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1. 发明申请

WO1997024229A1 METAL FILM BONDED BODY, BONDING AGENT LAYER AND BONDING AGENT 审中-公开
标题翻译：金属膜粘合体，粘结剂层和粘结剂
公开(公告)号：WO1997024229A1
公开(公告)日：1997-07-10
申请号：PCT/JP1995002698
申请日：1995-12-26
申请人： IBIDEN CO., LTD. , WANG, Dong, Dong , ASAI, Motoo
发明人： IBIDEN CO., LTD.
IPC分类号： B32B15/08
CPC分类号： B32B15/08 , B32B7/12 , H05K3/0023 , H05K3/181 , H05K3/4661 , H05K2201/0129 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , Y10T428/25 , Y10T428/256 , Y10T428/28 , Y10T428/2804 , Y10T428/287 , Y10T428/2878 , Y10T442/64
摘要： Techniques capable of stably providing a metal film bonded body which is to be bonded with a film of various kinds of metals and used for a printed wiring board and other industrial parts, and which has an excellent peeling strength even when it is used for higher-density high pattern accuracy wiring. The techniques provide a bonding agent, a bonding agent layer and a metal film bonded body, by using as a bonding agent-forming heat resisting resin matrix an uncured thermosetting resin containing a resin in which a photosensitive group substitutes for a part of a functional group and/or a mixed resin of an uncured photosensitive resin and a thermoplastic resin; and using as a heat resisting resin matrix for a bonding agent layer a homogeneous resin complex having a pseudo-uniform compatible structure, a eutectic continuous structure or a spherical domain structure which are formed by curing the mentioned resin and/or mixed resin.
摘要翻译：能够稳定地提供与各种金属的膜接合并用于印刷线路板等工业部件的金属膜接合体的技术，即使在用于较高温度的情况下也具有优异的剥离强度，密度高图案精度布线。该技术通过使用含有树脂的未固化的热固性树脂作为形成粘合剂的耐热树脂基质，提供粘合剂，粘合剂层和金属膜粘结体，其中光敏基团代替官能团的一部分和/或未固化的感光性树脂和热塑性树脂的混合树脂; 并且通过使所述树脂和/或混合树脂固化而形成具有假均匀相容结构，共晶连续结构或球形结构结构的均匀树脂配合物作为粘合剂层的耐热树脂基质。

2. 发明申请

WO1998027798A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：WO1998027798A1
公开(公告)日：1998-06-25
申请号：PCT/JP1997004684
申请日：1997-12-18
申请人： IBIDEN CO., LTD. , ASAI, Motoo , HIRAMATSU, Yasuji , WAKIHARA, Yoshinori , YAMADA, Kazuhito
发明人： IBIDEN CO., LTD.
IPC分类号： H05K03/46
CPC分类号： H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
摘要： A printed wiring board having a multilayered structure composed of a conductor circuit formed on a substrate and an interlayer insulating layer formed thereon, characterized in that the conductor circuit is composed of an electroless-plated film and an electroplated film and that a roughened layer is provided on at least part of the surface thereof.
摘要翻译：一种印刷线路板，具有由在基板上形成的导体电路和形成在其上的层间绝缘层构成的多层结构，其特征在于，所述导体电路由无电镀膜和电镀膜构成，并且设置有粗糙层在其表面的至少一部分上。

