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1. 发明申请

WO2022122568A1 COMPACT ADSORPTION HEAT EXCHANGERS 审中-公开
公开(公告)号：WO2022122568A1
公开(公告)日：2022-06-16
申请号：PCT/EP2021/084094
申请日：2021-12-03
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION [US]/[US] , IBM UNITED KINGDOM LIMITED [GB]/[GB] (MG)
发明人： RUCH, Patrick , AMMANN, Jens, Oliver , MICHEL, Bruno
IPC分类号： F28F1/10 , F25B37/00
摘要： According to certain embodiments, an adsorption heat exchanger (Ad HEX) part is provided. The Ad HEX part comprises a linear guiding element, and a plurality of planar structures that include fins. Each of the planar structures is: mounted on the linear guiding element via a joint element, the joint element configured to cooperate with the linear guiding element to form a slider joint, coated with an adsorbent coating, and fixed on the linear guiding element, at a respective position, by a fixing means that restricts linear sliding movement of each of the planar structures to form an arrangement of coated planar structures that are stacked along the linear guiding element.

2. 发明申请

WO2012038843A1 ELECTROCHEMICALLY POWERED INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：电化学集成电路封装
公开(公告)号：WO2012038843A1
公开(公告)日：2012-03-29
申请号：PCT/IB2011/053477
申请日：2011-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
发明人： BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
IPC分类号： H01L23/58
CPC分类号： H01L23/58 , H01L23/34 , H01L23/44 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01M8/04029 , H01M8/04276 , H01M8/1097 , H01M8/188 , Y02E60/528 , H01L2924/00
摘要： The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.
摘要翻译：本发明特别涉及一种集成电路封装（10c）。所述封装具有层状结构，其中IC和电极（17）布置成与层结构的层（16）电连接。包装还包括一个或多个流体回路段（19），每个流体回路段（19）各自意图接收相应的电解质溶液（或两个不同的溶液，参见下面描述的双流氧化还原模式）。涉及的每个溶液都具有可溶性电活性物质。流体部分设计成在操作中接收和允许电解质溶液接触相应的电极，例如为IC供电。当电极集成到封装中时，可以在IC附近提供电力，从而提高电源的效率。最后，当液体原位参与时，可以考虑合适的除热，应注意的是电力输送和散热需求是一致的。

3. 发明申请

WO2010086806A2 REFRIGERATION SYSTEM AND METHOD FOR CONTROLLING A REFRIGERATION SYSTEM 审中-公开
标题翻译：制冷系统和控制制冷系统的方法
公开(公告)号：WO2010086806A2
公开(公告)日：2010-08-05
申请号：PCT/IB2010/050371
申请日：2010-01-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , SMITH, Brian
发明人： MICHEL, Bruno , SMITH, Brian
IPC分类号： F25B5/04 , F25B49/02
CPC分类号： F25B5/04 , F25B2600/21 , H05K7/20809 , H05K7/20836
摘要： A refrigeration system comprises a compressor (COMP), a condenser (COND) and at least one multi-stage evaporator (MSE) with at least one first evaporator (FBE) as a first stage and at least one expansion device evaporator (EDE) as at least one further stage downstream the corresponding first stage. Each first evaporator (FBE) is arranged at a respective first compo¬ nent (Cl) for absorbing heat dissipated by the respective first component (Cl). Each expan¬ sion device evaporator (EDE) is arranged at a respective at least one further component (FC) for absorbing heat dissipated by the respective further component (FC). A flow of a working fluid (WF) of the refrigeration system is controlled such that the working fluid (WF) is in a liquid state when entering the first stage and is in a vapor state when leaving a last stage of the respective multi-stage evaporator (MSE).
摘要翻译：制冷系统包括压缩机（COMP），冷凝器（COND）和至少一个多级蒸发器（MSE），其具有至少一个作为第一级的第一蒸发器（FBE）和至少一个膨胀装置蒸发器（EDE），作为在相应的第一阶段下游的至少一个另外的阶段。每个第一蒸发器（FBE）布置在相应的第一组分（Cl）处，用于吸收由相应的第一组分（C1）消散的热量。每个膨胀装置蒸发器（EDE）被布置在相应的至少一个另外的部件（FC）上，用于吸收由相应的另一部件（FC）消散的热量。控制制冷系统的工作流体（WF）的流动，使得工作流体（WF）在进入第一阶段时处于液体状态，并且当离开相应多级的最后阶段时处于蒸气状态蒸发器（MSE）。

4. 发明申请

WO2002093991A1 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE 审中-公开
标题翻译：用于电镀沉积和在基材上形成金属的方法
公开(公告)号：WO2002093991A1
公开(公告)日：2002-11-21
申请号：PCT/IB2002/001225
申请日：2002-04-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

