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1. 发明申请

WO2009045008A3 CIRCUIT PROTECTION DEVICE 审中-公开
标题翻译：电路保护装置
公开(公告)号：WO2009045008A3
公开(公告)日：2009-05-22
申请号：PCT/KR2008005456
申请日：2008-09-16
申请人： INNOCHIPS TECHNOLOGY CO LTD , PARK IN-KIL , NOH TAE-HYUNG , JANG KYU CHEOL , LEE MYUNG HO , KWON YONG , KIM GYEONG TAE
发明人： PARK IN-KIL , NOH TAE-HYUNG , JANG KYU CHEOL , LEE MYUNG HO , KWON YONG , KIM GYEONG TAE
IPC分类号： H01L23/60 , G05F1/00
CPC分类号： H01L23/60 , H01L23/552 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention relates to a circuit protection device. A circuit protection device includes a laminate having a common mode noise filter and an electro static discharge (ESD) protection device laminated; first and second external electrodes respectively formed on one and the other side surfaces of the laminate; and a third external electrode formed on a top or bottom surface of the laminate. In the circuit protection device, the external electrode connected to the ESD protection device is formed on a bottom surface of a composite device, thereby reducing parasitic capacitance. Accordingly, distortion of signals can be prevented, thereby enhancing reliability.
摘要翻译：本发明涉及电路保护装置。电路保护装置包括具有共模噪声滤波器和层叠有静电放电（ESD）保护装置的叠层体; 第一外部电极和第二外部电极分别形成在层叠体的一个和另一个侧表面上; 以及形成在层叠体的顶表面或底表面上的第三外部电极。在电路保护装置中，连接到ESD保护装置的外部电极形成在复合器件的底表面上，从而减小寄生电容。因此，可以防止信号的失真，从而提高可靠性。

2. 发明公开

EP1654763A4 COMPLEX LAMINATED CHIP ELEMENT 审中-公开
标题翻译： KOMPLEXES LAMINIERTES CHIPELEMENT
公开(公告)号：EP1654763A4
公开(公告)日：2008-01-16
申请号：EP04774129
申请日：2004-07-15
申请人： INNOCHIPS TECHNOLOGY CO LTD , PARK IN-KIL , HWANG SOON-HA , KIM DUK-HEE
发明人： PARK IN-KIL , HWANG SOON-HA , KIM DUK-HEE
IPC分类号： H03H7/01 , H01C1/148 , H01C7/00 , H01C7/18 , H01C13/02 , H01F17/00 , H01G4/232 , H01G4/40 , H01L27/02
CPC分类号： H01G4/40 , H01C1/148 , H01C7/008 , H01C7/18 , H01C13/02 , H01F17/0006 , H01F27/40 , H01F2017/0026 , H01G4/232 , H01G4/35 , H03H1/02 , H03H2001/0014 , H03H2001/0085 , H03H2001/0092
摘要： The present invention relates to a laminated chip element which can be manufactured to have desired electric properties by combining various elements in accordance with the desired objectives. More p articularly, t he present invention relates to a laminated chip element which has superior high frequency properties and can be manufactured to control capacitance and/or inductance of the laminated chip element to a desired value. There is provided a laminated chip element, comprising at least one first sheet on which first and second conductive patterns are formed, the first and second conductive patterns being spaced apart from each other in a direction of both ends of the first sheet; and at least one second sheet on which a third conductive pattern is formed, the third conductive pattern being formed in a transverse direction of both the ends of the first sheet; wherein one ends of the first and second conductive patterns are connected to first and second external terminals, respectively, at least one end of the third conductive pattern is connected to a third external terminal, and the first and second sheets are laminated. There is also provided a laminated chip element, comprising: at least one first sheet on which a first conductive pattern is formed, the first conductive pattern consisting of first to third portions, the first and second portions being spaced apart from each other in a direction of both ends of the first sheet, the second portion connecting the first and second portions to each other to have a predetermined inductance; and at least one second sheet on which a second conductive pattern is formed in a transverse direction of both the ends of the first sheet; wherein the first and second portions are connected to first and second external terminals, respectively, at least one ends of the second conductive pattern is connected to a third external terminal, and the first and second sheets are laminated.

