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    • 6. 发明申请
    • METHODS OF FORMING A LOW RESISTANCE SILICON METAL CONTACT
    • 形成低电阻硅金属接触的方法
    • WO2011109242A1
    • 2011-09-09
    • PCT/US2011/026253
    • 2011-02-25
    • INNOVALIGHT, INC.POPLAVSKYY, DmitryABBOTT, Malcolm
    • POPLAVSKYY, DmitryABBOTT, Malcolm
    • H01L21/22
    • H01L31/022425Y02E10/50
    • A method of forming an ohmic contact on a substrate is described. The method includes depositing a set of silicon particles on the substrate surface. Then, heating the substrate to a baking temperature for a baking time period in order to create a densified film ink pattern. The method further includes exposing the substrate to a dopant source in a diffusion furnace with a deposition ambient comprising POCI 3 , a carrier N 2 gas, a main N 2 gas, and a reactive 0 2 gas at a temperature for a time period, wherein a PSG layer is formed on the substrate surface. The method also includes heating the substrate to a drive-in temperature and for a time period; and depositing a silicon nitride layer. The method further includes depositing a set of metal contacts on the set of silicon particles; and heating the substrate to a firing temperature and for a time period.
    • 描述了在衬底上形成欧姆接触的方法。 该方法包括在衬底表面上沉积一组硅颗粒。 然后,将基板加热到烧成温度以进行焙烧时间,以便产生致密的薄膜油墨图案。 该方法还包括在一段时间内将衬底暴露于扩散炉中的掺杂剂源,其中沉积环境包括POCI 3,载体N 2气体,主N 2气体和反应性O 2气体,其中PSG层为 形成在基板表面上。 该方法还包括将衬底加热到​​驱动温度和一段时间; 并沉积氮化硅层。 该方法还包括在该硅颗粒组上沉积一组金属触点; 并将基板加热至焙烧温度并持续一段时间。
    • 7. 发明申请
    • METHODS OF FORMING A METAL CONTACT ON A SILICON SUBSTRATE
    • 在硅基底上形成金属接触的方法
    • WO2012012166A1
    • 2012-01-26
    • PCT/US2011/042328
    • 2011-06-29
    • INNOVALIGHT, INCABBOTT, MalcolmKRAY, Daniel
    • ABBOTT, MalcolmKRAY, Daniel
    • H01L21/00
    • H01L31/022425Y02E10/50
    • The abstract was not in accordance with PCT Rule 8.1(b) because it was more than 150 words in length. The abstract has been established by this Authority to read as follows: Forming a metal contact on a silicon substrate includes depositing a nanoparticle ink on a substrate surface in a pattern, the nanoparticle ink comprising a set of nanoparticles and a set of solvents. The method also includes heating the substrate to a first temperature for a first time period to create a densified nanoparticle layer with a nanoparticle layer thickness of greater than about 50 nm. The method further includes depositing an SiNx layer on the substrate surface, the SiNx layer having a SiNx layer thickness of between about 50 nm and about 110 nm; exposing the substrate to an etchant that is selective to the densified nanoparticle layer for a second time period and at a second temperature to create a via; and forming a metal contact in the via, wherein an ohmic contact is formed with the silicon substrate.
    • 摘要与PCT规则第8.1(b)条不符,因为它的长度超过150个字。 摘要已经由本局建立​​,以阅读如下:在硅衬底上形成金属接触包括以图案沉积在衬底表面上的纳米颗粒油墨,纳米颗粒油墨包含一组纳米颗粒和一组溶剂。 该方法还包括将基底加热到第一温度第一时间以产生具有大于约50nm的纳米颗粒层厚度的致密的纳米颗粒层。 该方法还包括在衬底表面上沉积SiNx层,SiNx层的SiNx层厚度在约50nm至约110nm之间; 将所述衬底暴露于对所述致密纳米颗粒层选择性的蚀刻剂,所述蚀刻剂在第二时间段内和在第二温度下产生通孔; 以及在所述通孔中形成金属接触,其中与所述硅衬底形成欧姆接触。
    • 9. 发明申请
    • METHODS OF FORMING MULTI-DOPED JUNCTIONS ON A SUBSTRATE
    • 在基板上形成多层结的方法
    • WO2010050936A1
    • 2010-05-06
    • PCT/US2008/081558
    • 2008-10-29
    • INNOVALIGHT, INC.SHAH, SunilABBOTT, Malcolm
    • SHAH, SunilABBOTT, Malcolm
    • H01L21/265H01L31/04
    • H01L31/1804H01L21/2254Y02E10/547Y02P70/521
    • A method of forming a multi-doped junction on a substrate is disclosed. The method includes providing the substrate doped with boron, the substrate including a first substrate surface with a first surface region and a second surface region. The method also includes depositing a first set of nanoparticles on the first surface region, the first set of nanoparticles including a first dopant. The method further includes heating the substrate in an inert ambient to a first temperature and for a first time period creating a first densified film, and further creating a first diffused region with a first diffusion depth in the substrate beneath the first surface region. The method also includes exposing the substrate to a diffusion gas including phosphorous at a second temperature and for a second time period creating a PSG layer on the first substrate surface and further creating a second diffused region with a second diffusion depth in the substrate beneath the second surface region, wherein the first diffused region is proximate to the second diffused region. The method further includes exposing the substrate to a oxidizing gas at a third temperature and for a third time period, wherein a SiO2 layer is formed between the PSG layer and the substrate surface, wherein the first diffusion depth is substantially greater than the second diffusion depth.
    • 公开了一种在衬底上形成多掺杂结的方法。 该方法包括提供掺杂有硼的衬底,该衬底包括具有第一表面区域和第二表面区域的第一衬底表面。 该方法还包括在第一表面区域沉积第一组纳米颗粒,第一组纳米颗粒包括第一掺杂剂。 该方法还包括将惰性环境中的衬底加热至第一温度并在第一时间段内产生第一致密化膜,并且还在第一表面区域下方的基底中产生具有第一扩散深度的第一扩散深度。 该方法还包括将衬底暴露于包括在第二温度下的磷的扩散气体,并且持续第二时间段在第一衬底表面上产生PSG层,并进一步产生第二扩散区域,第二扩散区域在第二扩散区域的第二扩散深度 表面区域,其中第一扩散区域靠近第二扩散区域。 该方法还包括在第三温度和第三时间段内将衬底暴露于氧化气体,其中在PSG层和衬底表面之间形成SiO 2层,其中第一扩散深度基本上大于第二扩散深度 。