会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Spin transistor using N-type and P-type double carrier supply layer structure
    • 旋转晶体管采用N型和P型双载体供电层结构
    • US08183611B2
    • 2012-05-22
    • US12858702
    • 2010-08-18
    • Hyung Jun KimJin Dong SongHyun Cheol KooKyung Ho KimSuk Hee Han
    • Hyung Jun KimJin Dong SongHyun Cheol KooKyung Ho KimSuk Hee Han
    • H01L29/76
    • H01L29/66984G11C11/161G11C11/1675G11C11/18Y10S257/902
    • A spin transistor that includes: a semiconductor substrate including an upper cladding layer and a lower cladding layer, and a channel layer interposed between the upper and lower cladding layers; a ferromagnetic source and a ferromagnetic drain formed on the semiconductor substrate and spaced from each other in a length direction of the channel layer; and a gate electrode formed on the semiconductor substrate between the source and the drain and having applied a gate voltage thereto to control a spin precession of an electron passing through the channel layer, wherein the semiconductor substrate includes a first carrier supply layer of a first conductivity type disposed below the lower cladding layer and supplying carriers to the channel layer, and a second carrier supply layer of a second conductivity type opposite to the first conductivity type formed on the upper cladding layer and supplying the carriers to the channel layer.
    • 一种自旋晶体管,包括:包括上包层和下包层的半导体衬底,以及介于上包层和下包层之间的沟道层; 形成在所述半导体基板上并且在所述沟道层的长度方向上彼此间隔开的铁磁源和铁磁性漏极; 以及形成在所述源极和漏极之间的所述半导体衬底上并且施加了栅极电压以用于控制通过所述沟道层的电子的自旋进动的栅电极,其中所述半导体衬底包括具有第一导电性的第一载流子供应层 类型,其设置在所述下包层下方并且将沟道层供给到所述沟道层;以及第二导电类型的第二载流子供应层,其形成在所述上包层上并且将所述载流子提供给所述沟道层。
    • 9. 发明授权
    • Chemical mechanical polishing apparatus
    • 化学机械抛光装置
    • US06818095B1
    • 2004-11-16
    • US10720415
    • 2003-11-24
    • Hyung Jun Kim
    • Hyung Jun Kim
    • B24B100
    • B24B37/14
    • Disclosed is a chemical mechanical polishing apparatus. A plurality of support poles, the heights and locations of which can be controlled and moved, are installed on a circular rotary table. A platen for polishing the surface of a wafer are divided in given shapes and are then attached to the plurality of the support poles, respectively. A chemical mechanical polishing process is performed in a state the platens are assembled to have a desired shape by moving the support poles or the pressure applied to the wafer is controlled every region by controlling the height of the support poles. Therefore, the present invention has an effect that it can obtain a uniform polishing characteristic by controlling the degree of polishing depending on regions of the wafer.
    • 公开了一种化学机械抛光装置。 可以控制和移动高度和位置的多个支撑杆安装在圆形旋转台上。 用于抛光晶片表面的压板被分成给定的形状,然后分别附接到多个支撑极。 在通过移动支撑杆而将压板组装成具有期望形状的状态下执行化学机械抛光工艺,或者通过控制支撑杆的高度来控制施加到晶片的压力。 因此,本发明的效果是通过根据晶片的区域控制抛光程度来获得均匀的抛光特性。
    • 10. 发明授权
    • Metal lines of semiconductor devices and methods for forming
    • 半导体器件的金属线及其形成方法
    • US06541368B2
    • 2003-04-01
    • US10186902
    • 2002-06-28
    • Hyung Jun Kim
    • Hyung Jun Kim
    • H01L214763
    • H01L21/76801H01L21/76829
    • Metal lines of a semiconductor device and methods of forming same are disclosed. During a damascene process filling up a metal line in an insulating film, a low-k layer is used as an insulating film. An anchor groove is formed in one portion of the low-k layer. The anchor groove is filled up with an anchor layer. A metal line is formed, which contacts one or more underlying layers through the anchor layer and the interlayer isolation film. As a result, it is possible to prevent a distortion of a metal line and/or damage to a hard-mask layer, thereby improving device productivity and yield.
    • 公开了半导体器件的金属线及其形成方法。 在绝缘膜中填充金属线的镶嵌工艺期间,使用低k层作为绝缘膜。 在低k层的一部分中形成锚定槽。 锚定槽填充有锚定层。 形成金属线,其通过锚定层和层间隔离膜接触一个或多个下层。 结果,可以防止金属线的变形和/或硬掩模层的损坏,从而提高器件的生产率和产量。