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    • 3. 发明申请
    • METHODS OF FORMING MULTI-DOPED JUNCTIONS ON A SUBSTRATE
    • 在基板上形成多层结的方法
    • WO2010050936A1
    • 2010-05-06
    • PCT/US2008/081558
    • 2008-10-29
    • INNOVALIGHT, INC.SHAH, SunilABBOTT, Malcolm
    • SHAH, SunilABBOTT, Malcolm
    • H01L21/265H01L31/04
    • H01L31/1804H01L21/2254Y02E10/547Y02P70/521
    • A method of forming a multi-doped junction on a substrate is disclosed. The method includes providing the substrate doped with boron, the substrate including a first substrate surface with a first surface region and a second surface region. The method also includes depositing a first set of nanoparticles on the first surface region, the first set of nanoparticles including a first dopant. The method further includes heating the substrate in an inert ambient to a first temperature and for a first time period creating a first densified film, and further creating a first diffused region with a first diffusion depth in the substrate beneath the first surface region. The method also includes exposing the substrate to a diffusion gas including phosphorous at a second temperature and for a second time period creating a PSG layer on the first substrate surface and further creating a second diffused region with a second diffusion depth in the substrate beneath the second surface region, wherein the first diffused region is proximate to the second diffused region. The method further includes exposing the substrate to a oxidizing gas at a third temperature and for a third time period, wherein a SiO2 layer is formed between the PSG layer and the substrate surface, wherein the first diffusion depth is substantially greater than the second diffusion depth.
    • 公开了一种在衬底上形成多掺杂结的方法。 该方法包括提供掺杂有硼的衬底,该衬底包括具有第一表面区域和第二表面区域的第一衬底表面。 该方法还包括在第一表面区域沉积第一组纳米颗粒,第一组纳米颗粒包括第一掺杂剂。 该方法还包括将惰性环境中的衬底加热至第一温度并在第一时间段内产生第一致密化膜,并且还在第一表面区域下方的基底中产生具有第一扩散深度的第一扩散深度。 该方法还包括将衬底暴露于包括在第二温度下的磷的扩散气体,并且持续第二时间段在第一衬底表面上产生PSG层,并进一步产生第二扩散区域,第二扩散区域在第二扩散区域的第二扩散深度 表面区域,其中第一扩散区域靠近第二扩散区域。 该方法还包括在第三温度和第三时间段内将衬底暴露于氧化气体,其中在PSG层和衬底表面之间形成SiO 2层,其中第一扩散深度基本上大于第二扩散深度 。
    • 6. 发明公开
    • METHODS OF FORMING MULTI-DOPED JUNCTIONS ON A SUBSTRATE
    • 用于形成多掺杂阻挡层在基底上
    • EP2345062A1
    • 2011-07-20
    • EP08877854.3
    • 2008-10-29
    • Innovalight, Inc.
    • SHAH, SunilABBOTT, Malcolm
    • H01L21/265H01L31/04
    • H01L31/1804H01L21/2254Y02E10/547Y02P70/521
    • A method of forming a multi-doped junction on a substrate is disclosed. The method includes providing the substrate doped with boron, the substrate including a first substrate surface with a first surface region and a second surface region. The method also includes depositing a first set of nanoparticles on the first surface region, the first set of nanoparticles including a first dopant. The method further includes heating the substrate in an inert ambient to a first temperature and for a first time period creating a first densified film, and further creating a first diffused region with a first diffusion depth in the substrate beneath the first surface region. The method also includes exposing the substrate to a diffusion gas including phosphorous at a second temperature and for a second time period creating a PSG layer on the first substrate surface and further creating a second diffused region with a second diffusion depth in the substrate beneath the second surface region, wherein the first diffused region is proximate to the second diffused region. The method further includes exposing the substrate to a oxidizing gas at a third temperature and for a third time period, wherein a SiO2 layer is formed between the PSG layer and the substrate surface, wherein the first diffusion depth is substantially greater than the second diffusion depth.