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1. 发明授权

US08952484B2 Non-volatile memory having isolation structures in and above a substrate and manufacturing method thereof 有权
标题翻译：在基板中和上方具有隔离结构的非易失性存储器及其制造方法
公开(公告)号：US08952484B2
公开(公告)日：2015-02-10
申请号：US12949092
申请日：2010-11-18
申请人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L21/70 , H01L29/788 , H01L29/792 , H01L21/8238 , H01L21/336 , H01L21/762
CPC分类号： H01L29/792 , H01L21/76232
摘要： A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a substrate, a gate structure, a first doped region, a second doped region and a pair of isolation structures. The gate structure is disposed on the substrate. The gate structure includes a charge storage structure, a gate and spacers. The charge storage structure is disposed on the substrate. The gate is disposed on the charge storage structure. The spacers are disposed on the sidewalls of the gate and the charge storage structure. The first doped region and the second doped region are respectively disposed in the substrate at two sides of the charge storage structure and at least located under the spacers. The isolation structures are respectively disposed in the substrate at two sides of the gate structure.
摘要翻译：提供了一种非易失性存储器及其制造方法。非挥发性存储器包括衬底，栅极结构，第一掺杂区，第二掺杂区和一对隔离结构。栅极结构设置在基板上。栅极结构包括电荷存储结构，栅极和间隔物。电荷存储结构设置在基板上。栅极设置在电荷存储结构上。间隔件设置在栅极和电荷存储结构的侧壁上。第一掺杂区域和第二掺杂区域分别设置在电荷存储结构的两侧的基板中，并且至少位于间隔物之下。隔离结构分别设置在栅极结构的两侧的基板中。

2. 发明申请

US20110182123A1 FLASH MEMORY AND MANUFACTURING METHOD AND OPERATING METHOD THEREOF 有权
标题翻译：闪存及其制造方法及其工作方法
公开(公告)号：US20110182123A1
公开(公告)日：2011-07-28
申请号：US12834228
申请日：2010-07-12
申请人： GUAN-WEI WU , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： GUAN-WEI WU , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： G11C16/04 , H01L29/792 , H01L21/336 , H01L29/78 , G11C16/16
CPC分类号： H01L29/792 , G11C16/0475 , H01L29/4234 , H01L29/42352
摘要： A flash memory and a manufacturing method and an operating method thereof are provided. The flash memory includes a substrate, a charge-trapping structure, a first gate, a second gate, a third gate, a first doped region and a second doped region. The substrate has a protrusion portion. The charge-trapping structure is disposed over the substrate. The first gate and the second gate are disposed respectively over the charge-trapping structure at two sides of the protrusion portion. The top surfaces of the first gate and the second gate are lower than the top surface of the charge-trapping structure located on the top of the protrusion portion. The third gate is disposed over the charge-trapping structure located on the top of the protrusion portion. The first doped region and the second doped region are disposed respectively in the substrate at two sides of the protrusion portion.
摘要翻译：提供闪速存储器及其制造方法及其操作方法。闪速存储器包括衬底，电荷俘获结构，第一栅极，第二栅极，第三栅极，第一掺杂区域和第二掺杂区域。基板具有突起部。电荷捕获结构设置在衬底上。第一栅极和第二栅极分别设置在突出部分的两侧的电荷捕获结构的上方。第一栅极和第二栅极的顶表面比位于突起部分顶部的电荷捕获结构的顶表面低。第三栅极设置在位于突起部分的顶部上的电荷捕获结构之上。第一掺杂区域和第二掺杂区域分别设置在基板的突出部分的两侧。