3. 发明申请

WO1998011605A1 CIRCUIT BOARD FOR MOUNTING ELECTRONIC PARTS 审中-公开
标题翻译：电路板安装电路板
公开(公告)号：WO1998011605A1
公开(公告)日：1998-03-19
申请号：PCT/JP1996002608
申请日：1996-09-12
申请人： IBIDEN CO., LTD. , ASAI, Motoo , KAWAMURA, Yoichiro , MORI, Yoji
发明人： IBIDEN CO., LTD.
IPC分类号： H01L23/12
CPC分类号： H01L23/49833 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/5384 , H01L2224/16 , H01L2224/16225 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15174 , H01L2924/15311 , H01R12/523 , H05K1/0271 , H05K1/112 , H05K1/114 , H05K3/184 , H05K3/4602 , H05K3/4661 , H05K2201/0212 , H05K2201/09227 , H05K2201/09472 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/09727 , H05K2201/10674 , H05K2201/10734
摘要： A circuit board for mounting electronic parts, which includes first connecting terminal groups (12A and 12B) composed of a plurality of connecting terminals densely formed on the front surface (S1) of a base substrate (2) having through holes (6) and a second connecting terminal group (13) composed of a plurality of connecting terminals formed in at least outer peripheral section on the rear surface (S2) of the substrate (2). The first groups (12A and 12B) are connected to the second group (13) through the holes (6). On the front surface of the substrate (2), build-up multilayered wiring layers (B1 and B2) having via holes (11) are formed and the first groups (12A and 12B) are connected to the second group (13) through the wiring layers (B1 and B2) and through holes (6). In another example, each signal line (52) on the surfaces of the wiring layers (B1 and B2) is composed of a plurality of wiring patterns (58 and 59) having different line widths and a tapered pattern (60) which connects the wiring patterns (58 and 59) to each other and the width of which continuously varies. The line width of the signal line (52) in an area where the wiring density is relatively high is made narrower than that in another area where the wiring density is relatively low.
摘要翻译：一种用于安装电子部件的电路板，其包括由密集地形成在具有通孔（6）的基底基板（2）的前表面（S1）上的多个连接端子组成的第一连接端子组（12A和12B）和第二连接端子组（13），由形成在基板（2）的背面（S2）上的至少外周部的多个连接端子构成。第一组（12A和12B）通过孔（6）连接到第二组（13）。在基板（2）的前表面上形成具有通孔（11）的积层多层布线层（B1和B2），并且第一组（12A和12B）通过第二组布线层（B1和B2）和通孔（6）。在另一示例中，布线层（B1和B2）表面上的每个信号线（52）由具有不同线宽的多个布线图案（58和59）和锥形图案（60）组成，图案（58和59）彼此的宽度连续变化。布线密度相对较高的区域中的信号线（52）的线宽比布线密度较低的其他区域窄。

4. 发明申请

WO1996039796A1 PRINTED WIRING BOARD 审中-公开
标题翻译：印刷线路板
公开(公告)号：WO1996039796A1
公开(公告)日：1996-12-12
申请号：PCT/JP1996001539
申请日：1996-06-06
申请人： IBIDEN CO., LTD. , ASAI, Motoo , KAWADE, Masato , HIRATUKA, Shinji
发明人： IBIDEN CO., LTD.
IPC分类号： H05K03/28
CPC分类号： H05K3/3457 , H05K1/112 , H05K3/184 , H05K3/3452 , H05K3/4644 , H05K2201/09472 , H05K2201/09509 , H05K2201/0989 , H05K2201/10734 , H05K2203/0588
摘要： A printed wiring board suitable for reliable connections and reliable high-density mounting of components by using solder bumps. The printed wiring board has a mounting surface on which are formed pads coated with solder resist and having solder bumps. The position of the solder bump is coincident with the position of a via-hole, or the size of an opening disposed in the solder resist is made greater than a land diameter of the via-hole so that the solder resist does not overlap with the via-hole.
摘要翻译：一种印刷电路板，适用于通过使用焊料凸块的可靠连接和可靠的高密度安装部件。印刷布线板具有安装表面，其上形成有涂覆有阻焊剂并具有焊料凸块的焊盘。焊料凸块的位置与通孔的位置一致，或者设置在阻焊剂中的开口的尺寸大于通孔的焊盘直径，使得阻焊剂不与焊盘的重叠通孔。

5. 发明申请

WO1996020294A1 PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD 审中-公开
标题翻译：电解镀层，电镀镀层和电镀法的预处理方法
公开(公告)号：WO1996020294A1
公开(公告)日：1996-07-04
申请号：PCT/JP1995002014
申请日：1995-10-03
申请人： IBIDEN CO., LTD. , YUAN, Benzhen , ASAI, Motoo
发明人： IBIDEN CO., LTD.
IPC分类号： C23C18/52
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/166 , C23C18/1834 , H05K3/062 , H05K3/108 , H05K3/181 , H05K3/184 , H05K2201/0344 , H05K2203/0392 , H05K2203/072
摘要： A plating method for applying a secondary plating (electroless plating) onto a primary plated film (or a metal film) formed on a substrate for reliably executing the plating reaction at a higher deposition rate without requiring Pd-substitution treatment. The surface potential of the primary plated film is adjusted to be baser than the basest surface potential at which the surface current density of the primary plated film becomes 0 in the electroless plating solution for the secondary plating and, then, the secondary plating is effected. The invention further covers a pH-adjusting agent that is suited for carrying out the electroless plating method, a pretreatment solution for electroless plating that contains a reducing agent and a complexing agent, and an electroless plating bath.
摘要翻译：一种用于在形成于基板上的一次镀覆膜（或金属膜）上施加二次镀覆（无电镀）的电镀方法，用于以更高的沉积速率可靠地执行电镀反应而不需要Pd替代处理。将第一电镀膜的表面电位调整为比二次电镀用化学镀液中初级电镀膜的表面电流密度为0的最底面电位低，然后进行二次镀覆。本发明还涉及适用于进行化学镀方法的pH调节剂，含有还原剂和络合剂的无电镀的预处理溶液和化学镀浴。