5. 发明申请

WO1997006013A1 LITHOGRAPHIC SURFACE OR THIN LAYER MODIFICATION 审中-公开
标题翻译：光刻表面或薄膜修饰
公开(公告)号：WO1997006013A1
公开(公告)日：1997-02-20
申请号：PCT/IB1995000610
申请日：1995-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BIEBUYCK, Hans, Andre , MICHEL, Bruno
IPC分类号： B41K01/00
CPC分类号： B82Y10/00 , B41K1/00 , B82Y40/00 , G03F7/0002 , H01L21/768
摘要： A process for producing lithographic features in a substrate layer is described, comprising the steps of lowering a stamp (15) carrying a reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a patterm. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.
摘要翻译：描述了用于在基底层中生产光刻特征的方法，包括以下步骤：将承载反应物（14）的印模（15）降低到基底（10）上，将随后的反应限制到所需图案，提起所述印模并除去来自底物的反应碎片。优选地，印模承载对应于这种图案的蚀刻图案或凹陷。使用所描述的方法，可以生成具有亚微米特征的图案。该方法允许在各种技术领域中平行处理和转移材料的一般解决方案。

6. 发明申请

WO2016146459A1 WORKING FLUID FOR A DEVICE, DEVICE AND METHOD FOR CONVERTING HEAT INTO MECHANICAL ENERGY 审中-公开
标题翻译：用于装置的工作流体，将热量转换成机械能的装置和方法
公开(公告)号：WO2016146459A1
公开(公告)日：2016-09-22
申请号：PCT/EP2016/055053
申请日：2016-03-09
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM RESEARCH GMBH
发明人： BURG, Brian , MICHEL, Bruno , PAREDES, Stephan
IPC分类号： F01K25/04 , F01K7/16
CPC分类号： F01K11/02 , C09K5/048 , F01K3/06 , F01K7/16 , F01K9/003 , F01K25/04 , F01K25/08
摘要： A working fluid (6) for a device (4) for converting heat into mechanical energy is disclosed. The working fluid (6) comprises a fluid (7) having a boiling temperature in the range between 30 and 250 °C at a pressure of 1 bar and nanoparticles (8) which are dispersed or suspended in the liquid phase of the fluid (7). Said nanoparticles (8) are instrumented as condensation and/or boiling nuclei and the surface of said nanoparticles (8) is adapted to support condensation and/or boiling.
摘要翻译：公开了一种用于将热量转换成机械能的装置（4）的工作流体（6）。工作流体（6）包括在1巴的压力下沸点温度在30和250℃之间的流体（7）和分散或悬浮在流体（7）的液相中的纳米颗粒（8））。所述纳米颗粒（8）被装配为冷凝和/或沸腾核，并且所述纳米颗粒（8）的表面适于支持冷凝和/或沸腾。

7. 发明申请

WO2013001390A1 ADSORPTION HEAT EXCHANGER DEVICES 审中-公开
标题翻译：吸附式热交换器装置
公开(公告)号：WO2013001390A1
公开(公告)日：2013-01-03
申请号：PCT/IB2012/052900
申请日：2012-06-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
发明人： RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
IPC分类号： F25B17/08 , F25B37/00
CPC分类号： F25B17/08 , B82Y30/00 , C01B32/158 , C01P2006/32 , F25B17/083 , F25B37/00 , F28F3/02 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y02P20/124 , Y10S977/742
摘要： Adsorption heat exchanger devices (11, 30) are provided for solid sorption refrigeration systems (1). Such a device includes a heat exchanger (12) having a plurality of projections (17) arranged for extending into an adsorbate of the system (1) in use. An adsorption structure (13, 31) is formed on the heat exchanger (12) for adsorption of said adsorbate. The adsorption structure (13, 31) comprises a plurality of elongate adsorption elements (20) extending outwardly from each of said projections (17) of the heat exchanger (12).
摘要翻译：为固体吸附制冷系统（1）提供吸附热交换器装置（11,30）。这种装置包括具有多个突起（17）的热交换器（12），其布置成在使用中延伸到系统（1）的吸附物中。在热交换器（12）上形成吸附结构（13,31），用于吸附所述被吸附物质。吸附结构（13,31）包括从热交换器（12）的每个所述突起（17）向外延伸的多个细长的吸附元件（20）。