3. 发明申请

US20100302855A1 MEMORY DEVICE AND METHODS FOR FABRICATING AND OPERATING THE SAME 有权
标题翻译：存储器件及其制造和操作的方法
公开(公告)号：US20100302855A1
公开(公告)日：2010-12-02
申请号：US12614647
申请日：2009-11-09
申请人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu , Guan-Wei Wu , Tao-Yuan Lin , Po-Chou Chen
发明人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu , Guan-Wei Wu , Tao-Yuan Lin , Po-Chou Chen
IPC分类号： G11C16/04 , H01L29/792 , H01L21/336
CPC分类号： G11C16/0475 , H01L27/11568 , H01L29/42352 , H01L29/66833 , H01L29/792 , H01L29/7923
摘要： The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively.
摘要翻译：描述了存储器件，其包括衬底，导电层，多个电荷存储层和多个掺杂区域。衬底具有形成在其中的多个沟槽。导电层设置在基板上并填充沟槽。电荷存储层分别设置在沟槽中的衬底和导电层之间，其中电荷存储层彼此分离。掺杂区域分别配置在沟槽底部的衬底中。

4. 发明授权

US08014203B2 Memory device and methods for fabricating and operating the same 有权
标题翻译：存储器件及其制造和操作的方法
公开(公告)号：US08014203B2
公开(公告)日：2011-09-06
申请号：US12614647
申请日：2009-11-09
申请人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu , Guan-Wei Wu , Tao-Yuan Lin , Po-Chou Chen
发明人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu , Guan-Wei Wu , Tao-Yuan Lin , Po-Chou Chen
IPC分类号： G11C16/04
CPC分类号： G11C16/0475 , H01L27/11568 , H01L29/42352 , H01L29/66833 , H01L29/792 , H01L29/7923
摘要： The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively.
摘要翻译：描述了存储器件，其包括衬底，导电层，多个电荷存储层和多个掺杂区域。衬底具有形成在其中的多个沟槽。导电层设置在基板上并填充沟槽。电荷存储层分别设置在沟槽中的衬底和导电层之间，其中电荷存储层彼此分离。掺杂区域分别配置在沟槽底部的衬底中。

5. 发明申请

US20100112797A1 METHOD FOR FORMING A MEMORY ARRAY 有权
标题翻译：形成记忆阵列的方法
公开(公告)号：US20100112797A1
公开(公告)日：2010-05-06
申请号：US12263091
申请日：2008-10-31
申请人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L21/3205
CPC分类号： H01L21/28282 , H01L27/11568 , H01L29/4234 , Y10S438/954
摘要： The invention is directed to a method for forming a memory array. The method comprises steps of providing a substrate having a charge trapping structure formed thereon. A patterned material layer is formed over the substrate and the patterned material layer having a plurality of trenches expose a portion of the charge trapping structure. Furthermore, a plurality of conductive spacers are formed on the sidewalls of the trenches of the patterned material layer respectively and a portion of the charge trapping structure at the bottom of the trenches is exposed by the conductive spacers. An insulating layer is formed over the substrate to fill up the trenches of the patterned material layer. Moreover, a planarization process is performed to remove a portion of the insulating layer until a top surface of the patterned material layer and a top surface of each of the conductive spacers are exposed.
摘要翻译：本发明涉及一种用于形成存储器阵列的方法。该方法包括提供其上形成有电荷捕获结构的衬底的步骤。图案化的材料层形成在衬底上，并且具有多个沟槽的图案化材料层暴露电荷俘获结构的一部分。此外，在图案化材料层的沟槽的侧壁上分别形成多个导电间隔物，并且沟槽底部的电荷捕获结构的一部分被导电间隔物暴露。在衬底上形成绝缘层以填充图案化材料层的沟槽。此外，执行平面化处理以去除绝缘层的一部分，直到图案化材料层的顶表面和每个导电间隔物的顶表面露出。

