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    • 2. 发明授权
    • Dicing method for micro electro mechnical system chip
    • 微机电系统芯片的切割方法
    • US06833288B2
    • 2004-12-21
    • US10412465
    • 2003-04-11
    • Joon Seok KangSung Cheon JungSang Kee YoonHyun Kee Lee
    • Joon Seok KangSung Cheon JungSang Kee YoonHyun Kee Lee
    • H01L2144
    • B81C1/00888B81C1/00896B81C2201/053
    • A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).
    • 一种用于微机电系统芯片的切割方法,其中可以通过使用保护掩模在切割过程中防止对微结构的损害而实现高产量和高生产率的芯片。 一种微机电系统芯片的切割方法,其特征在于,包括如下步骤:在作为保护罩的透明胶带的非粘合表面上以芯片尺度设计网格线和晶片图案(第一步骤)。 在透明胶带的粘合剂表面上粘附微结构保护膜(第二步); 将透明带放置在晶片的整个表面上,其中设计在透明带的非粘合表面上的栅格线与晶片的切割线相匹配(第三步)。 将透明胶带切割成比晶片大的尺寸,将晶片安装在引导环上并切割晶片(第四步骤); 并将透明胶带分离成切片(第五步)。