AMONTOV, Sergey , DELAMARCHE, Emmanuel , MICHEL, Bruno
IPC分类号： B01J19/00
CPC分类号： G01N33/54366
摘要： A method for producing a monolayer of molecules on a surface comprises: loading a stamp with seed molecules; transferring seed molecules from the stamp to the surface; and, amplifying the seed molecules via an amplifying reaction to produce the monolayer. The method permit generation of complete monolayers from incomplete or sparse monolayers initially printed on the surface.
摘要翻译：在表面上产生单层分子的方法包括：用种子分子装载印模; 将种子分子从印模转移到表面; 并通过扩增反应扩增种子分子以产生单层。该方法允许从最初印刷在表面上的不完全或稀疏单层产生完整的单层。

9. 发明申请

WO2004022338A2 PRINTING IN A MEDIUM 审中-公开
标题翻译：在中文打印
公开(公告)号：WO2004022338A2
公开(公告)日：2004-03-18
申请号：PCT/IB2003/003834
申请日：2003-08-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
发明人： BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
IPC分类号： B41F
CPC分类号： B01J19/0093 , B01J2219/00382 , B01J2219/00527 , B01J2219/0072 , B01J2219/0074 , B01J2219/00745 , B01J2219/00747 , B01J2219/00783 , B01J2219/00833 , B01L3/0293 , B01L2300/0819 , B41K1/30 , B41M3/006 , C40B30/08 , C40B40/18 , C40B60/14 , G01N35/1002 , G01N2035/1034 , H05K3/12 , Y10S977/887
摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
摘要翻译：描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。在印模和基板之间实现接近接触。将印模和基板之间的第三介质层控制到预定厚度。还描述了用于执行该方法的邮票。

10. 发明申请

WO2012055782A1 HEAT SINK INTEGRATED POWER DELIVERY AND DISTRIBUTION FOR INTEGRATED CIRCUITS 审中-公开
标题翻译：集成电路的散热集成电力分配和散热
公开(公告)号：WO2012055782A1
公开(公告)日：2012-05-03
申请号：PCT/EP2011/068427
申请日：2011-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BAROWSKI, Harry , HUBER, Andreas , HARRER, Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
发明人： BAROWSKI, Harry , HUBER, Andreas , HARRER, Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
IPC分类号： H01L25/18
CPC分类号： H01L25/18 , H01L23/3672 , H01L2225/06527 , H01L2225/06589 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the process layer.
摘要翻译：提供了一种用于通过散热器进行集成电力输送和分配的机构。该机构包括经由第一组耦合装置耦合到信令和输入/输出（I / O）层的处理器层，以及经由第二组耦合装置耦合到处理器层的散热器。在该机构中，散热器包括在一个面上的多个凹槽，其中每个凹槽提供用于功率的路径或用于地面传送到处理器层的路径。在该机制中，散热器专用于仅传递功率，并且不向机构的元件提供数据通信信号，并且信令和I / O层专用于仅向数据通信信号发送数据通信信号并接收数据通信信号并且不向处理层的元件供电。

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