6. 发明授权

US08338880B2 Flash memory 有权
标题翻译：闪存
公开(公告)号：US08338880B2
公开(公告)日：2012-12-25
申请号：US12834228
申请日：2010-07-12
申请人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L29/66 , H01L29/788 , H01L29/792
CPC分类号： H01L29/792 , G11C16/0475 , H01L29/4234 , H01L29/42352
摘要： A flash memory and a manufacturing method and an operating method thereof are provided. The flash memory includes a substrate, a charge-trapping structure, a first gate, a second gate, a third gate, a first doped region and a second doped region. The substrate has a protrusion portion. The charge-trapping structure is disposed over the substrate. The first gate and the second gate are disposed respectively over the charge-trapping structure at two sides of the protrusion portion. The top surfaces of the first gate and the second gate are lower than the top surface of the charge-trapping structure located on the top of the protrusion portion. The third gate is disposed over the charge-trapping structure located on the top of the protrusion portion. The first doped region and the second doped region are disposed respectively in the substrate at two sides of the protrusion portion.
摘要翻译：提供闪速存储器及其制造方法及其操作方法。闪速存储器包括衬底，电荷俘获结构，第一栅极，第二栅极，第三栅极，第一掺杂区域和第二掺杂区域。基板具有突起部。电荷捕获结构设置在衬底上。第一栅极和第二栅极分别设置在突出部分的两侧的电荷捕获结构的上方。第一栅极和第二栅极的顶表面比位于突起部分顶部的电荷捕获结构的顶表面低。第三栅极设置在位于突起部分的顶部上的电荷捕获结构之上。第一掺杂区域和第二掺杂区域分别设置在基板的突出部分的两侧。

7. 发明授权

US07799638B2 Method for forming a memory array 有权
标题翻译：形成存储器阵列的方法
公开(公告)号：US07799638B2
公开(公告)日：2010-09-21
申请号：US12263091
申请日：2008-10-31
申请人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L21/00
CPC分类号： H01L21/28282 , H01L27/11568 , H01L29/4234 , Y10S438/954
摘要： The invention is directed to a method for forming a memory array. The method comprises steps of providing a substrate having a charge trapping structure formed thereon. A patterned material layer is formed over the substrate and the patterned material layer having a plurality of trenches expose a portion of the charge trapping structure. Furthermore, a plurality of conductive spacers are formed on the sidewalls of the trenches of the patterned material layer respectively and a portion of the charge trapping structure at the bottom of the trenches is exposed by the conductive spacers. An insulating layer is formed over the substrate to fill up the trenches of the patterned material layer. Moreover, a planarization process is performed to remove a portion of the insulating layer until a top surface of the patterned material layer and a top surface of each of the conductive spacers are exposed.
摘要翻译：本发明涉及一种用于形成存储器阵列的方法。该方法包括提供其上形成有电荷捕获结构的衬底的步骤。图案化的材料层形成在衬底上，并且具有多个沟槽的图案化材料层暴露电荷俘获结构的一部分。此外，在图案化材料层的沟槽的侧壁上分别形成多个导电间隔物，并且沟槽底部的电荷捕获结构的一部分被导电间隔物暴露。在衬底上形成绝缘层以填充图案化材料层的沟槽。此外，执行平面化处理以去除绝缘层的一部分，直到图案化材料层的顶表面和每个导电间隔物的顶表面露出。

8. 发明申请

US20120127795A1 NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF AND OPERATING METHOD OF MEMORY CELL 有权
标题翻译：非易失性存储器及其制造方法及其存储单元的操作方法
公开(公告)号：US20120127795A1
公开(公告)日：2012-05-24
申请号：US12949076
申请日：2010-11-18
申请人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： Guan-Wei Wu , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： G11C16/04 , H01L21/336 , H01L29/792
CPC分类号： H01L21/28282 , G11C16/0475 , H01L27/11565 , H01L27/11568 , H01L29/7923
摘要： A non-volatile memory and a manufacturing method thereof and a method for operating a memory cell are provided. The non-volatile memory includes a substrate, first and second doped regions, a charged-trapping structure, first and second gates and an inter-gate insulation layer. The first and second doped regions are disposed in the substrate and extend along a first direction. The first and second doped regions are arranged alternately. The charged-trapping structure is disposed on the substrate. The first and second gates are disposed on the charged-trapping structure. Each first gate is located above one of the first doped regions. The second gates extend along a second direction and are located above the second doped regions. The inter-gate insulation layer is disposed between the first gates and the second gates. Adjacent first and second doped regions and the first gate, the second gate and the charged-trapping structure therebetween define a memory cell.
摘要翻译：提供一种非易失性存储器及其制造方法以及操作存储单元的方法。非易失性存储器包括衬底，第一和第二掺杂区域，带电捕获结构，第一和第二栅极以及栅极间绝缘层。第一和第二掺杂区域设置在衬底中并沿着第一方向延伸。第一和第二掺杂区交替布置。带电捕获结构设置在基板上。第一和第二栅极设置在带电捕获结构上。每个第一栅极位于第一掺杂区域之上。第二栅极沿着第二方向延伸并且位于第二掺杂区域之上。栅间绝缘层设置在第一栅极和第二栅极之间。相邻的第一和第二掺杂区域和第一栅极，其间的第二栅极和带电捕获结构限定了存储单元。

