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1. 发明申请

US20060102383A1 Method of fabricating high density printed circuit board 审中-公开
标题翻译：制造高密度印刷电路板的方法
公开(公告)号：US20060102383A1
公开(公告)日：2006-05-18
申请号：US11055190
申请日：2005-02-10
申请人： Hye Cha , Byung Sun , Tae Kim , Jee Mok
发明人： Hye Cha , Byung Sun , Tae Kim , Jee Mok
IPC分类号： H05K3/12 , H05K1/11
CPC分类号： H05K3/4644 , H05K3/423 , H05K3/4602 , H05K3/4647 , H05K2201/0355 , H05K2201/096 , H05K2203/0733 , H05K2203/1536 , Y10T29/49155
摘要： Disclosed is a method of fabricating a high density PCB. Electric properties of a high frequency package product are reduced due to an increased length of a circuit even though the increased length of the circuit is necessary to maintain physical strength in the course of fabricating the PCB. Accordingly, a core insulating layer is removed, thereby providing a method of fabricating a slim PCB having a short wiring length.
摘要翻译：公开了一种制造高密度PCB的方法。即使在制造PCB的过程中需要增加电路长度来维持物理强度，由于电路长度的增加，高频封装产品的电性能也会降低。因此，去除了芯绝缘层，从而提供了一种制造具有短布线长度的薄型PCB的方法。

2. 发明申请

US20060046485A1 Method of manufacturing package substrate with fine circuit pattern using anodic oxidation 失效
标题翻译：使用阳极氧化制造具有精细电路图案的封装衬底的方法
公开(公告)号：US20060046485A1
公开(公告)日：2006-03-02
申请号：US11011401
申请日：2004-12-13
申请人： Duck Maeng , Byung Sun , Tae Kim , Jee Mok , Jong Bae , Yoong Oh , Chang-Kyu Song , Suk-Hyeon Cho
发明人： Duck Maeng , Byung Sun , Tae Kim , Jee Mok , Jong Bae , Yoong Oh , Chang-Kyu Song , Suk-Hyeon Cho
IPC分类号： H01L21/302
CPC分类号： H01L21/486 , H01L23/142 , H01L2924/0002 , H05K3/205 , H05K3/207 , H05K3/4614 , H05K3/4617 , H05K3/4647 , H05K2203/0152 , H05K2203/0315 , H01L2924/00
摘要： Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.
摘要翻译：本文公开了使用阳极氧化制造具有精细电路图案的封装衬底的方法。通过对通过掩模工艺开放的金属芯进行阳极氧化，在金属芯的开放区域中形成氧化层，以使电路图案的部分彼此绝缘。此外，通过使用屏幕将设置在氧化层之间的电镀部分用铜或在氧化层之间填充导电浆料，实现了具有精细电路图案的封装衬底。

3. 发明申请

US20060144618A1 Fill plated structure of inner via hole and manufacturing method thereof 审中-公开
标题翻译：内通孔的镀层结构及其制造方法
公开(公告)号：US20060144618A1
公开(公告)日：2006-07-06
申请号：US11137357
申请日：2005-05-24
申请人： Chang Song , Tae Kim , Kyung Kim , Woo Lee , Jee Mok
发明人： Chang Song , Tae Kim , Kyung Kim , Woo Lee , Jee Mok
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K3/423 , H01L2924/0002 , H05K3/427 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A fill plated structure of an inner via hole, which includes an electroless plated layer formed on a copper clad laminate having an inner via hole formed therethrough, a first copper electroplated layer formed on the electroless plated layer on the copper clad laminate and formed on an inner wall of the via hole to form an belly portion having a belly shape, and a second copper electroplated layer formed on the first copper electroplated layer of a surface of the copper clad laminate and formed on upper and lower portions of the first copper electroplated layer of the inner wall of the via hole to fill the via hole; and a method of manufacturing the same.
摘要翻译：内部通孔的填充电镀结构，其包括形成在其上形成有内通孔的覆铜层压板上的化学镀层，形成在覆铜层压板上的化学镀层上的第一铜电镀层，通孔的内壁形成具有腹部形状的腹部部分，以及形成在覆铜层压板的表面的第一铜电镀层上并形成在第一铜电镀层的上部和下部上的第二铜电镀层通孔的内壁填充通孔; 及其制造方法。

