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    • 1. 发明申请
    • PRODUCING A MONO-CRYSTALLINE SHEET
    • 生产单晶片
    • WO2011151757A1
    • 2011-12-08
    • PCT/IB2011/052237
    • 2011-05-23
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONBJOERK, Mikael T.RIEL, Heike E.SCHMID, Heinz
    • BJOERK, Mikael T.RIEL, Heike E.SCHMID, Heinz
    • C30B11/10C30B11/12C30B13/18C30B15/08H01L31/18
    • C30B15/08C30B11/003C30B11/02C30B11/10C30B11/12C30B13/18C30B15/002C30B21/06C30B29/06C30B29/64H01L31/0312H01L31/036H01L31/1804Y02E10/547Y02P70/521Y10T117/1032
    • A method for producing a mono-crystalline sheet (11), in particular a silicon sheet (11), comprises: providing at least two aperture elements (1, 2) forming a gap (3) in-between; providing a molten alloy (4) comprising silicon in the gap (3) between said at least two aperture elements (1, 2); providing a gaseous precursor medium (5) comprising silicon in the vicinity of the molten alloy (4); providing a silicon nucleation crystal (6) in the vicinity of the molten alloy (4); and bringing in contact said silicon nucleation crystal (6) and the molten alloy (4). A device (10, 20) for producing a mono-crystalline sheet (11), in particular a silicon sheet (11), comprises at least two aperture elements (1, 2) at a predetermined distance (D) from each other thereby forming a gap (3), and being adapted to be heated for holding a molten alloy (4) comprising silicon by surface tension in the gap (3) between the aperture elements (1,2 ); a means (15) for supplying a gaseous precursor medium (5) comprising silicon in the vicinity of the molten alloy (4); and a positioning means (16) for holding and moving a nucleation crystal (6) in the vicinity of the molten alloy (2).
    • 单晶片(11),特别是硅片(11)的制造方法包括:在其间形成间隙(3)的至少两个孔元件(1,2) 提供在所述至少两个孔元件(1,2)之间的间隙(3)中包含硅的熔融合金(4); 在所述熔融合金(4)附近提供包含硅的气态前体介质(5); 在熔融合金(4)附近提供硅成核晶体(6); 并与所述硅成核晶体(6)和熔融合金(4)接触。 用于制造单晶片(11),特别是硅片(11)的装置(10,20)包括彼此间隔预定距离(D)的至少两个孔元件(1,2),从而形成 间隙(3),并且适于被加热以保持在所述孔元件(1,2)之间的所述间隙(3)中通过表面张力保持包含硅的熔融合金(4); 用于在熔融合金(4)附近供应包含硅的气态前体介质(5)的装置(15); 以及用于保持和移动熔融合金(2)附近的成核晶体(6)的定位装置(16)。
    • 5. 发明申请
    • THERMOELECTRIC DEVICE
    • 热电装置
    • WO2015092608A1
    • 2015-06-25
    • PCT/IB2014/066696
    • 2014-12-08
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONIBM RESEARCH GMBH
    • RIEL, Heike E.SCHMIDT, Volker
    • H01L35/32
    • H01L35/32H01L35/10H01L35/34
    • A thermoelectric device (1) for transferring heat from a heat source (2) to a heat sink (3) comprises a first thermoelectric leg pair (10) having a first leg (4) including an n-type semiconductor material and a second leg (5) including a p-type semiconductor material, wherein the first leg (4) and the second leg (5) are electrically coupled in series. A second thermoelectric leg pair (11) has a third leg (7) including an n-type semiconductor material and a fourth leg (8) including a p-type semiconductor material, wherein the third leg (7) and the fourth leg (8) are electrically coupled in series. A first contact (12) placed between the first leg (4) and the fourth leg (8); and a second contact (13) placed between the second leg (5) and the third leg (7). A method for manufacturing a thermoelectric device or module comprises the steps of: providing a first thermoelectric leg pair (10) having a first leg (4) including an n-type semiconductor material and a second leg (5) including a p-type semiconductor material; electrically coupling the first leg (4) and the second leg (5) of the first thermoelectric leg pair (10) in series; providing a second thermoelectric leg pair (11) having a third leg (7) including an n-type semiconductor material and a fourth leg (8) including a p-type semiconductor material; electrically coupling the third leg (7) and the fourth leg (8) of the second thermoelectric leg pair (11) in series; placing a first contact (12) between the first leg (4) and the fourth leg (8); and placing a second contact (13) between the second leg (5) and the third leg (7).
    • 用于将热量从热源(2)传递到散热器(3)的热电装置(1)包括具有包括n型半导体材料和第二支腿的第一支腿(4)的第一热电腿对(10) (5),其包括p型半导体材料,其中所述第一腿部(4)和所述第二腿部(5)串联电耦合。 第二热电腿对(11)具有包括n型半导体材料的第三腿部(7)和包括p型半导体材料的第四腿部(8),其中第三腿部(7)和第四腿部(8) )串联电耦合。 放置在第一腿部(4)和第四腿部(8)之间的第一接触件(12) 以及放置在第二腿部(5)和第三腿部(7)之间的第二接触件(13)。 一种用于制造热电装置或模块的方法包括以下步骤:提供具有包括n型半导体材料的第一支脚(4)和包括p型半导体的第二支脚(5)的第一热电腿对(10) 材料; 电连接第一热电腿对(10)的第一腿部(4)和第二腿部(5); 提供具有包括n型半导体材料的第三腿部(7)和包括p型半导体材料的第四腿部(8)的第二热电腿对(11) 电连接第二热电腿对(11)的第三腿部(7)和第四腿部(8); 在第一腿部(4)和第四腿部(8)之间放置第一接触件(12); 以及将第二接触件(13)放置在第二腿部(5)和第三腿部(7)之间。