3. 发明专利

HK1205393A1 COMPLEX DEVICE AND ELECTRONIC DEVICE HAVING THE SAME 未知
公开(公告)号：HK1205393A1
公开(公告)日：2015-12-11
申请号：HK15105830
申请日：2015-06-18
申请人： INNOCHIPS TECHNOLOGY CO LTD
发明人： PARK IN-KIL , NOH TAE-HYUNG , PARK SUNG CHEOL , KIM YOUNG SUL , CHOI SOON DONG , JUNG IN SEOB , PARK WAN , SHIN HEE SEOB
IPC分类号： H04R20060101

4. 发明专利

JP2010251771A Composite laminated chip element 有权
标题翻译：复合层压片元件
公开(公告)号：JP2010251771A
公开(公告)日：2010-11-04
申请号：JP2010126211
申请日：2010-06-01
申请人： Soon-Ha Hwang , Innochips Technology Co Ltd , Duk-Hee Kim , In-Kil Park , イノチップス・テクノロジー・カンパニー・リミテッド , ドク−ヒキム , イン−キルパク , スン−ハファン
发明人： PARK IN-KIL , HWANG SOON-HA , KIM DUK-HEE
IPC分类号： H01G4/40 , H01C1/148 , H01C7/00 , H01C7/02 , H01C7/04 , H01C7/10 , H01C7/18 , H01C13/02 , H01F17/00 , H01F27/00 , H01G4/232 , H01L27/02
CPC分类号： H01G4/40 , H01C1/148 , H01C7/008 , H01C7/18 , H01C13/02 , H01F17/0006 , H01F27/40 , H01F2017/0026 , H01G4/232 , H01G4/35 , H03H1/02 , H03H2001/0014 , H03H2001/0085 , H03H2001/0092
摘要： PROBLEM TO BE SOLVED: To provide a laminated chip element of which the frequency characteristics, such as noise elimination and insertion loss, are enhanced. SOLUTION: This laminated chip element includes a first sheet of at least one sheet of a plurality of sheets continuously formed so that a first and a second conductor patterns respectively departed from them in a direction of both opposite ends are located for every unit element, respectively; a second sheet of at least one sheet formed so that a third conductor pattern is formed straddling a plurality of unit elements in a direction crossing the direction of the both opposite ends; and a plurality of resistor patterns formed for each unit element on the first and second sheets, respectively. In the laminated chip element, the first sheet and the second sheet are laminated alternately and the area of a region where the first conductor pattern and the third conductor patterns overlap differs from the area of a region where the second conductor pattern and the third conductor patterns overlap, respectively. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供其噪声消除和插入损耗等频率特性提高的层叠芯片元件。解决方案：该层压芯片元件包括连续形成的多个片材的至少一个片材的第一片材，使得沿着两个相对端的方向分别从它们分开的第一和第二导体图案位于每个单元元素; 至少一个片材的第二片材，其形成为使第三导体图案沿与两相对端的方向交叉的方向形成跨越多个单位元件; 以及分别为第一和第二片上的每个单位元件形成的多个电阻图案。在层叠芯片元件中，第一片和第二片交替层叠，并且第一导体图案和第三导体图案重叠的区域的区域与第二导体图案和第三导体图案的区域的区域不同重叠。版权所有（C）2011，JPO＆INPIT

5. 发明公开

EP2407860A4 POINTING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
标题翻译：定位设备和电子设备
公开(公告)号：EP2407860A4
公开(公告)日：2013-01-09
申请号：EP09841535
申请日：2009-03-11
申请人： INNOCHIPS TECHNOLOGY CO LTD
发明人： PARK IN-KIL , KIM DAE KYUM
IPC分类号： G06F3/033 , G06F1/16 , G06F3/0354
CPC分类号： G06F3/03548
摘要： Provided are a pointing device and an electronic device including the pointing device. The pointing device includes: an actuating member configured to be moved by a user; a magnet part disposed at a lower side of the actuating member; a cover part configured to cover the actuating member while exposing a part of the actuating member; an intermediate member including a center part configured to support the magnet part, a plurality of pattern parts extending from the center part and having a curved shape, a plurality of fixing parts disposed at ends of the pattern parts and fixed to the cover part, and a plurality of fixing protrusion parts extending from the center part for fixing the magnet part and the center part to the actuating member; and a sensor unit configured to output an electric signal by detecting a movement of the magnet part.

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