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    • 6. 发明授权
    • Methods of forming charge-trap type non-volatile memory devices
    • 形成电荷陷阱型非易失性存储器件的方法
    • US07888219B2
    • 2011-02-15
    • US12766272
    • 2010-04-23
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L21/336
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。
    • 10. 发明申请
    • Nonvolatile Memory Devices Including a Resistor Region
    • 包括电阻器区域的非易失性存储器件
    • US20080246073A1
    • 2008-10-09
    • US12138712
    • 2008-06-13
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/00
    • H01L27/105B82Y10/00H01L21/823462H01L27/0629H01L27/11526H01L27/11546H01L27/11568
    • Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. The second conductive layer is etched to form a cell gate electrode in the cell array region and to concurrently remove the second conductive layer from the resistor region and the first conductive layer is etched in the resistor region to form a resistor.
    • 形成存储器件的方法包括在包括单元阵列区域和电阻器区域的半导体衬底中形成器件隔离层,器件隔离层延伸到电阻器区域中并在半导体衬底中限定有源区域。 在电阻器区域中的器件隔离层上形成第一导电层。 半导体衬底暴露在电池阵列区域中。 电池绝缘层形成在包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的半导体衬底的一部分上。 在半导体衬底的包括电阻器区域中的暴露的电池阵列区域,有源区域和器件隔离层的部分中的单元绝缘层上形成第二导电层。 蚀刻第二导电层以在电池阵列区域中形成电池栅电极,并且同时从电阻器区域去除第二导电层,并且在电阻器区域中蚀刻第一导电层以形成电阻器。