4. 发明申请

US20070138133A1 Flexible fuel cell 失效
标题翻译：灵活的燃料电池
公开(公告)号：US20070138133A1
公开(公告)日：2007-06-21
申请号：US11641716
申请日：2006-12-20
申请人： Hye Cha , Tae Kim , Chang Ryu , Sam Her , Sung Kim
发明人： Hye Cha , Tae Kim , Chang Ryu , Sam Her , Sung Kim
IPC分类号： B31D3/00 , H01M4/88 , C23F1/00
CPC分类号： H01M8/1011 , H01M4/8657 , H01M4/8803 , H01M4/92 , H01M8/0239 , H01M8/0245 , H01M8/1004 , H01M8/1097 , H01M2250/30 , Y02B90/18 , Y02E60/523 , Y02P70/56
摘要： Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.
摘要翻译：通过选自激光钻孔，蚀刻和光刻的方法，在热塑性聚合物膜中形成用于燃料电池的流路的通孔，热塑性聚合物膜的内侧表面涂覆有金属层，并且通孔填充有燃料扩散材料和催化剂以提供阳极。重复该过程以提供阴极。然后，阳极和阴极彼此相对放置。在阳极和阴极之间设置阳离子导电聚合物膜，并且阳极，阳离子导电聚合物膜和阴极被热压。

5. 发明申请

US20060060558A1 Method of fabricating package substrate using electroless nickel plating 审中-公开
标题翻译：使用化学镀镍制造封装衬底的方法
公开(公告)号：US20060060558A1
公开(公告)日：2006-03-23
申请号：US11094618
申请日：2005-03-30
申请人： Duck Maeng , Byung Sun , Jong Bae , Tae Kim
发明人： Duck Maeng , Byung Sun , Jong Bae , Tae Kim
IPC分类号： C23F1/00 , H01B13/00
CPC分类号： H05K3/4661 , C23F1/02 , H05K3/108 , H05K3/4602 , H05K2201/0344 , H05K2201/09563
摘要： Disclosed is a method of fabricating a package substrate using electroless nickel plating. The method includes preparing a base substrate, on which an internal layer circuit pattern is formed through a predetermined masking process; forming an insulating layer on the base substrate to achieve interlayer electric insulation; forming a first via hole through the insulating layer to achieve interlayer electric connection; forming a seed layer on the insulating layer through which the first via hole is formed; and forming an external layer circuit pattern on the seed layer through the other predetermined masking process. The seed layer is partially or selectively flash etched so as to prevent via open and undercut formed at the external layer circuit pattern.
摘要翻译：公开了使用无电镀镍制造封装衬底的方法。该方法包括：准备基板，通过预定的掩模工艺在其上形成内层电路图形; 在基底基板上形成绝缘层以实现层间电绝缘; 通过绝缘层形成第一通孔以实现层间电连接; 在形成有第一通孔的绝缘层上形成籽晶层; 以及通过另一个预定的掩蔽过程在种子层上形成外部层电路图案。种子层被部分或选择性地快速蚀刻，以防止在外部层电路图案处形成的通孔打开和底切。

6. 发明申请

US20070121036A1 Portable display device 审中-公开
标题翻译：便携式显示设备
公开(公告)号：US20070121036A1
公开(公告)日：2007-05-31
申请号：US11545996
申请日：2006-10-10
申请人： Chan Moon , Tae Kim , Tae Kim , Jung Kim , Jai Jung
发明人： Chan Moon , Tae Kim , Tae Kim , Jung Kim , Jai Jung
IPC分类号： G02F1/1335 , G02F1/1333
CPC分类号： G02F1/133553 , G02F1/1336 , G02F2001/133311 , G02F2202/28
摘要： A portable display device includes a liquid crystal layer, a back light assembly comprising a light source for supplying light to the liquid crystal layer, a reflecting plate included in the back light assembly to supply light from the light source to the liquid crystal layer, and at least one adhesive member attached to at least three edges of a rear surface of the reflecting plate. The at least one adhesive member may also be attached to the reflecting plate and a bottom chassis of the back light assembly, a printed circuit board, or a display panel so as to form an air hole.
摘要翻译：便携式显示装置包括液晶层，背光组件，其包括用于向液晶层供应光的光源;反射板，包括在背光组件中以将来自光源的光提供给液晶层;以及至少一个粘合剂构件附接到反射板的后表面的至少三个边缘。所述至少一个粘合部件还可以附接到所述反射板和所述背光组件的底部底板，印刷电路板或显示面板，以便形成气孔。

7. 发明申请

US20060218751A1 Hinge 审中-公开
标题翻译：合页
公开(公告)号：US20060218751A1
公开(公告)日：2006-10-05
申请号：US11391997
申请日：2006-03-29
申请人： Tae Kim , Tae Kim
发明人： Tae Kim , Tae Kim
IPC分类号： E05D5/02
CPC分类号： E05D5/04 , E05D9/00 , Y10T16/558
摘要： Provided is a hinge. The hinge includes: a rotating plate which includes a plurality of pin fixing holes and at predetermined portions of both the ends of which a respective fixing groove is correspondingly formed; a fixing plate which includes an opening through which the rotating plate is fitted and at predetermined portions of the inner side of which a respective fixing groove is correspondingly formed and a plurality of pin fixing holes are perforated; and a hinge combiner unit which connects and disconnects the rotating plate with and from the fixing plate. Accordingly, since the fixing plate and the rotating plate are connected with or disconnected from the hinge combiner unit, the different materials can be applied to the fixing plate, the rotating plate, and the hinge combiner unit, to thus save the production cost.
摘要翻译：提供铰链。铰链包括：旋转板，其包括多个销固定孔，并且在其两端的预定部分处相应地形成有相应的固定槽; 固定板，其包括开口，旋转板通过该开口配合，并且其内侧的预定部分相应地形成相应的固定槽，并且多个销固定孔被穿孔; 以及铰链组合器单元，其将旋转板与固定板连接和断开。因此，由于固定板和旋转板与铰链组合器单元连接或断开，因此可以将不同的材料施加到固定板，旋转板和铰链组合器单元，从而节省生产成本。