9. 发明申请

US20120126307A1 NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF 有权
标题翻译：非易失性存储器及其制造方法
公开(公告)号：US20120126307A1
公开(公告)日：2012-05-24
申请号：US12949092
申请日：2010-11-18
申请人： GUAN-WEI WU , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
发明人： GUAN-WEI WU , I-Chen Yang , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L29/792 , H01L21/76232
摘要： A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory includes a substrate, a gate structure, a first doped region, a second doped region and a pair of isolation structures. The gate structure is disposed on the substrate. The gate structure includes a charge storage structure, a gate and spacers.The charge storage structure is disposed on the substrate. The gate is disposed on the charge storage structure. The spacers are disposed on the sidewalls of the gate and the charge storage structure. The first doped region and the second doped region are respectively disposed in the substrate at two sides of the charge storage structure and at least located under the spacers. The isolation structures are respectively disposed in the substrate at two sides of the gate structure.
摘要翻译：提供了一种非易失性存储器及其制造方法。非易失性存储器包括衬底，栅极结构，第一掺杂区，第二掺杂区和一对隔离结构。栅极结构设置在基板上。栅极结构包括电荷存储结构，栅极和间隔物。电荷存储结构设置在基板上。栅极设置在电荷存储结构上。间隔件设置在栅极和电荷存储结构的侧壁上。第一掺杂区域和第二掺杂区域分别设置在电荷存储结构的两侧的基板中，并且至少位于间隔物之下。隔离结构分别设置在栅极结构的两侧的基板中。

10. 发明授权

US08093665B2 Semiconductor device and method for fabricating the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08093665B2
公开(公告)日：2012-01-10
申请号：US12467479
申请日：2009-05-18
申请人： I-Chen Yang , Guan-Wei Wu , Yao-Wen Chang , Tao-Cheng Lu
发明人： I-Chen Yang , Guan-Wei Wu , Yao-Wen Chang , Tao-Cheng Lu
IPC分类号： H01L29/76 , H01L29/94
CPC分类号： H01L29/66636 , H01L29/665 , H01L29/7834
摘要： A semiconductor device is described, which includes a substrate, a gate structure, doped regions and lightly doped regions. The substrate has a stepped upper surface, which includes a first surface, a second surface and a third surface. The second surface is lower than the first surface. The third surface connects the first surface and the second surface. The gate structure is disposed on the first surface. The doped regions are configured in the substrate at both sides of the gate structure and under the second surface. The lightly doped regions are configured in the substrate between the gate structure and the doped regions, respectively. Each lightly doped region includes a first part and a second part connecting with each other. The first part is disposed under the second surface, and the second part is disposed under the third surface.
摘要翻译：描述了一种半导体器件，其包括衬底，栅极结构，掺杂区域和轻掺杂区域。基板具有阶梯状的上表面，其包括第一表面，第二表面和第三表面。第二表面低于第一表面。第三表面连接第一表面和第二表面。栅极结构设置在第一表面上。掺杂区域在栅极结构的两侧和第二表面的下方在衬底中配置。轻掺杂区域分别配置在栅极结构和掺杂区域之间的衬底中。每个轻掺杂区域包括彼此连接的第一部分和第二部分。第一部分设置在第二表面下方，第二部分设置在第三表面下。

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