6. 发明申请

WO1998026639A1 MULTILAYERED PRINTED WIRING BOARD 审中-公开
标题翻译：多层印刷线路板
公开(公告)号：WO1998026639A1
公开(公告)日：1998-06-18
申请号：PCT/JP1996003655
申请日：1996-12-13
申请人： IBIDEN CO., LTD. , ASAI, Motoo , NAKAMURA, Akihito
发明人： IBIDEN CO., LTD.
IPC分类号： H05K03/46
CPC分类号： H05K1/0224 , H05K1/0253 , H05K1/0298 , H05K3/184 , H05K3/38 , H05K3/4641 , H05K3/4661 , H05K2201/09681 , H05K2203/1178
摘要： A multilayered printed wiring board such that the swell of the conductor layer and the deterioration of the adhesion between the insulating resin layer and the conductor caused by remaining solvent are prevented. The multilayered printed wiring board is a lamination of the insulating resin layer and the conductor layer upon a sheet. The conductor layer composed at least of a signal layer and a power supply layer has a lattice-like conductor pattern of the power supply layer.
摘要翻译：能够防止导体层的隆起和由残留的溶剂导致的绝缘树脂层与导体之间的粘附性的劣化的多层印刷电路板。多层印刷布线板是层叠绝缘树脂层和导体层的片材。至少构成信号层和电源层的导体层具有电源层的格子状的导体图案。

7. 发明申请

WO1997016056A1 RESIN FILLER AND MULTILAYER PRINTED WIRING BOARD 审中-公开
标题翻译：树脂填料和多层印刷接线板
公开(公告)号：WO1997016056A1
公开(公告)日：1997-05-01
申请号：PCT/JP1996003088
申请日：1996-10-23
申请人： IBIDEN CO., LTD.
发明人： IBIDEN CO., LTD. , KAWAMURA, Yoichiro , MURASE, Hideki , ASAI, Motoo
IPC分类号： H05K03/46
CPC分类号： H05K3/0094 , H05K3/382 , H05K3/384 , H05K3/4602 , H05K2201/0129 , H05K2201/0195 , H05K2201/0209 , H05K2201/0212 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/09881 , H05K2203/0773
摘要： A resin filler preferably packed in recesses occurring in the surface of a wiring board or in through holes provided therein, and a structure of a highly reliable built-up multilayer printed wiring board filled with the same resin filler are proposed. This resin filler is a solventless resin filler to be packed in the recesses occurring in the surface of a wiring board or in the through holes provided therein, the resin filler being characterized in that the filler contains resin components of bisphenol type epoxy resin and a curing agent of imidazole, and an additive component of inorganic particles as necessary. A built-up multilayer printed wiring board using this resin filler is also proposed.
摘要翻译：优选填充在布线板表面的凹部或设置在其中的通孔中的树脂填料，以及填充有相同树脂填料的高可靠性的叠层多层印刷布线板的结构。这种树脂填料是一种无溶剂树脂填料，其被填充在布线板表面或设置在其中的通孔中的凹部中，树脂填料的特征在于，填料含有双酚型环氧树脂的树脂组分和固化咪唑的试剂，以及无机颗粒的添加成分。还提出了使用这种树脂填料的组合多层印刷线路板。

8. 发明申请

WO1995018522A1 PRINTED WIRING BOARD 审中-公开
标题翻译：印刷线路板
公开(公告)号：WO1995018522A1
公开(公告)日：1995-07-06
申请号：PCT/JP1994002197
申请日：1994-12-22
申请人： IBIDEN CO., LTD. , KOHMURA, Toshimi , HORIBA, Yasuhiro , KATO, Hisao
发明人： IBIDEN CO., LTD.
IPC分类号： H05K01/02
CPC分类号： H05K3/242 , H01L23/49572 , H01L23/49855 , H01L2924/0002 , H05K1/0393 , H05K3/0052 , H05K3/0097 , H05K2201/09263 , H05K2203/1545 , H01L2924/00
摘要： A printed wiring board comprising multiple rows of daughter printed wiring boards, a main plated lead formed between the rows of daughter printed wiring boards, and subsidiary plated leads which connects the pattern constituting the daughter printed wiring boards to the main plated leads. The main plated lead is a zigzag line including two groups of line segments on both sides of a cutting line between the rows of daughter boards. Since the printed wiring board of this invention has such a constitution, no punching step is required for electrical isolation and, only by cutting the printed wiring board along the cutting line, the subsidiary plated leads connected to the main plated lead can be collectively electrically isolated.
摘要翻译：包括多行子印刷线路板的印刷线路板，形成在各行子印刷电路板之间的主电镀引线和将构成子印刷电路板的图案连接到主电镀引线的辅助电镀引线。主电镀引线是锯齿线，其包括在子板之间的切割线的两侧上的两组线段。由于本发明的印刷电路板具有这样的结构，因此不需要冲压步骤进行电气隔离，并且只有沿着切割线切割印刷电路板，连接到主电镀引线的辅助电镀引线可以被集中地电隔离。