8. 发明授权

US08111570B2 Devices and methods for a threshold voltage difference compensated sense amplifier 有权
标题翻译：阈值电压差补偿读出放大器的器件和方法
公开(公告)号：US08111570B2
公开(公告)日：2012-02-07
申请号：US12906806
申请日：2010-10-18
申请人： Tae Kim , Howard C. Kirsch
发明人： Tae Kim , Howard C. Kirsch
IPC分类号： G11C7/00
CPC分类号： G11C7/08 , G11C7/062
摘要： Embodiments are described for a voltage compensated sense amplifier. One such sense amplifier includes a pair of digit line nodes respectively coupled to a pair of transistors. A first pair of switches are adapted to cross-couple the gates of the transistors to the respective digit line node and a second pair of switches are adapted to couple the gates of the transistors to a voltage supply. The first and second pair of switches are coupled to respective gates of the transistors independent of the pair of transistors being respectively coupled to the digit line nodes.
摘要翻译：针对电压补偿的读出放大器描述实施例。一个这样的感测放大器包括分别耦合到一对晶体管的一对数字线节点。第一对开关适于将晶体管的栅极交叉耦合到相应的数字线节点，并且第二对开关适于将晶体管的栅极耦合到电压源。第一和第二对开关耦合到晶体管的相应栅极，独立于一对晶体管分别耦合到数字线节点。

9. 发明申请

US20080203128A1 Backpack suspension system with hub 有权
标题翻译：带轮毂的背包悬挂系统
公开(公告)号：US20080203128A1
公开(公告)日：2008-08-28
申请号：US11987337
申请日：2007-11-29
申请人： Gregory Bass , Yusuke Miyashita , Tae Kim
发明人： Gregory Bass , Yusuke Miyashita , Tae Kim
IPC分类号： A45F3/10
CPC分类号： A45F3/047 , A45F3/08
摘要： A backpack suspension system is provided that provides a more natural feel as it is able to match a hiker's twisting and bending motions. A backpack suspension system comprises a frame having an upper and a lower portion, and a hub connecting the upper and lower portion. The upper and lower portion comprise a plurality of rods adapted to rotate within the hub. The hub is adapted to pivot about a horizontal axis. In certain embodiments the frame is substantially X shaped and in certain embodiments the hub is substantially X shaped.
摘要翻译：提供了一个背包悬挂系统，提供更自然的感觉，因为它能够匹配徒步旅行者的扭曲和弯曲运动。背包悬挂系统包括具有上部和下部的框架，以及连接上部和下部的轮毂。上部和下部包括适于在轮毂内旋转的多个杆。轮毂适于围绕水平轴线枢转。在某些实施例中，框架基本上为X形，并且在某些实施例中，毂基本上为X形。

10. 发明申请

US20080093609A1 Silicon Nitride Layer for Light Emitting Device, Light Emitting Device Using the Same, and Method of Forming Silicon Nitride Layer for Light Emitting Device 审中-公开
标题翻译：发光装置用氮化硅层，使用该发光元件的发光装置及形成发光装置用氮化硅层的方法
公开(公告)号：US20080093609A1
公开(公告)日：2008-04-24
申请号：US11577333
申请日：2005-11-04
申请人： Tae Kim , Nae Park , Kyung Kim , Gun Sung
发明人： Tae Kim , Nae Park , Kyung Kim , Gun Sung
IPC分类号： H01L33/00 , H01L21/36
CPC分类号： H01L33/34 , C23C16/30 , C23C16/345 , H01L33/08 , H01L33/18 , Y10S977/773
摘要： Provided are a silicon nitride layer for a light emitting device, light emitting device using the same, and method of forming the silicon nitride layer for the light emitting device. The silicon nitride layer of the light emitting device includes a silicon nitride matrix and silicon nanocrystals formed in the silicon nitride matrix. A light emitting device manufactured by the silicon nitride layer has a good luminous efficiency and emits light in the visible region including the short-wavelength blue/violet region and the near infrared region.
摘要翻译：提供了一种用于发光器件的氮化硅层，使用该氮化硅的发光器件以及用于形成发光器件的氮化硅层的方法。发光器件的氮化硅层包括在氮化硅衬底中形成的氮化硅衬底和硅纳米晶体。由氮化硅层制造的发光器件具有良好的发光效率，并且在包括短波长蓝色/紫色区域和近红外区域的可见区域中发光。

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