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1. 发明申请

WO03050850A2 CHIP ASSEMBLY 审中-公开
标题翻译：芯片配置
公开(公告)号：WO03050850A2
公开(公告)日：2003-06-19
申请号：PCT/DE0204398
申请日：2002-11-29
申请人： INFINEON TECHNOLOGIES AG , MAYERHOFER BORIS , MUELLER JOCHEN
发明人： MAYERHOFER BORIS , MUELLER JOCHEN
IPC分类号： H01L21/56 , H01L23/48 , H01L21/00
CPC分类号： H01L21/563 , H01L23/481 , H01L2224/05571 , H01L2224/05573 , H01L2224/13025 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/00
摘要： The invention relates to a chip assembly comprising a chip (20) having a front side (21) and a rear side (22) and in whose front side at least one integrated component is provided. The chip is provided, on or in the front side thereof, with contact locations (23) serving to contact the integrated component and has contact material elements (24) made of a contact material that extend in material receptacles (29) between the contact locations (23) and contact points (26) on the rear side of the chip. The chip assembly also comprises a substrate (10) with a contact side (11) on which contact surfaces (12) for defining a contact surface layout are provided. The chip is placed on the substrate so that the rear side (22) of the chip (20) is situated on the contact side (11) of the substrate (10), and the contact surfaces (12) rest opposite the contact points (26) while establishing an electrical connection.
摘要翻译：本发明提出了具有模组件的前侧（21）和具有芯片（20），用于在集成器件与焊盘接触的背面（22）之前，在其前侧的至少一个集成元件形成，其中，所述芯片上或者在其前侧（23）设置，并且具有接触材料元件（24）制成的接触材料，其延伸在所述芯片的背面的接触点（23）和接触点（26）之间的材料固定器（29）的，与衬底（10）具有接触侧（11）形成为限定的接触表面上的接触表面布局（12），其中所述芯片被布置使得后部（22），设置在所述衬底的所述接触侧（11）的芯片（20）的基板（10）上和接触表面（12）来产生的接触点（26）相对的电连接撒谎。

2. 发明申请

WO02101674A3 PORTABLE DATA SUPPORT WITH A NUMBER OF DIFFERENT HEIGHTS AT FUNCTIONAL ELEMENTS 审中-公开
标题翻译：具有不同高度的功能元件的多的便携式媒体
公开(公告)号：WO02101674A3
公开(公告)日：2003-04-10
申请号：PCT/DE0202049
申请日：2002-06-05
申请人： INFINEON TECHNOLOGIES AG , MAYERHOFER BORIS , MUELLER JOCHEN
发明人： MAYERHOFER BORIS , MUELLER JOCHEN
IPC分类号： G06K19/077 , B29C45/14 , H01L25/00 , H05K1/18
CPC分类号： G06K19/072 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a portable data support, with at least two electrical functional elements (20a, 20b, 20c) arranged in a support body (10), each comprising at least one contact element (21, 21a, 21b), whereby said functional elements (20a, 20b, 20c) are electrically connected to each other by means of said contact elements (21, 21a, 21b)and a conducting structure (31, 32). According to the invention, an intermediate layer (30, 40) is provided within the support body, the upper (34) and lower surfaces (35) of which comprise conducting structures (31, 32) and define various card body planes. At least two of the electrical functional elements (20a, 20b, 20c) are placed, with the underside thereof which faces the interior of the support body, in various card body planes. The compensation of the level for functional elements (20a, 20b, 20c) of various thicknesses thus occurs as a result of the construction of the portable data support, such that a level surface (12) of the data support is possible.
摘要翻译：本发明提出一种便携式数据载体之前，其中，在支撑体（10），至少两个电功能元件（20A，20B，20C）被插入，每一个具有至少一个接触元件（21，21A，21B），并且其中所述功能元件（20A， 20B，20C），这些接触元件（21，21A，21B电连接到彼此）和导体图案（31，32）的。据被设置在所述载体本体的内部的中间层（30，40）的发明中，具有顶部（34）和底部（35），导体图案（31，32）和定义不同的级别卡体。至少两个电功能元件（20A，20B，20C）被定位成它们的面向载体体在不同的平面卡体内部碱基。不同厚度的电平补偿功能元件（20A，20B，20C）因此由便携式数据载体的结构进行的，从而使数据载体的平坦表面（12）是可能的。