8. 发明申请

WO2012055781A1 THERMAL POWER PLANE FOR INTEGRATED CIRCUITS 审中-公开
标题翻译：用于集成电路的热电源
公开(公告)号：WO2012055781A1
公开(公告)日：2012-05-03
申请号：PCT/EP2011/068426
申请日：2011-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
发明人： BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
IPC分类号： H01L23/498 , H01L23/50 , H01L23/528
CPC分类号： H01L23/50 , H01L23/3677 , H01L23/38 , H01L23/473 , H01L23/481 , H01L23/49833 , H01L23/5286 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/09701 , Y10T29/49002 , Y10T29/49155 , H01L2924/014
摘要： A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
摘要翻译：提供了一种用于传递功率并构成最小热阻的火力发电平面的机构。该机构包括经由第一组耦合装置耦合到经由第二组耦合装置耦合到处理器层的信令和输入/输出（I / O）层和电力输送层的处理器层。在该机构中，功率传递层专用于仅传递功率，并且不向机构的元件提供数据通信信号。在该机构中，电力输送层包括多个导体，多个绝缘材料，一个或多个接地平面以及多个通过层压体的通孔。在该机制中，信令和输入/输出（I / O）层专用于仅向数据通信信号发送数据通信信号并从处理器层接收数据通信信号，并且不向处理器层的元件供电。

9. 发明申请

WO1997006012A1 STAMP FOR A LITHOGRAPHIC PROCESS 审中-公开
标题翻译：刻印图像的过程
公开(公告)号：WO1997006012A1
公开(公告)日：1997-02-20
申请号：PCT/IB1995000609
申请日：1995-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BIEBUYCK, Hans, Andre , MICHEL, Bruno
IPC分类号： B41K01/00
CPC分类号： G03F9/00 , B41K1/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/7042 , G03F9/7076
摘要： A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising an deformable layer (14) for accommodating unevenness of the surface of a substrate and of the stamp structure itself, and a patterned layer (12) in which a lithographic pattern is engraved. The stamp structure is further enhanced by comprising a third layer (16), which acts as rigid support for the stamp, thus preventing an undesired deformation of the stamp under load.
摘要翻译：描述了用于1微米以下特征的光刻处理的混合印模结构，包括用于容纳基底表面和印模结构本身的不均匀性的可变形层（14），以及图案化层（12），其中光刻图案被雕刻。印模结构通过包括作为印模的刚性支撑的第三层（16）进一步增强，从而防止印模在负载下的不期望的变形。

10. 发明申请

WO2013144749A2 PHOTOVOLTAIC THERMAL HYBRID SYSTEMS AND METHOD OF OPERATION THEREOF 审中-公开
标题翻译：光伏混合系统及其操作方法
公开(公告)号：WO2013144749A2
公开(公告)日：2013-10-03
申请号：PCT/IB2013/051850
申请日：2013-03-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , EGYPT NANOTECHNOLOGY CENTER (EGNC) , IBM RESEARCH GMBH
发明人： ESCHER, Werner , GHANNAM, Rami , MICHEL, Bruno , PAREDES, Stephan
IPC分类号： H01L31/058
CPC分类号： H02S40/44 , F24S10/502 , F24S10/55 , F24S20/20 , F24S23/70 , F24S2020/17 , H01L31/0521 , H01L31/0547 , H02S10/20 , H02S20/00 , H02S20/10 , Y02E10/41 , Y02E10/44 , Y02E10/52 , Y02E10/60
摘要： The invention is notably directed to methods of operating photovoltaic thermal hybrid systems (10). A such system (10) comprises: a hybrid solar receiver (20), having a photovoltaic module (21), operatively coupled to the system to deliver an electrical output power (P0) for a power user; and a thermal collector (22) distinct from the photovoltaic module. The photovoltaic module and/or the thermal collector are movably mounted in the system. The system further comprises a collector thermal storage (42) thermally connected to the thermal collector to store heat collected at the thermal collector; and positioning means (30) adapted to move the photovoltaic module and/or the thermal collector. The method comprises instructing (S30) the positioning means to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received (S10) at the photovoltaic module to an intensity of radiation received (S10) at the thermal collector.
摘要翻译：本发明特别涉及操作光伏热混合系统（10）的方法。一种这样的系统（10）包括：混合式太阳能接收器（20），具有光伏模块（21），可操作地耦合到所述系统以传递用于电力用户的电力输出功率（P0）和与光伏模块不同的热收集器（22）。光伏模块和/或热收集器可移动地安装在系统中。所述系统还包括与所述热收集器热连接以收集在所述热收集器处收集的热的收集器热存储器（42）以及适于移动光伏模块和/或热收集器的定位装置（30）。该方法包括指示（S30）定位装置移动光伏模块和/或热收集器以改变在光伏模块处接收的辐射强度（S10）与所接收的辐射强度（S10）的比率集电极。

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