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    • 7. 发明授权
    • Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby
    • 使用乙烯亚胺偶联剂对聚酰亚胺膜进行表面改性的方法,由此形成柔性覆铜层压板及其制品的制造方法
    • US08419918B2
    • 2013-04-16
    • US11920492
    • 2006-05-18
    • Young-Taik HongHyung Dae KangSeog Je KimJae Heung Lee
    • Young-Taik HongHyung Dae KangSeog Je KimJae Heung Lee
    • C25D5/56C25D5/34C23C28/02
    • H05K3/389C08J7/12C08J7/18C08J2379/08C08L79/08H05K1/0346H05K3/381H05K3/388H05K2201/0154H05K2203/095Y10T428/12569
    • A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams. Also, the FCCL having a two-layer structure, formed by conducting copper sputtering and electroplating on the surface modified polyimide film, has good adhesive strength between the polyimide film and the copper foil and can maintain such adhesive strength even at high temperatures for a long period of time. Further, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCP (Tape Carrier Package), COF (Chip On Film), etc.
    • 对聚酰亚胺膜进行表面改性的方法,使用该方法的柔性覆铜层压板的制造方法以及由此制造的具有两层结构的柔性覆铜层压板(FCCL)。 聚酰亚胺薄膜的表面改性方法是通过第一等离子体处理改性聚酰亚胺薄膜的表面,将聚酰亚胺薄膜浸入含有通过将式1化合物与化合物混合而制备的乙烯亚胺基硅烷偶联剂的溶液 的摩尔比为0.25〜1,然后通过第二等离子体处理改性聚酰亚胺膜的表面。 对聚酰亚胺膜进行表面改性的方法是有利的,因为它可以代替使用离子束的常规表面处理方法。 此外,具有通过在表面改性聚酰亚胺膜上进行铜溅射和电镀形成的双层结构的FCCL具有在聚酰亚胺膜和铜箔之间的良好的粘合强度,并且即使在高温下也能够保持这种粘合强度长时间 一段的时间。 此外,它可以有用地应用于诸如柔性印刷电路板,TCP(胶带载体封装),COF(片上胶片)等电子部件。