3. 发明申请

WO03038894A3 CHIP MODULE 审中-公开
标题翻译：芯片模块
公开(公告)号：WO03038894A3
公开(公告)日：2003-09-25
申请号：PCT/DE0203425
申请日：2002-09-13
申请人： INFINEON TECHNOLOGIES AG , KARL ANDREAS , KOCZWARA NORBERT , MAYERHOFER BORIS , MENSCH HANS-GEORG , SPOETTL THOMAS
发明人： KARL ANDREAS , KOCZWARA NORBERT , MAYERHOFER BORIS , MENSCH HANS-GEORG , SPOETTL THOMAS
IPC分类号： G06K9/00 , H01L23/31 , G06K19/077 , H01L23/12 , H01L31/0203
CPC分类号： H01L23/3135 , G06K9/0002 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a chip module, comprising a rectangular support frame and a chip, which lies at least on two opposite inner edges of said frame. According to said invention, said chip is firmly secured to the frame, by means of a fixing device, at only one of said two opposite inner edges.
摘要翻译：本发明提供了一种芯片模块，其由矩形支撑框架和至少位于框架的两个相对内边缘上的芯片组成。在这种情况下，通过Besfestigung，芯片仅在这两个相对的内边缘中的一个处牢固地连接到框架。

4. 发明申请

WO03017211A2 CHIP CARD COMPRISING AN INTEGRATED FINGERPRINT SENSOR 审中-公开
标题翻译：具有集成指纹传感器芯片卡
公开(公告)号：WO03017211A2
公开(公告)日：2003-02-27
申请号：PCT/DE0202757
申请日：2002-07-26
申请人： INFINEON TECHNOLOGIES AG , GUNDLACH HARALD , MAYERHOFER BORIS , SPOETTL THOMAS
发明人： GUNDLACH HARALD , MAYERHOFER BORIS , SPOETTL THOMAS
IPC分类号： G06K9/00 , G07F7/10 , G06K9/20 , G07C9/00
CPC分类号： G06K19/0718 , G06K9/0002 , G06K19/07728
摘要： The invention relates to a semiconductor chip (1) comprising a fingerprint sensor. Said chip is arranged in the card body (2) in such a position that when the chip card is bent, the load on the chip inside the entire arrangement of card and chip is minimised in such a way that sufficient security against fracture is achieved, at least in terms of the bending tests necessary for the ISO norm. To this end, a recess (3) is provided in the card body, in which the semiconductor chip is applied, preferably without a housing, in an adapted selected depth (d).
摘要翻译：具有指纹传感器的半导体芯片（1）被放置在这样的位置，在卡体（2）内，该芯片的应力被最小化时，芯片卡的卡和芯片的整个阵列内的弯曲，从而有足够的耐破损性至少在弯曲在按照ISO标准规定的测试得以实现。为此目的，凹部（3）在卡体，其中，所述半导体芯片，而不需要单独壳体，在适当选择的深度（d）优选地附接提供。

5. 发明专利

DE10131010A1 未知
公开(公告)号：DE10131010A1
公开(公告)日：2003-01-23
申请号：DE10131010
申请日：2001-06-27
申请人： INFINEON TECHNOLOGIES AG
发明人： MUELLER JOCHEN , MAYERHOFER BORIS , ROTH MANFRED
IPC分类号： G06K19/073 , G06K19/067
摘要： The invention relates to a data carrier with a data processing unit (2) and an optical memory display unit (3) linked therewith that consists, in a preferred embodiment, of a ferroelectric liquid crystal display. The inventive data carrier is characterized by comprising an additional cover unit (4), preferably a conventional monostable liquid crystal cell which at least partially covers the display unit (3). The data carrier is further provided with a control device (5) that consists, in a preferred embodiment, of a piezosensor and that is adapted to switch the cover unit (4) to a transparent or non-transparent state.