9. 发明申请

WO1993013418A1 FLUORESCENT IMMUNITY MEASURING INSTRUMENT 审中-公开
标题翻译：荧光免疫测量仪器
公开(公告)号：WO1993013418A1
公开(公告)日：1993-07-08
申请号：PCT/JP1992001652
申请日：1992-12-17
申请人： IBIDEN CO., LTD. , KOBAYASHI, Takeshi , IIJIMA, Shinji , SAKAI, Yasunori , SHIMADA, Ken-ichi
发明人： IBIDEN CO., LTD.
IPC分类号： G01N33/543
CPC分类号： G01N33/54366 , G01N33/5302 , G01N33/582 , Y10S435/968 , Y10S435/969 , Y10S436/80 , Y10S436/807
摘要： A fluorescent immunity measuring instrument provided with an excitation light source, a fluorescence detector, an antigen- or antibody-combined optical fiber and a spectroscope, characterized in that an antigen or an antibody is combined with an excitation light outgoing end surface of an optical fiber, the excitation light sent out from the excitation light source being introduced to an excitation light incident end surface of the optical fiber by the spectroscope, the fluorescent light emitted from a fluorescently labeled antibody or antigen which forms an immune complex with the antigen or antibody being introduced into the fluorescence detector, the excitation light outgoing end surface of the optical fiber having a permeability to the excitation light from the excitation light source; and a fluorescent immunity measuring sensing tip used for this instrument. According to the present invention, low-background high-sensitivity immunity measurement can be carried out practically, and a miniaturized inexpensive fluorescent immunity measuring instrument can be obtained.
摘要翻译：一种具有激发光源，荧光检测器，抗原或抗体组合光纤和分光镜的荧光免疫测定仪，其特征在于，抗原或抗体与光纤的激发光出射端面组合从激发光源发出的激发光通过分光镜被引入光纤的激发光入射端面，从与抗原或抗体形成免疫复合物的荧光标记抗体或抗原发射的荧光引入到荧光检测器中，光纤的激发光出射端面对来自激发光源的激发光具有磁导率; 以及用于该仪器的荧光免疫测量传感头。根据本发明，实际上可以进行低背景高灵敏度的免疫测量，并且可以获得小型化的便宜的荧光免疫测量仪器。

10. 发明申请

WO1990013029A1 REAGENT FOR ASSAYING BIOLOGICALLY ACTIVE SUBSTANCE, METHOD OF PRODUCTION THEREOF, AND METHOD AND APPARATUS FOR ASSAYING 审中-公开
标题翻译：用于测定生物活性物质的试剂，其生产方法，以及测定方法和装置
公开(公告)号：WO1990013029A1
公开(公告)日：1990-11-01
申请号：PCT/JP1990000514
申请日：1990-04-19
申请人： IBIDEN CO., LTD. , KOBAYASHI, Takeshi , HONDA, Hiroyuki , SHIMADA, Kenichi
发明人： IBIDEN CO., LTD.
IPC分类号： G01N33/533
CPC分类号： G01N33/533 , G01N33/54353 , G01N33/54373 , G01N33/582
摘要： A reagent for assaying a biologically active substance comprising a combination of (fluorochrome)n- avidin-a compound having a number of reactive groups, or one wherein avidin is bound via biotin to the compound having a number of reactive groups; a method of producing the reagent; an optical fiber made of a resin necessary for utilizing the reagent; an apparatus for assaying provided with a detecting unit utilizing the optical fiber; and a method of assaying the biologically active substance with the use of the above reagent and apparatus. This assaying method can be employed in the immunoassay of trace amounts of biologically active substances contained in blood or a humor for medical diagnosis, such as antigens, antibodies or enzymes, with a remarkably improved sensitivity of detection.
摘要翻译：一种用于测定生物活性物质的试剂，其包含（荧光染料）n-抗生物素蛋白 - 具有多个反应性基团的化合物或其中抗生物素蛋白通过生物素结合至具有多个反应性基团的化合物的组合的生物活性物质; 制备试剂的方法; 由所述试剂所需的树脂制成的光纤; 一种用于测定的设备，其具有利用所述光纤的检测单元; 以及使用上述试剂和装置测定生物活性物质的方法。该测定方法可用于血液或幽默中含有的痕量生物活性物质（例如抗原，抗体或酶）的免疫测定，其检测灵敏度显着提高。

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