6. 发明专利

DE10131010B4 未知
公开(公告)号：DE10131010B4
公开(公告)日：2004-03-04
申请号：DE10131010
申请日：2001-06-27
申请人： INFINEON TECHNOLOGIES AG
发明人： MUELLER JOCHEN , MAYERHOFER BORIS , ROTH MANFRED
IPC分类号： G06K19/073 , G06K19/067

7. 发明专利

DE10151151A1 Chip module has chip in contact with at least two opposing inner edges of frame, whereby chip is fixed to frame at only one of opposing inner edges by attachment arrangement 未知
公开(公告)号：DE10151151A1
公开(公告)日：2002-06-13
申请号：DE10151151
申请日：2001-10-19
申请人： INFINEON TECHNOLOGIES AG
发明人： MENSCH HANS , SPOETTL THOMAS , KARL ANDREAS , MAYERHOFER BORIS , KOCZWARA NORBERT
IPC分类号： G06K9/00 , H01L23/31 , H01L23/12
摘要： The invention relates to a chip module, comprising a rectangular support frame and a chip, which lies at least on two opposite inner edges of said frame. According to said invention, said chip is firmly secured to the frame, by means of a fixing device, at only one of said two opposite inner edges.

8. 发明专利

DE102019129091A1 IN SCHNITTFUGENGEBIETEN ZUR DIE-VEREINZELUNG AUSGEBILDETE VORBEREITENDE GRÄBEN 未知
公开(公告)号：DE102019129091A1
公开(公告)日：2020-04-30
申请号：DE102019129091
申请日：2019-10-28
申请人： INFINEON TECHNOLOGIES AG
发明人： HILSENBECK JOCHEN , ZUNDEL MARKUS , KONRATH JENS PETER , MAYERHOFER BORIS , MIESLINGER STEFAN , OSTERMANN THOMAS , SOTNIKOV ANATOLY , WESTERMEIER CHRISTIAN
IPC分类号： H01L21/78 , H01L21/301
摘要： Vorgesehen wird ein Halbleiter-Wafer (100), der eine Hauptoberfläche (102) und eine der Hauptoberfläche (102) entgegengesetzte rückwärtige Oberfläche (104) aufweist. Ein Schritt zur Vorbereitung einer Die-Vereinzelung wird in Schnittfugengebieten (108) des Halbleiter-Wafers (100) ausgeführt. Die Schnittfugengebiete (108) umschließen eine Vielzahl von Die-Stellen (106). Der Schritt zur Vorbereitung einer Die-Vereinzelung umfasst ein Ausbilden eines oder mehrerer vorbereitender Schnittfugengräben (112) zwischen zumindest zwei unmittelbar benachbarten Die-Stellen (106). Ferner umfasst das Verfahren ein Ausbilden aktiver Halbleitervorrichtungen in den Die-Stellen (106) und ein Vereinzeln des Halbleiter-Wafers (100) in den Schnittfugengebieten (108), wodurch aus den Die-Stellen (106) eine Vielzahl separater Halbleiter-Dies (110) gebildet wird. Der eine oder die mehreren vorbereitenden Schnittfugengräben (112) sind während des Vereinzelns nicht gefüllt, und das Vereinzeln umfasst ein Entfernen von Halbleitermaterial von einer Oberfläche des Halbleiter-Wafers (100), die zwischen gegenüberliegenden Seitenwänden des einen oder der mehreren vorbereitenden Schnittfugengräben (112) liegt.

9. 发明专利

DE10161043B4 未知
公开(公告)号：DE10161043B4
公开(公告)日：2005-12-15
申请号：DE10161043
申请日：2001-12-12
申请人： INFINEON TECHNOLOGIES AG
发明人： MUELLER JOCHEN , MAYERHOFER BORIS
IPC分类号： H01L21/56 , H01L23/48 , H01L21/60

10. 发明专利

DE10128579A1 未知
公开(公告)号：DE10128579A1
公开(公告)日：2003-01-02
申请号：DE10128579
申请日：2001-06-13
申请人： INFINEON TECHNOLOGIES AG
发明人： MAYERHOFER BORIS , MUELLER JOCHEN
IPC分类号： G06K19/077
摘要： The invention relates to a portable data support, with at least two functional elements arranged in a support body, each comprising at least one contact element, whereby said functional elements are electrically connected to each other by means of said contact elements and a conducting structure. According to the invention, an intermediate layer is provided within the support body, the upper and lower surfaces of which comprise conducting structures and define various card body planes. At least two of the electrical functional elements are placed, with the underside thereof which faces the interior of the support body, in various card body planes. The compensation of the level for functional elements of various thicknesses thus occurs as a result of the construction of the portable data support, such that a level surface of the data support is possible.

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